• Journal of Korean Vacuum Science & Technology
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• 제7권2호
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• pp.45-56
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• 2003

A high flux metal plasma pulse ion source, which can simultaneously perform ion implantation and deposition, was developed and tested to evaluate its performance using the prototype. Flux of ion source was measured to be 5 A and bi-polar pulse power supply with a peak voltage of 250 V, repetition of 20 Hz and width of 100 ${\mu}\textrm{s}$ has an output current of 2 kA and average power of 2 kW. Trigger power supply is a high voltage pulse generator producing a peak voltage of 12 kV, peak current of 50 A and repetition rate of 20 Hz. The acceleration column for providing target energy up to ion implantation is carefully designed and compatible with UHV (ultra high vacuum) application. Prototype systems including various ion sources are fabricated for the performance test in the vacuum and evaluated to be more competitive than the existing equipments through repeated deposition experiments.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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• pp.465-468
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• 1999

Electrical properties of metal-ferroelectric-semiconductor field effect transistor(MFSFET) using $BaMgF_4$ thin films grown on p-Si(100) substrates have been investigated. $BaMgF_4$ thin films have been directly deposited on the p-Si(100) wafers at a low temperature of $300^{\circ}C$ in an ultra high vacuum(UHV) system. First an in-situ post-deposition annealing was conducted for 20s at $650^{\circ}C$ and second an in-situ post-annealing was conducted for 10s at $950^{\circ}C$. The electrical properties of MFSFET compared with using A1 and Pt electrodes.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1998년도 춘계학술대회 논문집
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• pp.59-62
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• 1998

Thermal treatment dependences of MFS devices in $BaMgF_4$ on Si structures have been investigated. $BaMgF_4$ thin films have been directly deposited on the p-Si(100) wafers at a low temperature of $300^{\circ}$ in an ultra high vacuum(UHV) system. After in-situ post-deposition annealing was conducted for 20 s at $650^{\circ}$, bias and temperature were applied to $BaMgF_4/Si$ structures. Although X-ray diffraction analysis showed that the films were polycrystalline in nature before and after bias temperature, the C-V properties were some different between with and without bias-temperature treatment.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2015년도 제49회 하계 정기학술대회 초록집
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• pp.70.1-70.1
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• 2015

The facility for RAON superconducting heavy-ion accelerator at a beam power of up to 400 kW will be produced rare isotopes with two electron cyclotron resonance (ECR) ion sources. Highly charged ions generated by the ECR ion source will be injected to a superconducting LINAC to accelerate them up to 200 MeV/u. During the acceleration of the heavy ions, a good vacuum system is required to avoid beam loss due to interaction with residual gases. Therefore ultra-high vacuum (UHV) is required to (i) limit beam losses, (ii) keep the radiation induced within safe levels, and (iii) prevent contamination of superconducting cavities by residual gas. In this work, a RAON vacuum design for all the accelerator system will be presented along with Monte Carlo simulation of vacuum levels in order to validate the vacuum hardware configuration, which is needed to meet the baseline requirements.

• Applied Science and Convergence Technology
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• 제25권6호
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• pp.108-115
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• 2016

Even if ion pumps are widely and mostly used in ultra-high vacuum (UHV) conditions, virtually every existing ion pump has its maximum pumping speed around 1E-6 mbar (1E-4 Pa). Discharge intensity in the ion pump Penning cell is defined as the current divided by pressure (I/P). This quantity reflects the rate of cathode bombardment by ions, which underlies all of the various pumping mechanisms that occur in ion pumps (chemisorption on sputtered material, ion burial, etc.), and therefore is an indication of pumping speed. A study has been performed to evaluate the influence of magnetic fields and cell dimensions on the ion pump discharge intensity and consequently on the pumping speed at different pressures. As a result, a combination of parameters has been developed in order to design and build an ion pump with the pumping speed peak shifted towards lower pressures. Experimental results with several different test set-ups are presented and a prototype of a new 200 l/s ion pump with the maximum pumping speed in the 1E-8 mbar (1E-6 Pa) is described. A model of the system has also been developed to provide a framework for understanding the experimental observations.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.173.2-173.2
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• 2014

Thin nitride thin films were synthesized by reactive radio-frequency magnetron sputtering in the ultra high vacuum (UHV) chamber. To control the characteristics of thin films, tin nitride thin films were obtained various argon and nitrogen gas mixtures, especially low nitrogen gas ratios. Tin nitride thin films were analyzed with alpha step, scanning electron microscopy (SEM), X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), and 4 point probe measurement. The result of alpha step and SEM showed that the thickness of thin nitride thin films were decreased with increasing nitrogen gas ratios. The metallic tin structure was decreased and the amorphous tin nitride structure were observed by XRD with higher nitrogen gas ratios. The oxidation state of tin and nitride were studied with high resolution Sn 3d and N 1s XP spectra.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2004년도 추계학술발표대회 개요집
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• pp.243-245
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• 2004

가속기의 저장링 및 빔라인에는 방사광을 차단 혹은 일부 통과 둥의 목적으로 Photon Absorber와 같은 진공 부품이 사용되고 있으며, 이는 일반적으로 구리와 스테인리스 스틸 등의 이종재료를 브레이징 공정을 이용하여 제작함으로써 부품이 구조적 건성의 확보와 더불어 진공환경 및 수밀을 유지하고 있다. 그러나, Photon Absorber는 사용 용도에 따라 구조적 형상이 서로 다르기 때문에 브레이징 공정을 적용하는 경우, 상대적으로 제품 생산가격의 상승, 유지보수 및 제작불량에 따른 공정 제어의 어려움이 나타나고 있다. 본 연구에서는 스테인리스 스틸 (STS 304)과 구리(OFHC Copper)의 이종금속에 접합에 GTAW 용접 공정 기술을 적용하여 제반 용접공정에 따른 용접부 성능 및 진공 특성 등을 검토하였다. 용접봉 (ER CuSi-A)을 직접 사용하여 이종 재료의 시험편에 GTAW 용접을 적용한 결과, 진공 누설율은 $1{\times}10^{-10}\;Torr{\cdot}l/s$ 이하를 얻을 수 있었으며, 용접 접합부의 인장강도 210 MPa로써 구리 모재와 유사한 기계적 특성을 나타내었다.

• 한국진공학회지
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• 제6권3호
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• pp.235-241
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• 1997

실리콘 기판위에 초고진공 Ionized Cluster Beam(UHV-ICB)증착법으로 적층 성장시 킨 $Y_2O_3$ 박막의 결정성 및 구조를 Backscattering Spectroscopy(BS)/channeling을 이용하여 분석하였다. 현재까지 타증착법에 의해 성장된 $Y_2O_3$박막의 channeling 최소수율은 0.8~0.95 로 거의 비정질이거나 다결정이었다. 이에 반해 UHV-ICB법으로 Si(100), Si(111) 기판 위에 적층 성장시킨 $Y_2O_3$ 박막의 channeling 최소수율은 각각 0.28, 0.25로 UHV-ICB법으로 성장 시킨 $Y_2O_3$박막이 타증착법으로 성장시킨 박막보다 상대적으로 우수한 결정성을 지니고 있 었다. 또한 실리콘 기판의 방향에 관계없이 $Y_2O_3$박막의 표면 영역이 계면 영역보다 결정성 이 좋았다. Si(111) 위에 적층 성장한 Y2O3박막은 실리콘 결정과 $0.1^{\circ}$어긋나서 (111)면으로 성장하였고, Si(100) 위에 적층 성장한 $Y_2O_3$박막은 실리콘 결정과 평행하게 double domain 구조를 지닌 (110)면으로 성장하였다. 산소공명 BS/channeling 결과 Si(111) 위에 적층 성장 한 $Y_2O_3$박막의 산소는 결정성을 갖고 있으나 Si(100) 위에 적층 성장한 $Y_2O_3$박막의 산소는 random하게 분포하고 있음을 확인하였다.

• 한국자기학회지
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• 제20권6호
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• pp.212-215
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• 2010

비정질 Ga 박막은 벌크에 비해 높은 초전도 임계온도와 임계자기장 값을 보이나 그 특성은 불안정하여 상온에 한번 노출되면 그 초전도 특성을 잃어버리게 된다. 이 논문에서는 Ga/Al 두층 박막을 제작하여 이러한 비정질 Ga 박막의 불안정한 초전도 특성을 개선할 뿐만 아니라 기존의 스핀검출에 응용되고 있는 Al 박막을 대체할 수 있는 가능성을 연구하였다. 극초진공 분자빔박막 증착장비(UHV-MBE)를 사용하여 Ga/Al 두층 박막을 제작하고, 표면의 적절한 플라즈마 산화 처리에 의한 Ga/Al/$Al_2O_3$/Fe의 터널 접합구조를 제작하여 Ga/Al 박막의 초전도 특성을 측정하였다. 한편, Ga/Al 박막의 표면 특성은 Auger 전자 분광기를 이용하여 분석하였다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1995년도 추계학술대회 논문집 학회본부
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• pp.326-328
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• 1995

SiC buffer layers were grown on Si(100) substrates by ultra-high-vacuum electron cryclotron resonance plasma (UHV ECR plasma) from $CH_4/H_2$ mixture at 700$^{\circ}C$. The electron densities and temperature were measured by single probe. The axial plasma potentials measured by emissive probe had the double layer structure at positive substrate bias. Piranha cleaning was carried out as ex-situ wet cleaning. Clean and smooth silicon surface were prepared by in-situ hydrogen plasma cleaning at 540$^{\circ}C$. A short exposure to hydrogen plasma transforms the Si surface from 1$\times$1 to 2$\times$1 reconstruction. It was monitored by reflection high energy electron diffraction (RHEED). The defect densities were analysed by the dilute Schimmel etching. The results showed that the substrate bias is important factor in hydrogen plasma cleaning. The low base pressure ($5\times10^{-10}$ torr) restrains the $SiO_2$ growth on silicon surface. The grown layers showed different characteristics at various substrate bias. RHEED and K-ray Photoelectron spectroscopy study showed that grown layer was SiC.