• Title/Summary/Keyword: UV레이저

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Micro Heater Trimming using UV Laser (UV레이저를 이용한 마이크로 히터 트리밍)

  • Yoo, Seungryeol
    • Journal of the Semiconductor & Display Technology
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    • v.16 no.3
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    • pp.36-40
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    • 2017
  • In this paper, a new method of laser trimming of thick film heater is studied. Various laser waves (IR, Green, UV) are used to ablation the heater and the process parameters are also presented. For given initial printed resisters, the cutting length should be prepared to obtain the target resister value in advance. Therefore, the cutting model is very important. The well-known model was tested and proven that it is valid only within a certain range of cutting length. A new model is proposed for a wide range of resister laser trimming. The cutting lengths and resister variation was obtained and formulated. To verify the presented method, the cutting lengths of each resister are calculated for various target resister value and laser trimming using UV is conducted.

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A study on the design development of a domestic disinfector using UV LED (UV LED를 이용한 가정용 소독기의 디자인 개발에 관한 연구)

  • Zhu, Wang;Sheng, Ying;Kang, Seung-Min;Jee, Moon-Hwan
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.29 no.6
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    • pp.264-269
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    • 2019
  • The design for household sterilizer applying UV LED was studied. Based on UV LED sterilization distance and time data, the concept of home disinfectioner design was presented. Using technologies such as computer aided design software, 3D printing and laser cutting, etc., three different UV LED operating method models were produced. The final design was derived by conducting an analysis of the product's merits and demerits on the three plans from the result of each model.

Development of Auto Positioning Laser System by using Image Measurement Data (영상 측정 데이터를 이용한 위치보정 레이저 가공시스템 개발)

  • Pyo, Chang-Ryul
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.12 no.3
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    • pp.36-40
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    • 2013
  • Recently, electronic equipments become smaller, more functional, and more complex than before. As these trends, MLC(multi-layer ceramic) circuit has been emerged to a promising technology in semiconductor inspection industry. Especially, multi-layer ceramic which is consisted of many fine-pitch multi-hole is used to produce a semiconductor inspection unit. The hole is processed by UV laser. But, working conditions are changed all the time. Therefore real time measurement of fine-pitch multi-hole is very important method for ensuring performance. In this paper we found the best method for illuminating and auto focusing. And, we verified our equipment.

Micromachining technology using photosensitive glass (감광성유리를 이용한 마이크로머시닝 기술)

  • Cho, Soo-Je
    • Laser Solutions
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    • v.14 no.1
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    • pp.25-29
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    • 2011
  • Micromachining of photosensitive glass by UV exposure, heat treatment, and etching processes is reported. Like photoresist, the photosensitive glass is also classified into positive and negative types by development characteristics. For the positive type, the exposed area is crystallized and etched away during the etching process in HF solution, whereas the unexposed area is crystallized and etched away for the negative type. The crystallized area of the photosensitive glass has an etch rate approximately 30~100 times faster than that of the amorphous area so that it becomes possible to fabricate microstructures in the glass. Based on the unique properties of glass such as high optical transparency, electrical insulation, and chemical/thermal stability, the glass micromachining technique introduced in this work could be widely applied to various devices in the fields of electronics, bio engineering, nanoelectonics and so on.

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Four Spherical Mirror Stepper Optics for Deep UV Micro-Lithography (Deep UV 마이크로 리소그라피용 Stepper를 위한 4구면 반사경계)

  • 조영민;이상수;박성찬
    • Korean Journal of Optics and Photonics
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    • v.2 no.4
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    • pp.186-192
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    • 1991
  • For the micro-lithography using a excimer laser beam $(\lambda\leq0.248$\mu\textrm{m})$. a mirror system consisting of four spherical surfaces with reductlon magnification 5X is designed. Initially the aplanat, flat field and the distortion free condition of the system are analytically investigated within Seidel 3rd order aberrations. And the computer-aided optimization technique has been employed for the further improved performance of the system. The final system has N.A. of 0.15 and image field diameter 3.3 mm, and has the diffraction-limited performance for KrF eximer laser beam.

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Measuring Method of Planar Displacement Referring to The Double Linear Patterns (이중화된 패턴을 참조하는 평면 변위 측정 방법)

  • Park, Sung Jun;Jung, Kwang Suk
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.16 no.7
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    • pp.4405-4410
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    • 2015
  • Two-dimensional displacements are obtained from the sandwiched patterns, which superpose two linearly-periodic patterns orthogonally, respectively. The transparent top pattern is identified by deflection of the laser beam due to a difference of refractivity and the opaque bottom pattern is identified by deviation of the beam intensity due to a difference of reflectance. In the sample setup, the top pattern made up of build-up film is manufactured by UV laser machining and the bottom pattern is manufactured by ultra-precision trench machining and deposition for aluminum plate. The proposed decoding method is verified experimentally using the $10{\mu}m$ equally spaced sample patterns and the devised optical system. The Korea Academia-Industrial cooperation Society.

Direct UV laser projection ablation to engrave 6㎛-wide patterns in a buildup film (빌드업 필름의 선폭 6㎛급 패턴 가공을 위한 직접식 UV 레이저 프로젝션 애블레이션)

  • Sohn, Hyonkee;Park, Jong-Sig;Jeong, Jeong-Su;Shin, Dong-Sig;Choi, Jiyeon
    • Laser Solutions
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    • v.17 no.3
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    • pp.19-23
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    • 2014
  • To directly engrave circuit-line patterns as wide as $6{\mu}m$ in a buildup film to be used as an IC substrate, we applied a projection ablation technique in which an 8 inch dielectric ($ZrO_2/SiO_2$) mask, a DPSS 355nm laser instead of an excimer laser, a ${\pi}$-shaper and a galvo scanner are used. With the ${\pi}$-shaper and a square aperture, the Gaussian beam from the laser is shaped into a square flap-top beam. The galvo scanner before the $f-{\theta}$ lens moves the flat-top beam ($115{\mu}m{\times}105{\mu}m$) across the 8 inch dielectric mask whose patterned area is $120mm{\times}120mm$. Based on the results of the previous research by the authors, the projection ratio was set at 3:1. Experiments showed that the average width and depth of the engraved patterns are $5.41{\mu}m$ and $7.30{\mu}m$, respectively.

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Photopolymer Solidification Phenomena Considering Laser Exposure Conditions in Micro-stereolithography Technology (마이크로 광 조형에서 레이저 주사조건에 따른 광 경화성수지의 경화현상)

  • 이인환;조동우;이응숙
    • Journal of the Korean Society for Precision Engineering
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    • v.21 no.3
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    • pp.171-179
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    • 2004
  • Micro-stereolithography technology has made it possible to fabricate a freeform 3D microslructure. This technology is based on conventional stereolithography, in which a UV laser beam irradiates the open surface of a UV-curable liquid photopolymer, causing it to solidify. In micro-stereolithography, a laser beam of a few $\mu m$ diameter is used to solidify a very small area of the photopolymer. This is one of the key technological elements, and can be achieved by using a focusing lens. Thus, the solidification phenomena of the liquid photopolymer must be carefully investigated. In this study, the photopolymer solidification phenomena in response to variations in the scanning pitch of a focused laser beam was investigated experimentally. The effect of layer thickness on the solidification width and depth was also examined. These studies were conducted under the conditions of relatively lower laser power and relatively higher scanning speed. Moreover, the photopolymer solidification phenomena for the relatively higher laser power and lower scanning speed was investigated, too. In this case, comparing to the case of lower laser power and higher scanning speed, the photopolymer absorbed large amount of irradiation energy of the laser beam. These results were compared with those obtained from a photopolymer solidification model. From these results, a new laser-scanning scheme was proposed according to the shape of the 3D model. Samples by each method were fabricated successfully.

Nanoscale Patterning Using Femtosecond Laser and Self-assembled Monolayers (SAMs) (펨토초레이저와 자기조립박막을 이용한 나노스케일 패터닝)

  • Chang, Won-Seok;Choi, Moo-Jin;Kim, Jae-Gu;Cho, Sung-Hak;Whang, Kyung-Hyun
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.28 no.9
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    • pp.1270-1275
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    • 2004
  • Standard positive photoresist techniques were adapted to generate nano-scale patterns of gold substrate using self-assembled monolayers (SAMs) and femtosecond laser. SAMs formed by the adsorption of alkanethiols onto gold substrate are employed as very thin photoresists, Alkanethiolates formed by the adsorption of alkanethiols are oxidized on exposure to UV light in the presence of air to alkylsulfonates. Specifically, it is known that deep UV light of wavelength less than 200nm is necessary for oxidation to occur. In this study, ultrafast laser of wavelength 800nm and pulse width 200fs is applied for photolithography. Results show that ultrafast laser of visible range wavelength can replace deep UV laser source for photo patterning using thin organic films. Femtosecond laser coupled near-field scanning optical microscopy facilitates not only the patterning of surface chemical structure, but also the creation of three-dimensional nano-scale structures by combination with suitable etching methods.

Keyhole monitoring in laser scanner welding (스캐너 레이저 용접에서 키홀 현상 모니터링)

  • Ahn, Do-Chang;Kim, Cheol-Hee;Kim, Jae-Do
    • Proceedings of the KWS Conference
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    • 2009.11a
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    • pp.109-109
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    • 2009
  • 최근 유럽의 완성차 업체에서 조립라인에 적용을 시작하고 있는 레이저 원격 용접기술은 저항 점용접에서의 문제점들을 동시에 해결하고 작업 시간을 획기적으로 감소시켜 생산성을 향상시킬 수 있는 용접공정으로 떠오르고 있다. 레이저 원격 용접기술은 레이저 빔을 용접부의 원거리에서 조사하여 용접하는 기술로서 레이저의 초점거리와 갈바노미터의 고속 이송를 이용한 최첨단 용접공정이다. 높은 생산성을 유지 하기 위하여 정확한 용접 컨트롤이 필요하지만, 레이저 용접의 경우 용접시 안전 문제로 육안으로 관찰하기가 힘들다. 이러한 문제를 해결하기 위하여 모니터링이 필수적이다. 기존의 레이저 모니터링으로는 음향 센서를 이용하여 음향을 측정하는 방법이나 UV 센서, IR 센서 등의 빛을 이용한 방법이 많이 사용되어왔다. 하지만 이 방법들은 간접적인 방법들로 노이즈에 민감하고 또 설치가 까다로운 단점이 있었다. 본 연구에서는 CCD 카메라를 이용하여 시스템의 복잡함을 줄이고 더 정확하고 빠르게 용접 현상을 관찰하기 위하여 동축 모니터링 시스템을 이용하였으며, 이를 통해 Keyhole을 관찰하고 센서를 이용한 용접 변수(레이저 출력, 용접 속도 등)의 변화에 따른 용접 현상을 규명하였다.

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