• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.99-102
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• 2003

Reactions between 48Sn-52In solder and under bump metallurgies(UBM) such as 100nm $Ti/8{\mu}m$ Cu and 300nm Al/400nm Ni(V)/400nm Cu have been investigated, and the shear strength of 48Sn-52In solder bumps on each UBM has been evaluated. While intermetallic compounds with two different morphologies were continuously thickened on Ti/Cu with repeating the reflow process, the intermetallics on Al/Ni(V)/Cu spalled into the solder with increasing the number of reflow times. The solder bumps on Ti/Cu exhibited higher shear strength than those on Al/Ni(V)/Cu.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.118-121
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• 2003

The electrochemical behaviors of UBM nickel were investigated. Electrode potential has been changed with the surface composition. Zinc is dissolved into the solution immediately after immersion. Electrode potential has three distinct regions: Zinc dissolution region, transient region and nickel plating region. The effects additives on electrode potential and polarization curves were also investigated. The addition of suppressor lowered the current density which is related with deposition rate.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.128-132
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• 2003

무전해 Ni-P UBM과 3가지 경우의 무연 솔더간의 계면연구를 통해 Bi가 솔더의 합금원소로 들어감에 따라 계면반응에 어떠한 영향을 줄 수 있는 가를 연구했다. 3가지 다른 무연 솔더는 Bi가 각각 $0wt\%,\;4.8wt\%,\;58wt\%$들어간 Sn3.5Ag, Sn3.5Ag4.8Bi, Sn58Bi 이다. reflow를 수행한 후에 세 가지 솔더에서 나타나는 계면에서의 IMC는 $Ni_3Sn_4$로서 어떤 다른 솔더도 Bi를 함유한 IMC가 계면에선 관찰되지 않았다. 다만 SnAgBi 솔더의 경우 특이하게 솔더내에서 침상의 $Ni_3Sn_4$가 reflow후에 관찰되었다. 또한 반응속도의 척도가 되는 Ni-P UBM소모속도를 비교해 보면 reflow후의 SnAg와 SnAgBi의 경우에는 비슷하나 SnBi의 경우에는 알서 두 솔더에 비해 눈에 띠게 느림을 관찰하였다. 이러한 Ni-P UBM의 소모경향을 Bi의 함량, 그에 따른 Sn의 상대적인 함량의 관점에서 고찰하고자 한다.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.19-23
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• 2015

In this study, two types of Au/TiW bump samples were fabricated by the electroplating process onto Al/Si and SiN/Si wafers for the COG (Chip On Glass) packaging. TiW was used as the UBM (Under Bump Metallurgy) material of the Au bump and it was deposited by a sputtering method under the sputtering powers ranges from 500 to 5000 Watt. We investigated the delamination phenomenas for the prepared samples as a function of the input sputtering powers. The stable interfacial adhesion condition was found to be 1500 Watt in sputtering power. In addition, the SAICAS (Surface And Interfacial Cutting Analysis System) measurement was used to find the adhesion strength of Au bumps for the prepared samples. TiW UBM films were deposited at the 1500 Watt sputtering power. As a results, there was a similar adhesion strengths between TiW/Au interfacial films on Al/Si and SiN/Si wafers. However, the adhesion strength of TiW UBM sputtering films on Al and SiN under films were 2.2 times differences, indicating 0.475 kN/m for Al/Si wafer and 0.093 kN/m for SiN/Si wafer, respectively.

• Journal of the Korean Vacuum Society
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• v.13 no.4
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• pp.150-156
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• 2004

Boron nitride thin films were deposited on Si(100) substrate by RF (Radio-frequency) UBM (Unbalanced Magnetron) sputtering system. The effect of working pressure and substrate bias voltage on microstructure and compressive stress of boron nitride thin films has been investigated. In high working pressure, the alignment of hBN laminates increased with substrate bias voltage, in low working pressure, however, it was high in low substrate bias voltage. Compressive stress evolution and surface morphology of deposited BN films are closely related with the alignment of hBN laminates. The cBN phase without high compressive stress could be nucleated on hBN thin film by controlling the alignment of hBN laminates.

• The Journal of the Acoustical Society of Korea
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• v.33 no.3
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• pp.216-224
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• 2014

In this paper, we propose a new method to drastically reduce computational complexity in Gaussian Mixture Model (GMM)-based Speaker Identification (SI). Generally, GMM-based SI systems have very high computational complexity proportional to the length of the test utterance, the number of enrolled speakers, and the GMM size. These make the SI systems difficult to be used in various real applications in spite of their broad applicability. Thus, a trade-off between computational complexity and identification accuracy is considered as a primary issue for practical applications. In order to reduce computational complexity sharply with a little loss of accuracy, we introduce a method based on the Universal Background Model (UBM) clustering approach and then we show that it can be used successfully in real-time applications. In experiments with the proposed algorithm, we obtained a speed-up factor of 6 with a negligible loss of accuracy.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.1
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• pp.35-41
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• 2002

Flip-chip interconnection that uses solder bump is an essential technology to improve the performance of micro-electronics which require higher working speed, higher density, and smaller size. In this paper, the shear strength of Cr/Cr-Cu/Cu UBM structure of the high-melting solder bump and that of low-melting solder bump after aging is evaluated. Observe intermetallic compound and bump joint condition at the interface between solder and UBM by SEM and TEM. And analyze the shear load concentrated to bump applying finite element analysis. As a result of experiment, the maximum shear strength of Sn-97wt%Pb which was treated 900 hrs aging has been decreased as 25% and Sn-37wt%Pb sample has been decreased as 20%. By the aging process, the growth of $Cu_6/Sn_5$ and $Cu_3Sn$ is ascertained. And the tendency of crack path movement that is interior of a solder to intermetallic compound interface is found.

• Journal of IKEEE
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• v.24 no.4
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• pp.1022-1027
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• 2020

In this paper, SVM-based speaker classification is experimented with GMM-supervector. To create a speaker cluster, conventional speaker change detection is performed with the KL distance using the SNR-based weighting function. SVM-based speaker classification consists of two steps. In the first step, SVM-based classification between UBM and speaker models is performed, speaker information is indexed in each cluster, and then grouped by speaker. In the second step, the SVM-based classification between UBM and speaker models is performed by inputting the speaker cluster group. Linear and RBF are applied as kernel functions for SVM-based classification. As a result, in the first step, the case of applying the linear kernel showed better performance than RBF with 148 speaker clusters, MDR 0, FAR 47.3, and ER 50.7. The second step experiment result also showed the best performance with 109 speaker clusters, MDR 1.3, FAR 28.4, and ER 32.1 when the linear kernel was applied.

• Journal of Life Science
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• v.27 no.10
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• pp.1137-1144
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• 2017

The microalgae Chlorella vulgaris has been considered an important alternative resource for biodiesel production. However, its industrial-scale production has been constrained by the low productivity of the biomass and lipid. To overcome this problem, we isolated and characterized a potentially economical oleaginous strain of C. vulgaris via the random mutagenesis technique using UV irradiation. Two types of mass production systems were compared for their yield of biomass and lipid content. Among the several putatively oleaginous strains that were isolated, the particular mutant strain designated as UBM1-10 in the laboratory showed an approximately 1.5-fold higher cell yield and lipid content than those from the wild type. Based on these results, UBM1-10 was selected and cultivated under outdoor conditions using two different types of reactors, a tubular-type photobioreactor (TBPR) and an open pond-type reactor (OPR). The results indicated that the mutant strain cultivated in the TBPR showed more than 5 times higher cell concentrations ($2.6g\;l^{-1}$) as compared to that from the strain cultured in the OPR ($0.5g\;l^{-1}$). After the mass cultivation, the cells of UBM1-10 and the parental strain were further investigated for crude lipid content and composition. The results indicate a 3-fold higher crude lipid content from UBM1-10 (0.3%, w/w) as compared to that from the parent strain (0.1% w/w). Therefore, this study demonstrated that the economic potential of C. vulgaris as a biodiesel production resource can be increased with the use of a photoreactor type as well as the strategic mutant isolation technique.

• Journal of KIISE:Computer Systems and Theory
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• v.28 no.1_2
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• pp.33-44
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• 2001

최근 버퍼 캐쉬의 성능을 향상시키기 위한 많은 블록 교체 기법들이 제안되었으며 이 중에서 작업 집합 (working set) 변화에 잘 적응하고 구현이 용이한 Least Recently Used (LRU) 블록 교체 기법이 널리 사용되고 있다. 그러나 LRU 블록 교체 기법은 블록들이 규칙적인 참조 패턴을 보이면서 순차 참조되거나 순환 참조될 때 이 규칙성을 적절히 이용하지 못해 성능이 저하되는 문제점을 가진다. 본 논문에서는 다중 응용 트레이스를 이용하여 LRU 블록 교체 기법의 문제점을 관찰하고, 이 문제점을 해결하는 통합된 형태의 효율적인 버퍼 관리 (Unified Buffer Management, 이하 UBM) 기법을 제안한다. UBM 기법은 순차 참조 및 순환 참조를 자동 검출하여 분리된 공간에 저장하고 이들 참조에 적합한 블록 교체 기법으로 이 공간을 관리한다. 또한 순차 참조와 순환 참조를 위한 공간과 나머지 참조를 위한 공간의 비율을 최적으로 할당하기 위해 온라인에서 수집된 정보를 이용하여 계산된 단위 공간 증가당 예상 버퍼 적중 증가율을 이용한다. 다중 응용 트레이스 기반 시뮬레이션 실험에서 UBM 기법의 버퍼 적중률은 LRU 블록 교체 기법에 비해 평균 12%, 최대 28%까지 향상된 결과를 보였다.