• Transactions of the Korean Society of Mechanical Engineers
• /
• v.17 no.8
• /
• pp.1910-1920
• /
• 1993

An experimental study to investigate the unconventional chip formation called triangulation of chip in cutting with a SPRT (self-propelled rotary tool) is performed using acoustic emission (AE) signal analysis. In doing that, a quantitative model of the AE RMS signal in triangulation with a SPRT is first developed. The predicted results from this model show good correlation between the AE RMS signal and the general characteristics of triangular chip formation. Then, effects of various process parameters such as cutting conditions (cutting speed, depth of cut, oblique angle and normal rake angle) and the work material properties on the chip formation in cutting with a SPRT are explored. Special attention is paid to the work material properties which are found to have significant effects on triangulation.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.17 no.5
• /
• pp.1041-1053
• /
• 1993

A theoretical model to predict the triangular chip formation in cutting with a self-propelled rotary tool is developed. The model is based on the model of transient chip formation in two dimensional orthogonal cutting. The predicted results are found to be in good agreement with the experimental observations and suggest that transient charcteristics of work material, which depend on both cutting conditions and material properties, have the significant influence on triangulation.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.14 no.5
• /
• pp.2113-2120
• /
• 2013

In this study, an efficient machine vision based inspection system is developed for the in-line measurement of phosphor resin dispensing shapes on LED chip package. Since the phosphor resin (target material) has semitransparent characteristics, illuminated light beam is reflected from the bottom of the chip as well as from the surface. Since such phenomenon can deteriorate inspection reliability, a white LED and a 635nm laser slit beams are experimentally tested to decide suitable illumination optics. Also, specular and diffuse reflection methods are tested to decide suitable optical triangulation. As a result, it can be known that the combination of a white slit beam source and specular reflection method show the best inspection results. The Catmull-Rom spline interpolation is applied to the obtained data to form smoother surface. From the results, it can be conclude that the developed system can be sucessfully applied to the in-line inspection of LED chip packaging process.

• Journal of the Korean Society for Precision Engineering
• /
• v.32 no.9
• /
• pp.799-805
• /
• 2015

The further development of information, communication and digital media technologies requires the use of advanced, miniaturized semiconductor chips that operate at a high frequency. Die bonding and wire bonding methods for semiconductor packaging have been replaced by direct attachment to the substrate after forming a bump on the chip. However, the height of the bump or ball is an important factor for defects during assembly. This paper proposes an algorithm to measure the height of the bumps or balls in semiconductor packaging with greater accuracy. The performance of the proposed algorithm is experimentally validated. Non-contact 3D measurements of a shiny round ball is quite difficult, and it is not easy to obtain accurate data. This paper thus proposes an optical method and technique to improve the measurement accuracy.