• Title/Summary/Keyword: Tri-Gate

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Remote O2 plasma functionalization for integration of uniform high-k dielectrics on large area synthesized few-layer MoSe2

  • Jeong, Jaehun;Choi, Yoon Ho;Park, Dambi;Cho, Leo;Lim, Dong-Hyeok;An, Youngseo;Yi, Sum-Gyun;Kim, Hyoungsub;Yoo, Kyung-Hwa;Cho, Mann?Ho
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.281.1-281.1
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    • 2016
  • Transition metal dichalcogenides (TMDCs) are promising layered structure materials for next-generation nano electronic devices. Many investigation on the FET device using TMDCs channel material have been performed with some integrated approach. To use TMDCs for channel material of top-gate thin film transistor(TFT), the study on high-k dielectrics on TMDCs is necessary. However, uniform growth of atomic-layer-deposited high-k dielectric film on TMDCs is difficult, owing to the lack of dangling bonds and functional groups on TMDC's basal plane. We demonstrate the effect of remote oxygen plasma pretreatment of large area synthesized few-layer MoSe2 on the growth behavior of Al2O3, which were formed by atomic layer deposition (ALD) using tri-methylaluminum (TMA) metal precursors with water oxidant. We investigated uniformity of Al2O3 by Atomic force microscopy (AFM) and Scanning electron microscopy (SEM). Raman features of MoSe2 with remote plasma pretreatment time were obtained to confirm physical plasma damage. In addition, X-ray photoelectron spectroscopy (XPS) was measured to investigate the reaction between MoSe2 and oxygen atom after the remote O2 plasma pretreatment. Finally, we have uniform Al2O3 thin film on the MoSe2 by remote O2 plasma pretreatment before ALD. This study can provide interfacial engineering process to decrease the leakage current and to improve mobility of top-gate TFT much higher.

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Design and Implementation of Robot-Based Alarm System of Emergency Situation Due to Falling of The Eldely (고령자 낙상에 의한 응급 상황의 4족 로봇 기반 알리미 시스템 설계 및 구현)

  • Park, ChulHo;Lim, DongHa;Kim, Nam Ho;Yu, YunSeop
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.17 no.4
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    • pp.781-788
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    • 2013
  • In this paper, we introduce a quadruped robot-based alarm system for monitoring the emergency situation due to falling in the elderly. Quadruped robot includes the FPGA Board(Field Programmable Gate Array) applying a red-color tracking algorithm. To detect a falling of the elderly, a sensor node is worn on chest and accelerations and angular velocities measured by the sensor node are transferred to quadruped robot, and then the emergency signal is transmitted to manager if a fall is detected. Manager controls the robot and then he judges the situation by monitoring the real-time images transmitted from the robot. If emergency situation is decided by the manager, he calls 119. When the fall detection system using only sensor nodes is used, sensitivity of 100% and specificity of 98.98% were measured. Using the combination of the fall detection system and portable camera (robot), the emergency situation was detected to 100 %.

Performance and Variation-Immunity Benefits of Segmented-Channel MOSFETs (SegFETs) Using HfO2 or SiO2 Trench Isolation

  • Nam, Hyohyun;Park, Seulki;Shin, Changhwan
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.14 no.4
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    • pp.427-435
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    • 2014
  • Segmented-channel MOSFETs (SegFETs) can achieve both good performance and variation robustness through the use of $HfO_2$ (a high-k material) to create the shallow trench isolation (STI) region and the very shallow trench isolation (VSTI) region in them. SegFETs with both an HTI region and a VSTI region (i.e., the STI region is filled with $HfO_2$, and the VSTI region is filled with $SiO_2$) can meet the device specifications for high-performance (HP) applications, whereas SegFETs with both an STI region and a VHTI region (i.e., the VSTI region is filled with $HfO_2$, and the STI region is filled with $SiO_2$) are best suited to low-standby power applications. AC analysis shows that the total capacitance of the gate ($C_{gg}$) is strongly affected by the materials in the STI and VSTI regions because of the fringing electric-field effect. This implies that the highest $C_{gg}$ value can be obtained in an HTI/VHTI SegFET. Lastly, the three-dimensional TCAD simulation results with three different random variation sources [e.g., line-edge roughness (LER), random dopant fluctuation (RDF), and work-function variation (WFV)] show that there is no significant dependence on the materials used in the STI or VSTI regions, because of the predominance of the WFV.