• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.555-556
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• 2006

The study examines hardness pattern of SH737-2Cu-.9C samples transient liquid phase sintered at different temperatures viz. $1120^{\circ}C$, $1180^{\circ}C$ and $1250^{\circ}C$, heat treated by various methods and then tempered at different temperatures. Sintered samples were characterized for density and densification parameter, and austenitized at $900^{\circ}C$, subsequently cooled by four different methods viz. annealing, normalizing, oil and brine quenching. Hardness pattern was found minimum for air cooled and maximum for brine quenched, and samples sintered at $1250^{\circ}C$ had relatively higher hardness. The O.Q and B.Q samples were then tempered at $200^{\circ}C$, $400^{\circ}C$, $600^{\circ}C$ and $700^{\circ}C$. Hardness pattern typically showed secondary hardness taking place, with maximum around $600^{\circ}C$.

• Journal of Powder Materials
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• v.17 no.6
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• pp.489-493
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• 2010

Nickel-based and iron-based alloys have been developed and commercialized for a wide range of high performance applications at severely corrosive and high temperature environment. This alloy foam has an outstanding performance which is predestinated for diesel particulate filters, heat exchangers, and catalyst support, noise absorbers, battery, fuel cell, and flame distributers in burners in chemical and automotive industry. Production of alloy foam starts from high-tech coating technology and heat treatment of transient liquid-phase sintering in the high temperature. These technology allow for preparation of a wide variety of foam compositions such as Ni, Cr, Al, Fe on various pore size of pure nickel foam or iron foam in order for tailoring material properties to a specific application.

• Journal of the Korean Ceramic Society
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• v.29 no.5
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• pp.410-418
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• 1992

Si3N4, AlN and Y2O3 powder mixtures of the Y0.1(Si, Al)12(N, O)16 composition were hot-pressed at 1900℃ for 0 to 60 min under 30 MPa in order to fabricate the partially-stabilized α-Sialon ceramics (X=0.1). Room and high temperature flexural strengths of the specimens were compared with those of Si3N4-5 wt%Y2O3, Si3N4-5 wt%Y2O3-2 wt%Al2O3, and β-Sialon (Z=0.5) ceramics. The flexural strength of the α-Sialon ceramics which was hot-pressed for 15 min showed the highest value of 820 MPa at 1400℃ that is relatively higher temperature. It is guessed that a little amount of glassy phase existed in grain boundary because Y2O3 and AlN components were incoperated in Si3N4 grains, or transient liquid phase sintering, and microstructure with the smaller grain size and the interlocked grains of α'-and β-Si3N4 was obtained by the hot-pressing at high temperature of 1900℃ for the short time (15 min).

• Journal of the Microelectronics and Packaging Society
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• v.29 no.1
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• pp.7-16
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• 2022

Recently, the automobile industry is rapidly changing due to technological development. Next-generation cars with high technology and new functions are on the market. It is essential to develop electronic devices to meet the condition of next-generation cars. In this study, the authors have reviewed recent trends of automotive electronics and packaging technology. Automotive electronics are used in harsh environments compared with other industries. Thus, it is important to improve the reliability of device junctions that directly affect electronics performance. Soldering, TLP (transient liquid phase bonding), and sintering are introduced for the bonding methods in car electronics.

• Journal of the Korean institute of surface engineering
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• v.50 no.6
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• pp.510-515
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• 2017

In this study, a transient liquid phase sintering (TLPS) process of Ag pastes mixed with a fusible metal alloy of Bi58Sn42 with the melting temperature of $138^{\circ}C$, was examined. After screen printing of the Ag pastes with and without Bi58Sn42 powders on polyimide (PI) substrates, the electrodes were heat-treated at different temperatures in the range between 150 and $300^{\circ}C$ for 60 min in air. Comparing the electrical conductivity of the Ag pastes with and without Bi58Sn42 alloy powder after the heat treatment, it was manifested that the low melting temperature alloy definitely played a major role in an increased conductivity when it is added into the Ag pastes by providing more electrical conduction paths between Ag particles. This can be explained by the fact that capillary force of the melts of Bi58Sn42 can contribute to the rearrangement of the Ag particles during the heat-treatment inducing better connectivity between the Ag particles.