• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.12
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• pp.1641-1646
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• 2011

The second-generation magnetic abrasive polishing is one of the nontraditional machining technologies newly developed. Because of the flexibility effect in magnetic abrasive polishing, the precise and mirror like surface can be obtained during this process. In this study, magnetic abrasive polishing process was applied in small grooved surface. As a result, it was seen that the flexible magnetic abrasive tool was effective to remove burrs on the edge of the groove. However, the efficiency of magnetic abrasive polishing at the slot was very low according to increasing depth and width of slot. So, correlation between geometric parameters, such as the depth and width, and surface roughness was evaluated and the minimum width for suitable polishing was found by experimental results.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.2
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• pp.310-317
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• 2013

In this paper, the contact pressure of the wafer and polishing pad for final polishing process for 300 mm-wafer were investigated through numerical analysis using FEM tool, ANSYS. The distribution of the contact pressure is one of main parameters which affects on the flatness and surface roughness of polished wafers. Two types of polishing head, a hard type head with ceramic disk and a soft type head with air bag were considered. The effects of the deformation and initial shape of table on the contact pressure were also examined. Both heads and tables were modeled as 3D finite element model from solid model, and the material properties of polishing pads and rubber plate for the air-bag head were obtained from tensile tests. The contact pressure deviation on wafer surface was smaller with air bag head than hard type head even when the table had form errors such as convex or concave. From this 3D analysis, it could be concluded that the air-bag head has better uniformity of the contact pressure on wafer. Also, the effects of inner diameter of air bag and radial clearance between wafer and retainer were investigated as view point of contact pressure concentration on the edge of wafer.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.2
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• pp.123-129
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• 2022

Quartz (SiO2) has high abrasion and heat resistances and excellent chemical and mechanical properties; therefore, it is used in various industries, such as machinery, chemistry, optics, and medicine. Quartz is a high-hardness and brittle material and is classified as the topmost difficult-to-cut material, which is because of the cracking or chipping at the edge during processing. Corner wear, such as cracks and chippings that occur during cutting, is a major cause for the deterioration in the machining quality. Therefore, many researchers are investigating various techniques to process quartz effectively. However, owing to the mechanical properties of quartz, most studies have been conducted on grinding, micromachining, and microdrilling. Few studies have been conducted on quartz processing. The purpose of this study was to analyze the machining characteristics according to the machining factors during the slot machining of quartz using a cubic boron nitride (CBN) tool and to select the optimal machining conditions using the Taguchi method. The machining experiment was performed considering three process variables: the spindle speed, feed rate, and depth of cut. The cutting force and surface roughness were analyzed according to the processing conditions.