• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1307_1308
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• 2009

고온초전도체 REBCO(RE=rare earth) 선재는 높은 전류전송밀도를 가지고 있기 때문에 고용량의 전류가 요구되는 응용분야에 사용되어 전력기기 등의 성능을 높일 수 있을 것으로 기대되고 있다. 이전까지 대부분의 REBCO 선재 연구들은 GdBCO, NdBCO, YBCO 등 비교적 Tc값이 높은 고온초전도체에 집중되어 왔다. 반면에 TmBCO는 대부분의 REBCO 보다 Tc값이 낮기 때문에 선재 연구 분야에서 거의 주목받지 않았다. 하지만 본 연구 결과에 따르면 TmBCO 선재는 비교적 낮은 Tc(88K) 값에도 불구하고 우수한 전류전송밀도(Jc=2.3MA/$cm^2$) 특성을 나타내기 때문에 고온초전도 선재로서 활용이 가능하다. 또한 NdBCO 선재에 비해 낮은 기판온도에서 제조가 가능함으로써 공정상의 이점을 가질 수 있음을 확인하였다.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.58 no.11
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• pp.2209-2213
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• 2009

$REBa_{2}Cu_{3}O_{7-d}$(REBCO) coated conductors(REBCO CCs) have been studied for electric power applications which require high current density wires. As long as the critical transition temperature(Tc) is concerned, REBCO CCs with large $RE^{3+}$ ions have been expected to have better current transport properties than those with smaller $RE^{3+}$ ions. For this reason, REBCO's with large $RE^{3+}$ ions which include GdBCO, NdBCO and SmBCO have been mainly considered as the superconducting layer of CCs. On the other hand, REBCO's with smaller $RE^{3+}$ions are expected to have advantages in the fabrication process of CCs because of the lower melting temperature. But it has not yet been made clear which REBCO is the most suitable for the superconducting layer of CCs. In this study, we investigated the current transport properties of REBCO CCs with small $RE^{3+}$ ion and advantages of using that in the CC fabrication process. Thin films of TmBCO, which has smaller $RE^{3+}$ion than most other $RE^{3+}$ ions, were fabricated on buffered metal substrate as the superconducting layer of CC by PLD process. TmBCO CC shows critical current density (Jc (77 K, sf) = $2.3\;MA/cm^2$) high enough to be utilized for application in electric power devices. Compared with previous experiments using the same PLD system, deposition temperature was approximately $20^{\circ}C$ lower than NdBCO thin films on buffered metal substrates.

• 한국초전도학회:학술대회논문집
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• v.16
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• pp.94-94
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• 2006