• Title/Summary/Keyword: TiCu

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Fatigue Characterization of NiTiCu Shape Memory Alloys (NiTiCu 형상기억합금의 피로특성)

  • Han, Ji-Won;Park, Sung Bum
    • Journal of the Korean Society of Safety
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    • v.29 no.4
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    • pp.28-33
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    • 2014
  • Recently, the actuator worked by the driving recovery-force of the thermo elastic martensitic transformation of shape memory alloys(SMA) has been studied. This paper presents a study on the fatigue life of shape memory alloy (SMA) actuators undergoing thermally induced martensitic phase transformation under various stress levels. shape memory recoverable stress and strain of Ti-44.5at.%Ni-8at.%Cu alloys were by means of constant temperature tensile tests. Differential scanning calorimetry (DSC) was employed in order to investigate the transformation characteristics of the alloy before the tests. the results were summarized as follows. The martensite inducing stress incerased with the increasing of the Cu-contents. The fatigue life decreased with the increasing of the test load and the Cu-content. The data acquired will be very useful during the design process of an SMA NiTiCu element as a functional part of an actuator.

The Surface Characteristics of Ti/TiN Film Coated Sintered Stainless Steels by EB-PVD Method (EB-PVD법에 의한 Ti/TiN film 코팅된 스테인리스강 소결체의 표면특성)

  • 최한철
    • Journal of Surface Science and Engineering
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    • v.34 no.3
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    • pp.195-205
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    • 2001
  • The surface characteristics of Ti/TiN films coated on sintered stainless steels (SSS) by electron beam physical vapour deposition (EB-PVD) were investigated. Stainless steel compacts containing 2, 4, and 10wt%Cu were prepared by the electroless Cu-plating method, which results in increased homogenization in the alloying powder. The specimens were coated with Ti and TiN with a 1.0$\mu\textrm{m}$ thickness respectively by EB-PVD. The microstructures were investigated using scanning electron microscopy (SEM). The corrosion behaviors were investigated using a potentiosat in 0.1 M $H_2$$SO_4$, and 0.1M HCl solutions and the corrosion surface was observed using SEM and XPS. The Ti coated specimens showed rough surface compared to Ti/TiN coated specimens. Ti and Ti/TiN coated SSS revealed a higher corrosion and pitting potential from anodic polarization curves than that of Ti and Ti/TiN uncoated SSS. In addition, Ti/TiN coated SSS containing 10wt% Cu exhibited good resistance to pitting corrosion due to the formation of a dense film on the surface and the decrease in interconnected porosity by electroless coated Cu.

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Preparation and Photoelectrochemical Behavior of Cu2O/TiO2 Inverse Opal Heterojunction Arrays

  • Kim, Hyun-Sik;Lee, Sang-Kwon;Kang, Soon-Hyung
    • Journal of the Korean Electrochemical Society
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    • v.15 no.3
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    • pp.149-153
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    • 2012
  • The $Cu_2O/TiO_2$ inverse opal heterojunction arrays were developed by electrochemical deposition of $Cu_2O$ nanoparticles on $TiO_2$ inverse opal arrays. The $Cu_2O$ nanoparticles completely filled the inner pores of $TiO_2$ inverse opal film (prepared by liquid phase deposition with an average thickness of 400 nm) and covered the entire area; exhibiting high crystalline properties of anatase and cubic phase from $TiO_2$ and $Cu_2O$, respectively. From asymmetric current-voltage profile, it was noticeable that a heterojunction was well formed for charge transport from $Cu_2O$ to $TiO_2$ film resulting from the enhanced charge separation yield. In addition, increased photocurrent of 0.19 $mA/cm^2$ (versus 0.08 $mA/cm^2$ under dark condition) was obtained at -0.35 V from the heterojunction structure in the 0.5M $Na_2SO_4$ solution.

A Study on Aging and Wear Behaviors of Al-5Mg-X(Si, Cu, Ti)/SiCp Composites Fabricated by Pressureless Infiltration Method (무가압 침투에 의하여 제조된 Al-5Mg-X(Si, Cu, Ti)/SiCp 복합재료의 시효 및 마멸특성에 관한 연구)

  • Woo, Kee-Do;Kim, Sug-Won;Na, Hong-Suk;Moon, Ho-Jung
    • Journal of Korea Foundry Society
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    • v.20 no.5
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    • pp.300-306
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    • 2000
  • The objective of this work was to investigate the effects of SiC particle size(50, 100 ${\mu}m$) and additional elements such as Si, Cu and Ti on aging behavior in Al-5Mg-X(Si,Cu,Ti)/SiCp composites fabricated by pressureless infiltration method using hardness and wear test, scanning electron microscopy(SEM) and differential scanning calorimetry(DSC). The peak aging time in Al-5Mg-X(Si, Cu, Ti)/SiCp(50, 100 ${\mu}m$) composites is shorter than Al-5Mg-0.3Si alloy.The peak aging time of 50 ${\mu}m$ SiC particle reinforced Al-5Mg-X(Si,Cu,Ti) composites is shorter than those of 100 ${\mu}m$ SiC particle reinforced of Al-5Mg-X(Si,Cu,Ti) composites. The Al-5Mg-0.3Si-0.1Cu-0.1Ti/SiCp(50 ${\mu}m$) composites aged at $180^{\circ}C$ has higher hardness and better wear resistance than any other aged composite.The aging effect is promoted by the addition of Si and Cu in Al-5Mg/SiCp composites, so the wear resistance of Al-5Mg/SiCp composites with Si and Cu elements is enhanced by the aging treatment.

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The Effects of the Annealing Condition on the MOCVD Copper Films (열처리 조건에 따른 MOCVD Cu 박막의 특성 변화)

  • Kim, Dong-Won
    • Korean Journal of Materials Research
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    • v.7 no.10
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    • pp.884-890
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    • 1997
  • Sputtering 방법을 통해 Si기판 위에 Ti와 TiN박막을 증착하고 저압 반응관내에서 Cu*hfac)(TMVS)를 precursor로 사용 MOCVD Cu박막을 증착하여 Cu/TiN/Ti/Si구조의 다층박막을 제조하였고 이에 대한 열처리 방식 및 분위기 변화 등을 통해 열처리 조건에 따른 Cu 박막의 특성 변화에 대해 조사하였다. 열처리 방식으로는 Cu박막을 형성한 후 공기 중에 노출이 없이 바로 열처리하여 Cu산화물 형성을 억제할 수 있는 in-situ열처리 방식이 유리하고, 열처리 분위기로는 Cu 박막의 표면이나 결정립계 내에 존재하는 Cu 산화물을 환원시켜 줄 수 있는 H$_{2}$(10%)/Ar분위기가 표면평탄화, 결정립 크기 증가 및 비저항 감소측면에서 우수한 특성의 Cu박막을 얻을 수 있음을 확인하였다.

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XPS를 이용한 Cu/Polyimide와 Cu/TiN 계에 대한 연구

  • 이연승
    • Proceedings of the Korean Vacuum Society Conference
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    • 2000.02a
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    • pp.169-169
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    • 2000
  • 최근 반도체 소자의 초고집적화 현상에 따라 기존의 Al-base 합금에 대한 한계에 달하면서 그에 대한 대체 물질로 Cu가 관심을 모으게 되었고 그럼으로써 Cu metallization을 위한 많은 연구가 진행되어 왔다. Cu는 Al-base 합금계보다 비저항이 낮고, 녹는점이 높으며, 또한 electromigration 특성이 뛰어난 것으로 알려져 있다. 공학적인 면에서 이미 이들 계에 대한 adhesion 및 전기적 특성에 대한 많은 연구가 있어왔지만, 이들 특성 변화에 대한 물리적 의미를 제공할 만한 기초 자료들이 부족한 상태이다. 본 연구에서는 부도체인 polyimide 박막과 diffusion barrier인 TiN 박막위에서의 Cu 박막성장에 따르는 interface chemical reaction의 변화를 XPS를 이용하여 관찰함으로서 이들 계에 있어서의 adhesion과의 관계를 조사하였다. 그리고 XPS를 이용한 modified surface accumulation method를 적용시켜 TiN diffusion barrier를 통한 Cu의 grain boundary diffusion 상수들을 측정하였다. Cu/TiN system의 경우에는 interface chemical reaction이 일어나지 않았지만 Cu/polymide system에 있어서는 boundary diffusivity는 특히 40$0^{\circ}C$에서 $650^{\circ}C$ 영역에서, Db=60$\times$10-11exp[-0.29/(kBT)]cm2/sec 이었다.

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Synthesis of TiB2 Dispersed Cu Matrix Composite Material by the Combination of the Mechanical Milling and Plasma Activated Sintering Process (기계적 밀링과 플라즈마 활성 소결법에 의한 TiB2 분산 Cu기 복합재료 제조)

  • Kim, Kyong-Ju;Lee, Gil-Geun;Park, Ik-Min
    • Journal of Powder Materials
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    • v.14 no.5
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    • pp.292-297
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    • 2007
  • The present study was focused on the synthesis of a $TiB_2$ dispersed copper matrix composite material by the combination of the mechanical milling and plasma activated sintering processes. The $Cu/TiB_2$ mixed powder was prepared by the combination of the mechanical milling and reduction processes using the copper oxide and titanium diboride powder as the raw material. The synthesized $Cu/TiB_2$ mixed powder was sintered by the plasma activated sintering process. The hardness and electric conductivity of the sintered bodies were measured using micro vickers hardness and four probe method, respectively. The relative density of $Cu/TiB_2$ composite material sintered at $800^{\circ}C$ showed about 98% of theoretical density. The $Cu-1vol%TiB_2$ composite material has a hardness of about 130Hv and an electric conductivity of about 85% IACS. The hardness and electric conductivity of $Cu-3vol%TiB_2$ composite material were about 140 Hv and about 45% IACS, respectively.

The Characteristics of Wear Resistance of Cu-TiB2 Composites Reinforced by TiB2 Powders (TiB2 분말로 강화된 Cu-TiB2 복합재료의 내마모특성)

  • Lee Tae-Woo;Choi Jong-Un;Kang Kae-Myung
    • Korean Journal of Materials Research
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    • v.15 no.12
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    • pp.824-828
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    • 2005
  • In this study the effect of the content of $TiB_2$ on wear properties was investigated. $Cu-TiB_2$ composites have been fabricated by hot extrusion. Sliding wear tests were peformed by a pin-on-disk type wear test machine under dry condition and loads varied with from 20N to 80N at sliding speed 3.5Hz. The test results showed that the wear losses and the friction coefficients decreased with increasing $Cu-TiB_2$ volume fraction and increasing the size of $Cu-TiB_2$ particle. Wear property of $10{\mu}m,\;5 vol\%\; TiB_2$ specimen was excellent all of the wear specimens. It is thought that the increase of plastic flow resistivity due to uniform distribution of $10{\mu}m,\;5 vol\%\; TiB_2$ wear specimen would improve wear property. The worn surface and wear debris were examined by optical microscope and scanning electron microscope.

The Effect of Addition of Ti and Co Elements on Microstructural control and Characteristics of Vacuum-casted Cu-25 wt%Cr Electrical Contact Material (Ti과 Co 첨가가 진공주조법으로 제조된 Cu-25 wt%Cr 난가공성 중고압용 전기접점 소재의 미세구조 제어 및 물성에 미치는 영향)

  • Hye Sung Kim
    • Journal of the Korean Society for Heat Treatment
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    • v.37 no.4
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    • pp.172-181
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    • 2024
  • In this study, the effect of addition of Ti and Co elements on microstructural evolution and characteristics of vacuum-casted Cu-25%Cr electrical contact material was investigated. The coarse and insoluble Cr phases with an average size of 300 ㎛ in commercial Cu-25%Cr alloy were reduced to tens of micrometers in vacuum casted Cu-25%Cr-X(X=Ti, Co) alloy, which can be interpreted as result controlling coarsening and the work-frame structure of the insoluble Cr phase by the formation of intermetallic compounds such as Cr2Ti or Cr0.5Co1.5Ti around the Cr phase As a result, the electrical properties such as weight loss and fusion resistance against the repeated arc generation of the electrical contact material as well as the mechanical properties were greatly improved.