• Title/Summary/Keyword: TiAlN thin film

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Fabrication and Structural Properties of Ge-Sb-Te Thin Film by MOCVD for PRAM Application (상변화 메모리 응용을 위한 MOCVD 방법을 통한 Ge-Sb-Te 계 박막의 증착 및 구조적인 특성분석)

  • Kim, Ran-Young;Kim, Ho-Gi;Yoon, Soon-Gil
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.21 no.5
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    • pp.411-414
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    • 2008
  • The germanium films were deposited by metal organic chemical vapor deposition using $Ge(allyl)_4$ precursors on TiAlN substrates. Deposition of germanium films was only possible with a presence of $Sb(iPr)_3$, which means that $Sb(iPr)_3$ takes a catalytic role by a thermal decomposition of $Sb(iPr)_3$ for Ge film deposition. Also, as Sb bubbler temperature increases, deposition rate of the Ge films increases at a substrate temperature of $370^{\circ}C$. The GeTe thin films were fabricated by MOCVD with $Te(tBu)_2$ on Ge thin film. The GeTe films were grown by the tellurium deposition at $230-250^{\circ}C$ on Ge films deposited on TiAlN electrode in the presence of Sb at $370^{\circ}C$. The GeTe film growth on Ge films depends on the both the tellurium deposition temperature and deposition time. Also, using $Sb(iPr)_3$ precursor, GeSbTe films with hexagonal structures were fabricated on GeTe thin films. GeSbTe films were deposited in trench structure with 200 nm*120 nm small size.

A Study on Microstructure and Tribological Behavior of Superhard Ti-Al-Si-N Nanocomposite Coatings (초고경도 Ti-Al-Si-N 나노복합체 코팅막의 미세구조 및 트라이볼로지 거동에 관한 연구)

  • Heo, Sung-Bo;Kim, Wang Ryeol
    • Journal of the Korean institute of surface engineering
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    • v.54 no.5
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    • pp.230-237
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    • 2021
  • In this study, the influence of silicon contents on the microstructure, mechanical and tribological properties of Ti-Al-Si-N coatings were systematically investigated for application of cutting tools. The composition of the Ti-Al-Si-N coatings were controlled by different combinations of TiAl2 and Ti4Si composite target powers using an arc ion plating technique in a reactive gas mixture of high purity Ar and N2 during depositions. Ti-Al-Si-N films were nanocomposite consisting of nanosized (Ti,Al,Si)N crystallites embedded in an amorphous Si3N4/SiO2 matrix. The instrumental analyses revealed that the synthesized Ti-Al-Si-N film with Si content of 5.63 at.% was a nanocomposites consisting of nano-sized crystallites (5-7 nm in dia.) and a three dimensional thin layer of amorphous Si3N4 phase. The hardness of the Ti-Al-Si-N coatings also exhibited the maximum hardness value of about 47 GPa at a silicon content of ~5.63 at.% due to the microstructural change to a nanocomposite as well as the solid-solution hardening. The coating has a low friction coefficient of 0.55 at room temperature against an Inconel alloy ball. These excellent mechanical and tribological properties of the Ti-Al-Si-N coatings could help to improve the performance of machining and cutting tool applications.

Permittivity Characteristics of SiO/TiN Thin Film (SiO/TiN 박막의 유전율 특성에 관한 연구)

  • 김병인;이우선;김창석
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1996.11a
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    • pp.18-21
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    • 1996
  • SiO 7f the SiO/TiN film is used as the insulating layer and TiN film is chosen as the barrier against the diffusion of Al which is the terminal connected by ohmic contact because TiN has the advantageous properties such as good thermal stability and very low diffusion rate in spite of it\`s relatively low specific resistance. In this study we investigated it\`s electrical and optical characteristics to determine refractive index, absorption coefficient and Permittivity. The films are differently fabricated in thickness method for this experiment.

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Permittivity Characteristics of SiO/TiN Thin Film according to Coating Thickness (SiO/TiN 박막의 증착두께에 따른 유전율 특성)

  • 김창석;이우선;정천옥;김병인
    • Electrical & Electronic Materials
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    • v.10 no.6
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    • pp.570-575
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    • 1997
  • In this days, the thinner film of dielectric materials is required while its capacitance is required to be still large at the VLSI process. Most of such VLSI have MOS structures. For the research on this requirement, MOS capacitors were fabricated on the silicon wafer in four different thickness groups by RF sputtering method. SiO of the SiO/TiN film is used as the insulating layer and TiN is chosen as the barrier against the diffusion of Al which is the terminal connected by ohmic contact because TiN has the advantageous properties such as good thermal stability and very low diffusion rate in spite of its relatively low specific resistance. In this study their electrical and optical characteristics are investigated to find refractive index, absorption coefficient and Permittivity.

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Variations in Tunnel Electroresistance for Ferroelectric Tunnel Junctions Using Atomic Layer Deposited Al doped HfO2 Thin Films (하부전극 산소 열처리를 통한 강유전체 터널접합 구조 메모리 소자의 전기저항 변화 특성 분석)

  • Bae, Soo Hyun;Yoon, So-Jung;Min, Dae-Hong;Yoon, Sung-Min
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.33 no.6
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    • pp.433-438
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    • 2020
  • To enhance the tunneling electroresistance (TER) ratio of a ferroelectric tunnel junction (FTJ) device using Al-doped HfO2 thin films, a thin insulating layer was prepared on a TiN bottom electrode, for which TiN was preliminarily treated at various temperatures in O2 ambient. The composition and thickness of the inserted insulating layer were optimized at 600℃ and 50 Torr, and the FTJ showed a high TER ratio of 430. During the heat treatments, a titanium oxide layer formed on the surface of TiN, that suppressed oxygen vacancy generation in the ferroelectric thin film. It was found that the fabricated FTJ device exhibits two distinct resistance states with higher tunneling currents by properly heat-treating the TiN bottom electrode of the HfO2-based FTJ devices in O2 ambient.

Effectiveness of medical coating materials in decreasing friction between orthodontic brackets and archwires

  • Arici, Nursel;Akdeniz, Berat S.;Oz, Abdullah A.;Gencer, Yucel;Tarakci, Mehmet;Arici, Selim
    • The korean journal of orthodontics
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    • v.51 no.4
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    • pp.270-281
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    • 2021
  • Objective: The aim of this in vitro study was to evaluate the changes in friction between orthodontic brackets and archwires coated with aluminum oxide (Al2O3), titanium nitride (TiN), or chromium nitride (CrN). In addition, the resistance of the coatings to intraoral conditions was evaluated. Methods: Stainless steel canine brackets, 0.016-inch round nickel-titanium archwires, and 0.019 × 0.025-inch stainless steel archwires were coated with Al2O3, TiN, and CrN using radio frequency magnetron sputtering. The coated materials were examined using scanning electron microscopy, an X-ray diffractometer, atomic force microscopy, and surface profilometry. In addition, the samples were subjected to thermal cycling and in vitro brushing tests, and the effects of the simulated intraoral conditions on the coating structure were evaluated. Results: Coating of the metal bracket as well as nickel-titanium archwire with Al2O3 reduced the coefficients of friction (CoFs) for the bracket-archwire combination (p < 0.01). When the bracket and stainless steel archwire were coated with Al2O3 and TiN, the CoFs were significantly lower (0.207 and 0.372, respectively) than that recorded when this bracket-archwire combination was left uncoated (0.552; p < 0.01). The friction, thermal, and brushing tests did not deteriorate the overall quality of the Al2O3 coatings; however, some small areas of peeling were evident for the TiN coatings, whereas comparatively larger areas of peeling were observed for the CrN coatings. Conclusions: Our findings suggest that the CoFs for metal bracket-archwire combinations used in orthodontic treatment can be decreased by coating with Al2O3 and TiN thin films.

A Review of Epitaxial Metal-Nitride Films by Polymer-Assisted Deposition

  • Luo, Hongmei;Wang, Haiyan;Zou, Guifu;Bauer, Eve;Mccleskey, Thomas M.;Burrell, Anthony K.;Jia, Quanxi
    • Transactions on Electrical and Electronic Materials
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    • v.11 no.2
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    • pp.54-60
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    • 2010
  • Polymer-assisted deposition is a chemical solution route to high quality thin films. In this process, the polymer controls the viscosity and binds metal ions, resulting in a homogeneous distribution of metal precursors in the solution and the formation of crack-free and uniform films after thermal treatment. We review our recent effort to epitaxially grow metal-nitride thin films, such as hexagonal GaN, cubic TiN, AlN, NbN, and VN, mixed-nitride $Ti_{1-x}Al_xN$, ternary nitrides tetragonal $SrTiN_2$, $BaZrN_2$, and $BaHfN_2$, hexagonal $FeMoN_2$, and nanocomposite TiN-$BaZrN_2$.

Influence of processing parameters for adhesion strength of TiAlN films prepared by Arc Ion Plating

  • Ju, Yun-Gon;Fang, W.;Jo, Dong-Yul;Yun, Jae-Hong;Zhang, S.H.
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2007.11a
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    • pp.136-137
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    • 2007
  • Wear resistant TiAlN thin film has been widely deposited on the surface of cutting and forming tools by using Arc Ion Plating. TiAlN films are deposited by the processes designed by the Taguchi L18 experimental design. The L18 experimental design is applied to achieve surface properties and adhesion. The deposition parameters are working pressure, substrate temperature, bias voltage, arc power and pre-sputtering bias voltage and time. The most influential parameters on surface properties and adhesion are substrate bias voltage, working nitrogen pressure and arc power. The optimal coating processes are obtained for surface properties and adhesion.

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Capacitance Properties of Nano-Structure Controlled Alumina on Polymer Substrate (폴리머 기판위에 형성된 나노구조제어 알루미나의 캐패시터 특성)

  • Jung, Seung-Won;Min, Hyung-Sub;Han, Jeong-Whan;Lee, Jeon-Kook
    • Korean Journal of Materials Research
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    • v.17 no.2
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    • pp.81-85
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    • 2007
  • Embedded capacitor technology can improve electrical perfomance and reduce assembly cost compared with traditional discrete capacitor technology. To improve the capacitance density of the $Al_2O_3$ based embedded capacitor on Cu cladded fiber reinforced plastics (FR-4), the specific surface area of the $Al_2O_3$ thin films was enlarged and their surface morphologies were controlled by anodization process parameters. From I-V characteristics, it was found that breakdown voltage and leakage current were 23 V and $1{\times}10^{-6}A/cm^2$ at 3.3 V, respectively. We have also measured C-V characteristics of $Pt/Al_2O_3/Al/Ti$ structure on CU/FR4. The capacitance density was $300nF/cm^2$ and the dielectric loss was 0.04. This nano-porous $Al_2O_3$ is a good material candidate for the embedded capacitor application for electronic products.

Effect of Interlayer on TiN and CrN Thin Films of STS 420 Hybrid-Deposited by AlP and DC Magnetron Sputtering (AIP 와 스퍼터링으로 복합증착된 420 스테인리스강의 TiN과 CrN 박막에 미치는 중간층의 영향)

  • Choi, Woong-Sub;Kim, Hyun-Seung;Park, Burm-Su;Lee, Kyung-Ku;Lee, Doh-Jae;Lee, Kwang-Min
    • Korean Journal of Materials Research
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    • v.17 no.5
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    • pp.256-262
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    • 2007
  • Effects of interlayer and the combination of different coating methods on the mechanical and corrosion behaviors of TiN and CrN coated on 420 stainless steel have been studied. STS 420 specimen were tempered at $300^{\circ}C$ for 1 hr in vacuum furnace. The TiN and CrN thin film with 2 ${\mu}m$ thickness were coated by arc ion plating and DC magnetron sputtering following the formation of interlayer for pure titanium and chromium with 0.2 ${\mu}m$ thickness. The microstructure and surface analysis of the specimen were conducted by using SEM, XRD and roughness tester. Mechanical properties such as hardness and adhesion also were examined. XRD patterns of TiN thin films showed that preferred TiN (111) orientation was observed. The peaks of CrN (111) and $Cr_2N$ (300) were only observed in CrN thin films deposited by arc ion plating. Both TiN and CrN deposited by arc ion plating had the higher adhesion and hardness compared to those formed by magnetron sputtering. The specimen of TiN and CrN on which interlayer deposited by magnetron sputtering and thin film deposited by arc ion plating had the highest adhesion with 22.2 N and 19.2 N. respectively. TiN and CrN samples shown the most noble corrosion potentials when the interlayers were deposited by using magnetron sputtering and the metal nitrides were deposited by using arc ion plating. The most noble corrosion potentials of TiN and CrN were found to be approximately -170 and -70 mV, respectively.