• Title/Summary/Keyword: TiAl intermetallic

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Plastic Behaviro of Two Phase Intermetallic Compounds Based on $Li_2$-type$(Ai, Cr)_3$/Ti ($Li_2$$(Ai, Cr)_3$/Ti기 2상 금속간화합물의 소성거동)

  • Park, Jeong-Yong;O, Myeong-Hun;Wi, Dang-Mun;Miura, S.;Mishima, Y.
    • Korean Journal of Materials Research
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    • v.4 no.8
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    • pp.906-914
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    • 1994
  • Plastic behavior of two-phase intermetallic compounds based on $LI_{2}$-type $(Al, Cr)_3$ Ti was investigated using compression test at R.T. and 77K. $LI_{2}$ single phase alloys and two-phase alloys consisting of mainly $LI_{2}$ phase and a few or 20% second phases were selected from AI-Ti-Cr phase diagram. In general, compared with Llz single phase, two-phase alloys consisting of 20% second phase showed relatively high yield strength and poor ductility. Among the alloys, however, AI-21Ti-23Cr alloy consisting of 20% $Cr_{2}Al$ phase showed available ductility as well as high yield strength. Plastic behavior of $LI_{2}$ single phase alloys and two-phase alloys consisting of a few% $Cr_{2}Al$ was also investigated. Homogenization of arc melted ingots substantially reduced the amount of second phases but introduced extensive pore. When Cr content increased in $Ll_{2}$ single phase alloys after the homogenization, the volume fraction of pore in the alloys decreased, and no residual pore was observed in two-phase alloys consisting of a few% $Cr_{2}Al$ phase. Environmental effect on the ductility of the alloys was investigated using compression test at different strain rates($1.2 \times 10^{-4}/s$ and $1.2 \times 10^{-2}/s$). Environmental embrittlement was least significant in A1-25Ti-10Cr alloy consisting of LIZ single phase among the alloys tested in this study. However, based on the combined estimation of the pore formation, environmental embrittlement and ingot cast structure, AI-21Ti-23Cr alloy consisting of 20% $Cr_{2}Al$ as the second phase is expected to show the best tensile elongation behavior.

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Brazing characteristics of $ZrO_2$ and Ti-6Al-4V brazed joints with increasing temperature (브레이징 온도 변화에 따른 $ZrO_2$와 Ti-6Al-4V의 접합 특성)

  • Kee, Se-Ho;Park, Sang-Yoon;Heo, Young-Ku;Jung, Jae-Pil;Kim, Won-Joong
    • The Journal of Korean Academy of Prosthodontics
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    • v.50 no.3
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    • pp.169-175
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    • 2012
  • Purpose: In this study, brazing characteristics of $ZrO_2$ and Ti-6Al-4V brazed joints with increasing temperature were investigated. Materials and methods: The sample size of the $ZrO_2$ was $3mm{\times}3mm{\times}3mm$ (thickness), and Ti-6Al-4V was $10mm(diameter){\times}5mm(thickness)$. The filler metal consisted of Ag-Cu-Sn-Ti was prepared in powder form. The brazing sample was heated in a vacuum furnace under $5{\times}10^{-6}$ torr atmosphere, while the brazing temperature was changed from 700 to $800^{\circ}C$ for 30 min. Results: The experimental results shows that brazed joint of $ZrO_2$ and Ti-6Al-4V occurred at $700-800^{\circ}C$. Brazed joint consisted of Ag-rich matrix and Cu-rich phase. A Cu-Ti intermetallic compounds and a Ti-Sn-Cu-Ag alloy were produced along the Ti-6Al-4V bonded interface. Thickness of the reacted layer along the Ti-6Al-4V bonded interface was increased with brazing temperature. Defect ratios of $ZrO_2$ and Ti-6Al-4V bonded interfaces decreased with brazing temperature. Conclusion: Thickness and defect ratio of brazed joints were decreased with increasing temperature. Zirconia was not wetting with filler metal, because the reaction between $ZrO_2$ and Ti did not occur enough.

Antifuse with Ti-rich barium titanate film and silicon oxide film (과잉 Ti 성분의 티탄산 바륨과 실리콘 산화막으로 구성된 안티퓨즈)

  • 이재성;이용현
    • Journal of the Korean Institute of Telematics and Electronics D
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    • v.35D no.7
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    • pp.72-78
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    • 1998
  • This paper is focused on the fabrication of reliable novel antifuse, which could operate at low voltage along with the improvement in OFF and ON-state properties. The fabricated antifuse consists of Al/BaTi$_{2}$O$_{3}$/SiO$_{2}$/TiW-silicide structure. Through the systematic analyses for bottom metal and the intermetallic insulator, material and electri cproperties were investiaged. TiW-silicide as the bottom electrode had smooth surface with average roughness of 11.angs. at 10X10.mu.m$^{2}$ and was bing kept as-deposited SiO$_{2}$ film stable. Amorphous BaTi$_{2}$O$_{3}$ film as the another insulator was chosen because of its low breakdown strength (2.5MV/cm). breakdown voltage of antifuse is remarkably reduced by using BaTi$_{2}$O$_{3}$ film, and leakage current of that maintained low level due to the SiO$_{2}$ film. Low ON-resistance (46.ohm./.mu.m$^{2}$) and low programming voltage(9.1V) can be obtained in theses antifuses with 220.angs. double insulator layer and 19.6X10$^{-6}$ cm$^{2}$ area, while keeping sufficient OFF-state reliability (less than 1nA).

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Effects of 3rd Element Additions on the Oxidation Resistance of TiAi Intermetallics (합금원소 첨가가 TiAI계의 내산화성에 미치는 영향)

  • Kim, Bong-Gu;Hwang, Seong-Sik;Yang, Myeong-Seung;Kim, Gil-Mu;Kim, Jong-Jip
    • Korean Journal of Materials Research
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    • v.4 no.6
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    • pp.669-680
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    • 1994
  • Oxidation behaviour of TiAl intermetallic compounds with the addition of Cr, V, Si, Mo, or Nb was investigated at 900~$1100^{\circ}C$ under the atmospheric environment. The reaction products were examined by XRD, SEM equipped with WDX. The weight gain by continuous oxidation increased with the addition of Cr or V, but there was less weight gain when Mo, Si or Nb was added individually. he oxidation rate of Cr- or V-added TiAl was always larger than that of TiAI. However, oxidation rate of Si-, Mo- or Nb-added TiAl was almost same or smaller than that of TiAI. Thus, it is concluded that the addition of Cr or V did not improve the oxidation resistance, whereas the addition of Si, Mo or Nb improved the oxidation resistance. Oxides formed on TiAl with Mo, Si, and Nb were found to be more protective, resulting from the decrease in diffusion rate of the alloying elements and oxygen. Nb strengthened the tendency to form $AI_{2}O_{3}$ in the early stage of oxidation, due to the continuous $AI_{2}O_{3}$ layer formation and dense $Tio_{2}+AI_{2}O_{3}$ layer. According to the Pt-marker test of TiAI- 5wt%Nb, oxygen diffused mainly inward while oxides were formed on the substrate surface. Upon thermal cyclic oxidation at $900^{\circ}C$, it is shown that the addition of Cr or Nb improved the adherence of oxide scale to the substrate.

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Electrochemical properties of $TiO_2$/CNTs composite as anode materials for lithium secondary battery system (리튬이차전지용 음극물질 $TiO_2$/CNTs의 전기화학적 특성)

  • Oh, Mi-Hyun;Park, Soo-Gil
    • Proceedings of the KIEE Conference
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    • 2007.07a
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    • pp.1363-1364
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    • 2007
  • The composites such as Sn-CNTs, $SnSb_{0.5}$-CNTs and $CoSb_3$-CNTs have attracted much attention in the past years owing to their good overall properties. In these samples, intermetallic compounds show high specific capacities. Recently, interest in metal oxides such as $Al_{2}O_{3}$, MgO and $TiO_2$ has been largely stimulated by the realization that they can improve the cycling stability of the Li-ion battery electrodes. The reversible capacity of the $TiO_2$/CNTs composite reaches 168 mAh $g^{-1}$ at the first cycle and remains almost constant during long-term cycling. In this study, a nanocomposite of $TiO_2$/CNTs was prepared by sol-gel method and its electrochemical properties as anode materials for Li-ion batteries were studied by galvanostatic cycling, cyclic voltammograms (CV) and electrochemical impedance spectroscopy (EIS).

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Recent Trends of Friction Stir Welding of Titanium (타이타늄 소재 마찰교반용접 기술 동향)

  • Chun, Chang-Keun;Kim, Sung-Wook;Kim, Heung-Joo;Chang, Woong-Seong;Noh, Joong-Suk
    • Journal of Welding and Joining
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    • v.31 no.2
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    • pp.16-20
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    • 2013
  • Titanium and its alloys have been widely using in the various field of industry application due to high corrosion resistant properties and mechanical properties. Titanium is highly reactive in the high temperature state and the formation of titanium oxide and porosities in the nuggets of fusion welding will results in the degradation of the mechanical properties. For this reason the studies of friction stir welding for titanium have been investigated recently. The FSW zones of titanium were classified by the weld nugget (WN), the linear transition boundary (TB) and the heat affected zone (HAZ). The WN along with titanium parent was characterized by the presence of twins and dislocations. The average grain size and hardness of WN has been changed according to heat input. The grain refinement resulted from the FSW increased the hardness in the stir zone. Sound dissimilar joints between SUS 304 and CP-Ti were achieved using an advancing speed of 50 mm/min and rotation speeds in the range of 700-1100 rpm. Aluminum 1060 and titanium alloy Ti-6Al-4V plates were lap joined by friction stir welding, hence the ultimate tensile shear strength of joint reached 100% of Al 1060. Mg alloy and Ti were successfully butt joined by inserting a probe into the Mg alloy plate with slightly offsetting. But Ti-Al intermetallic compound layers formed at the interface of these joints.

Aging Effects in the Two-phase Intermetallic compounds Based on Cr-doped $\textrm{Ll}_2\textrm{Al}_3\textrm{Ti}$ (Cr 첨가 $\textrm{Ll}_2\textrm{Al}_3\textrm{Ti}$기 2상 금속간화합물의 시효처리 효과)

  • Lee, Jae-Gyeong;Park, Jeong-Yong;O, Myeong-Hun;Wi, Dang-Mun
    • Korean Journal of Materials Research
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    • v.9 no.10
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    • pp.951-955
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    • 1999
  • Two-phase Al-21Ti-23Cr alloy containing 20 vol.% $\textrm{Cr}_{2}\textrm{Al}$ as a second phase in the $Ll_2$ matrix is located in the two- phase region of the Al- Ti- Cr phase diagram at $1150^{\circ}C$, while in the three-phase region at $1000^{\circ}C$. Based on this result, the mechanical properties of the A1-21Ti-23Cr alloy were enhanced through the refined precipitation of the third phase in the $Ll_2$ matrix by aging the alloy below $1000^{\circ}C$. It was observed that a several ,m of the third phase precipitated in the $Ll_2$ matrix through aging at $800^{\circ}C$ and $1000^{\circ}C$, but the precipitation was not observed below $600^{\circ}C$. Furthermore, the third phase was more finely precipitated at $800^{\circ}C$ than at $1000^{\circ}C$. Although the third phase precipitated at $800^{\circ}C$ and at $1000^{\circ}C$, the compressive yield strength increased rapidly at $800^{\circ}C$ only. This is probably attributable to the refined precipitation of the third phase in the $Ll_2$ matrix. It is expected that the precipitation of the third phase. which was confirmed to be the TiAlCr phase, improves the mechanical properties by preventing crack propagation in the $Ll_2$ matrix.

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Evaporation characteristics of materials from resistive heating sources(I) (저항가열원에 의한 물질의 증발특성(I))

  • 정재인;임병문;문종호;홍재화;강정수;이영백
    • Journal of the Korean institute of surface engineering
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    • v.24 no.1
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    • pp.25-30
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    • 1991
  • The evaporation characteristics of Ag, Al, Au, Cr. Cu, In, Mg, Mn, Pb, Pd, Si, SiO, Sn, Ti and Zn with the various resistive heating sources have been studied. The employed sources are refractory metal (Mo, Ta and W) boats, W-wire, ceramic (usually Al2O3)-coated and -barriered refractory metal boats, and special boats such as baffled boats and intermetallic boats (nitride compound and graphite). We investigated the melting mode, evaporation rate at a specific power, and lifetime of the sources. A special boat holder is also discussed which is needed to cool the sources at a large heat capacity.

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Studies on the Interfacial Reaction between electroplated Eutectic Pb/Sn Flip-Chip Solder Bump and UBM(Under Bump Metallurgy) (전해 도금법을 이용한 공정 납-주석 플립 칩 솔더 범프와 UBM(Under Bump Metallurgy) 계면반응에 관한 연구)

  • Jang, Se-Yeong;Baek, Gyeong-Ok
    • Korean Journal of Materials Research
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    • v.9 no.3
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    • pp.288-294
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    • 1999
  • In the flip chip interconnection using solder bump, the Under Bump Metallurgy (UBM) is required to perform multiple functions in its conversion of an aluminum bond pad to a solderable surface. In this study, various UBM systems such as $Al 1\mu\textrm{m} / Ti 0.2\mu\textrm{m} / Cu 5\mu\textrm{m}, Al 1\mu\textrm{m} / Ti 0.2\mu\textrm{m} / Cu 1\mu\textrm{m}, al 1\mu\textrm{m}/Ni 0.2\mu\textrm{m} / Cu 1\mu\textrm{m} and Al 1\mu\textrm{m}/Pd 0.2\mu\textrm{m} / Cu 1\mu\textrm{m}$ for flip chip interconnection using the low melting point eutectic 63Sn-37Pb solder were investigated and compared to their metallurgical properties. $100\mu\textrm{m}$ size bumps were prepared for using an electroplating process. The effects of the number of reflows and aging time on the growth of intermetallic compounds(IMC) were investigated. $Cu_6Sn_5$ and $Cu_3Sn$ IMC were abserved after aging treatment in the UBM system with thick coper $(Al 1\mu\textrm{m}/Ti 0.2\mu\textrm{m}/Cu 5\mu\textrm{m})$. However only the $Cu_6Sn_5$ was detected in the UBM system with $1\mu\textrm{m}$ thick copper even after 2 reflow and 7 day aging at $150^{\circ}C$. Complete Cu consumption by Cu-Sn IMC growth gives rise to a direct contact between solder inner layer such as Ti, Ni and Pd, and hence to possibly cause reactions between two of them. In this study, however, only for the Pd case, IMC of PdSn. was observed by Cu consumption. UBM interfacial reactions with s이der affected the adhesion strength ot s이der balls after s이der reflow and annealing treatment.

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A Study on the Deformation Induced Microstructure $L1_2$-ordered $Ni_3Al$ Containing Fine Precipitates (미세석출상을 포함하는 $L1_2$형 규칙 $Ni_3Al$의 변형조직에 관한 연구)

  • Han, Chang-Suk;Lee, Joon
    • Journal of the Korean Society for Heat Treatment
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    • v.21 no.5
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    • pp.251-258
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    • 2008
  • A transmission electron microscope investigation has been performed on the morphology of dislocations in deformed ${\gamma}^{\prime}-Ni_3(Al,Ti)$ alloys containing fine dispersion of disordered ${\gamma}$ particles. Superlattice dislocations dissociate into fourfold Shockley partial dislocations in a uniform supersaturated solid solution of the ${\gamma}^{\prime}$ phase. Dislocations are attracted into the disordered ${\gamma}$ phase and dissociate further in the particles. At any stage of aging, dislocations cut through the particles and the Orowan bypassing process does not occur even in the over-aged stage of this alloy system. The work necessary to pull the dislocation away from the disordered particles into the ordered matrix should mainly contribute to increase the strength of the ${\gamma}^{\prime}$ phase containing fine dispersion of the disordered ${\gamma}$ phase.