• 한국태양에너지학회:학술대회논문집
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• 한국태양에너지학회 2009년도 춘계학술발표대회 논문집
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• pp.214-219
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• 2009

In high-efficiency crystalline silicon solar cells, If high-efficiency solar cells are to be commercialized. It is need to develop superior contact formation method and material that can be inexpensive and simple without degradation of the solar cells ability. For reason of plated metallic contact is not only high metallic purity but also inexpensive manufacture. It is available to apply mass production. Especially, Nickel, Copper and Silver are applied widely in various electronic manufactures as easily formation is available by plating. The metallic contact system of silicon solar cell must have several properties, such as low contact resistance, easy application and good adhesion. Ni is shown to be a suitable barrier to Cu diffusion as well as desirable contact metal to silicon. Nickel monosilicide(NiSi) has been suggested as a suitable silicide due to its lower resistivity, lower sintering temperature and lower layer stress than $TiSi_2$. Copper and Silver can be plated by electro & light-induced plating method. Light-induced plating makes use the photovoltaic effect of solar cell to deposite the metal on the front contact. The cell is immersed into the electrolytic plating bath and irradiated at the front side by light source, which leads to a current density in the front side grid. Electroless plated Ni/ Electro&light-induced plated Cu/ Light-induced plated Ag contact solar cells result in an energy conversion efficiency of 14.68 % on $0.2{\sim}0.6{\Omega}{\cdot}cm,\;20{\times}20mm^2$, CZ(Czochralski) wafer.

• 한국전기전자재료학회논문지
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• 제22권4호
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• pp.342-349
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• 2009

This study investigated the growth characteristics of carbon nanotubes (CNTs) by changing a period of annealing time and a $C_{2}H_{2}/H_2$ flow ratio at temperature as low as $450^{\circ}C$ with inductively coupled plasma chemical vapor deposition. The 1-nm-thick Fe-Ni-Co alloy thin film served as a catalyst layer for the growth of CNTs, which was thermally evaporated on the 15-nm-thick Al underlayer deposited on the 50-nm-thick Ti diffusion barrier. The annealing at low temperature of $450^{\circ}C$ brought about almost no granulation of the catalyst layer, and the CNT growth was not affected by a period of annealing time. A study of changing the flow rate of $C_{2}H_{2}$ and $H_2$ showed that as the ratio of the $C_{2}H_{2}$ flow rate to the $H_2$ flow rate was lowered, the CNTs were grown to be longer With further decreasing the flow ratio, the length of CNTs reached the maximum and then became shorter. Under the optimized gas flow rates, we successfully synthesized CNTs with a uniform length over a 4-inch Si wafer at $450^{\circ}C$.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2018년도 춘계학술대회 논문집
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• pp.129-129
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• 2018

Hard coating application is effective way of cutting tool for hard-to-machine materials such as Inconel, Ti and composite materials focused on high-tech industries which are widely employed in aerospace, automobile and the medical device industry also Information Technology. In cutting tool for hard-to-machine materials, high hardness is one of necessary condition along with high temperature stability and wear resistance. In recent years, high-entropy alloys (HEAs) which consist of five or more principal elements having an equi-atomic percentage were reported by Yeh. The main features of novel HEAs reveal thermodynamically stable, high strength, corrosion resistance and wear resistance by four characteristic features called high entropy, sluggish diffusion, several-lattice distortion and cocktail effect. It can be possible to significantly extend the field of application such as cutting tool for difficult-to-machine materials in extreme conditions. Base on this understanding, surface coatings using HEAs more recently have been developed with considerable interest due to their useful properties such as high hardness and phase transformation stability of high temperature. In present study, the nanocomposite coating layers with high hardness on WC substrate are investigated using high entropy alloy target made a powder metallurgy. Among the many surface coating methods, reactive magnetron sputtering is considered to be a proper process because of homogeneity of microstructure, improvement of productivity and simplicity of independent control for several critical deposition parameters. The N2 is applied to reactive gas to make nitride system with transition metals which is much harder than only alloy systems. The acceleration voltage from 100W to 300W is controlled by direct current power with various deposition times. The coating layers are systemically investigated by structural identification (XRD), evaluation of microstructure (FE-SEM, TEM) and mechanical properties (Nano-indenter).

• 한국재료학회지
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• 제12권3호
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• pp.211-214
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• 2002

Properties of 52/48 PZT films with various thicknesses for piezoelectric micro-electro mechanical systems (MEMS) devices fabricated by multi-coating method on $Pt(3500{\AA})/Ti(400{\AA})/SiO_2(3000{\AA})/Si$(525$\mu\textrm{m}$) substrates were investigated. PZT films were deposited by spin-coating process at 3500 rpm for 30 sec, followed by pyrolysis at 45$0^{\circ}C$ for 10 min producing the thickness of about 120nm. These processes were repeated 4, 8, 12, 16 and 20 times in order to have various thicknesses, respectively. Finally, they were crystallized at $650^{\circ}C$ for 30 min. All thick PZT films showed dense and homogeneous surface microstructures. Thick PZT films showed crystalline structures of random orientations with increasing thickness. Dielectric constants of thick PZT films were increased with increasing film thickness and reached 800 at 100kHz for 2.3$\mu\textrm{m}$ thick PZT film. $P_r\; and\; E_c$ of 2.3$\mu\textrm{m}$ thick PZT films were about 20$\mu$C/$\textrm{cm}^2$ and 63kV/cm. Depth profile analysis by Auger Electron Spectroscopy (AES) of 4800 $\AA$ thick PZT film showed the formation of the perovskite phase on Pt layer by Pb diffusion behavior. It was considered that Pb-Pt intermediate layer promoted PZT (111) columnar structures.

• Journal of Welding and Joining
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• 제25권5호
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• pp.45-50
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• 2007

The Ni-base superalloy GTD111 DS is used in the first stage blade of high power land-based gas turbines. Advanced repair technologies of the blade have been introduced to the gas turbine industry over recent years. The effect of the filler metal powder on Transient Liquid Phase bonding phenomenon and tensile mechanical properties was investigated on the GTD111 DS superalloy. At the filler metal powder N series, the base metal powders fully melted at the initial time and a large amount of the base metal near the bonded interlayer was dissolved by liquid inter metal. Liquid filler metal powder was eliminated by isothermal solidification which was controlled by the diffusion of B into the base metal. The solids in the bonded interlayer grew from the base metal near the bonded interlayer inward the insert metal during the isothermal solidification. The bond strength of N series filler metal powder was over 1000 MPa. and ${\gamma}'$ phase size of N series TLP bonded region was similar with base metal by influence of Ti, Al elements. At the insert metal powder M series, the Si element fluidity of the filler metal was good but microstructure irregularity on bonded region because of excessive Si element. Nuclear of solids formed not only from the base metal near the bonded interlayer but also from the remained filler metal powder in the bonded interlayer. When the isothermal solidification was finished, the content of the elements in the boned interlayer was approximately equal to that of the base metal. But boride and silicide formed in the base metal near the bonded interlayer. And these boride decreased with the increasing of holding time. The bond strength of M series filler metal powder was about 400 MPa.

• Journal of Welding and Joining
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• 제23권6호
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• pp.99-105
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• 2005

The mixing ratio effect of the GTD-111(base metal) powder and the GNI-3 (Ni-l4Cr-9.5Co-3.5Al-2.5B) powder on TLP(Transient Liquid Phase) bonding phenomena and mechanism was investigated. At the mixing ratio of the base metal powder under $50wt\%$, the base metal powders fully melted at the initial time and a large amount of the base metal near the bonded interlayer was dissolved by liquid inter metal. Liquid insert metal was eliminated by isothermal solidification which was controlled by the diffusion of B into the base metal. The solid phases in the bonded interlayer grew epitaxially from the base metal near the bonded interlayer inward the insert metal during the isothermal solidification. The number of grain boundaries farmed at the bonded interlayer corresponded with those of base metal. At the mixing ratio above $60wt\%$, the base metal powder melted only at the surface of the powder and the amount of the base metal dissolution was also less at the initial time. Nuclear of solids firmed not only from the base metal near the bonded interlayer but also from the remained base metal powder in the bonded interlayer. Finally, the polycrystal in the bonded interlayer was formed when the isothermal solidification finished. When the isothermal solidification was finished, the contents of the elements in the boned interlayer were approximately equal to those of the base metal. Cr-W borides and Cr-W-Ta-Ti borides formed in the base metal near the bonded interlayer. And these borides decreased with the increasing of holding time.

• 한국재료학회지
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• 제3권6호
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• pp.614-623
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• 1993

높은 알칼리량을 함유하는 LiF-$Li_{2}O-B_{2}O_{3}-P_{2}O_5$계 유리의 전기적 특성을 분석하였다. $Li_{+}$ 이온은 모두 전기전도에 기여하지 않으나 조성에 따른 전기전도도의 변동은 약전해질 모델을 따르지 않았다. 또한 이동이온의 농도를 구하는데 사용되는 승법칙(power law)의 적용이 가능하지 않았다. 이들 계에서 조성에 따른 전기전도도의 변동은 유리내에서의 이동 가능한 $Li^{+}$이온의 농도변화만으로 또는 이동도의 변화만으로는 설명할 수 없었다. 전도도의 향상은 $(B-O-P)^{o}$ 보다 $Li^{+}$이온의 확산에 부가적인 자리를 제공하는$(B-O-P)^-,di^-$, 및 metaborate가 형성된 것과 관련이 있었다. 전기전도성이 가장 좋은 조성의 $150^{\circ}C$에서의 전기전도도는 $2.43 \times 10^{-4}$S/cm였고 분해포텐샬은 5.94V, emf는 3.14V였고 에너지 밀도는 22Wh/Kg이었다.

• 한국의학물리학회지:의학물리
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• 제10권3호
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• pp.125-131
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• 1999

현재 임상적으로 쓰이고 있는 T$_1$/T$_2$ 강조영상 (weighted image) 은 각각 다른 조직이나 정상/병변 조직 사이에 정성적인 대조도를 준다. T$_1$/T$_2$ 영상화 (mapping)는 영상의 각 화소신호랄 T$_1$/T$_2$ 시간으로 나타내는 방법으로 병변의 진행정도를 정량적으로 알 수 있다. T$_1$/T$_2$ 영상화 (mapping)를 얻기 위해서는 수신신호의 증폭률이 같아야 하는데, 일반적으로 MR 영상화 장비에서는 A/D converter 의 동적 구간을 최대 활용하기 위하여 입력신호를 최대 증폭하기 때문에 각각 다른 수신 증폭률을 사용할 수 있다. 이 논문에서는 최대 증폭한 경우와 수신증폭률을 보정한 경우의 T$_1$/T$_2$ 영상을 각각 얻고 측정된 T$_1$/T$_2$ 값을 비교하여 수신증폭률 보정이 T$_1$/T$_2$ 영상화에 어떠한 영향을 미치는지 분석하였다. 그 방법으로서 얻은 영상들이 각각 다른 수신증폭률을 가진 경우에 이를 보정하기 위해 잡음을 표준편차로 이용하는 방법을 사용하였다. 이렇게 얻어진 머리의 T$_1$/T$_2$ 영상은 이미 보고된 T$_1$/T$_2$ 의 값과 유사하였다.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2012년도 춘계학술발표대회
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• pp.84-84
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• 2012

소자가 고집적화 됨에 따라, 비저항이 낮고 electro migration (EM), Stress Migration (SM) 특성이 우수한 구리(Cu)를 배선재료로서 사용하고 있다. 그러나, 구리는 Si과 $SiO_2$의 내부로 확산이 빠르게 일어나, Si 소자 내부에 deep donor level을 형성하고, 누설 전류를 증가시키는 등 소자의 성능을 저하시킬 수 있는 문제점을 가지고 있다. 그러나, electroplating 을 이용하여 증착한 Cu 박막은 일반적으로 확산 방지막으로 쓰이는 TiN, TaN, 등의 물질과의 접착 (adhesion) 특성이 나쁘다. 따라서, Cu CMP 에서 증착된 Cu 박막의 벗겨지거나(peeling), EM or SM 저항성 저하 등의 배선에서의 reliability 문제를 야기하게된다. 따라서 Cu 와 접착 특성이 좋은 새로운 확산방지막 또는 adhesion layer의 필요성이 대두되고 있다. 본 연구에서는 이러한 Cu 배선에서의 접착성 문제를 해결하고자 Metal organic chemical vapor deposition (MOCVD)을 이용하여 제조한 코발트(Co) 박막을 $Cu/TaN_x$ 사이의 접착력 개선을 위한 adhesion layer로 적용하려는 시도를 하였다. Co는 비저항이 낮고, Cu 와 adhesion이 좋으며, Cu direct electroplating 이 가능하다는 장점을 가지고 있다. 하지만, 수소 분위기에서 $C_{12}H_{10}O_6(Co)_2$ (dicobalt hexacarbonyl tert-butylacetylene, CCTBA) 전구체에 의한 MOCVD Co 박막의 경우 탄소, 산소와 같은 불순물이 다량 함유되어 있어, 비저항, surface roughness 가 높아지게 된다. 따라서 구리 전착 초기에 구리의 핵 생성(nucleation)을 저해하고 핵 생성 후에도 응집(agglomeration)이 발생하여 연속적이고 얇은 구리막 형성을 방해한다. 이를 해결하기 위해, MOCVD Co 박막 증착 시 수소 반응 가스에 암모니아를 추가로 주입하여, 수소/암모니아의 분압을 1:1, 1:6, 1:10으로 변화시켜 $Co/TaN_x$ 박막의 특성을 비교 분석하였다. 각각의 수소/암모니아 분압에 따른 $Co/TaN_x$ 박막을 TEM (Transmission electron microscopy), XRD (X-ray diffraction), AES (Auger electron spectroscopy)를 통해 물성 및 조성을 분석하였고, AFM (Atomic force microscopy)를 이용하여, surface roughness를 측정하였다. 실험 결과, $Co/TaN_x$ 박막은 수소/암모니아 분압 1:6에서 90 ${\mu}{\Omega}-cm$의 낮은 비저항과 0.97 nm 의 낮은 surface roughness 를 가졌다. 뿐만 아니라, MOCVD 에 의해 증착된 Co 박막이4-6 % concentration 의 탄소 및 산소 함량을 가지는 것으로 나타났고, 24nm 크기의 trench 기판 위에 약 6nm의 $Co/TaN_x$ 박막이 매우 균일하게 형성된 것을 확인 할 수 있었다. 이러한 결과들은, 향후 $Co/TaN_x$ 박막이 Cu direct electroplating 공정이 가능한 diffusion barrier로서 성공적으로 사용될 수 있음을 보여준다.

• 대한치과보철학회지
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• 제35권3호
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• pp.566-576
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• 1997

This study was performed to evaluate the tensile strength of solder joint in titanium and the wettability of 14K gold solder on titanium. Two pieces of titanium rod 30 mm in length and 3mm in diameter were butt-soldered with a 14K gold solder using the electric resistance heating under flux-argon atmosphere, the infrared heating under argon atmosphere, and the infrared heating under vacuum-argon atmosphere. A tensile test was performed at a crosshead speed of 0.5 mm/min, and fracture surfaces were examined by SEM. To evaluate the wettability of 14K gold solder on titanium, titanum plates of a $17{\times}17{\times}1mm$ were polished with #80-#2000 emery papers, and the spreading areas of solder 10 mg were measured by heating at 840 * for 60 seconds. The solder-matrix interface regions were etched by the solution of 10% KCN-10% (NH4)2S2O8, and analyzed by EPMA. The results obtained were summarized as follows ; 1. The maximum tensile strength was obtained when the titanium surface was polished with #2000 emery paper and soldered using the electric resistance heating under flux-argon atmosphere. Soldering strengths showed the significant difference between the electric resistance heating and the infrared heating(p<0.05). 3. The fracture surfaces showed the aspect of brittle fracture, and the failure developed along the interfaces of solder-matrix reaction zone. 4. The EPMA data for the solder-matrix interface region revealed that the diffusion of Au and Cu occurred to the titanium matrix, and the reaction zone showed the higher contents of Au, Cu and Ti than others.