• Korean Journal of Materials Research
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• v.27 no.11
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• pp.603-608
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• 2017

$Si_3N_4$ is a ceramic material attracting attention in many fields because of its excellent abrasion resistance. In addition, Ti and TiAl alloys are metals used in a variety of high temperature environments, and have attracted much attention because of their high strength and high melting points. Therefore, study of the interface reaction between $Si_3N_4/Ti$ and $Si_3N_4/TiAl$ can be a useful practice to identify phase selection and diffusion control. In this study, $Si_3N_4/Ti_5Si_3+TiN/TiN/Ti$ diffusing pairs were formed in the $Si_3N_4/Ti$ interfacial reaction and $Si_3N_4/TiN(Al)/Ti_3Al/TiAl$ diffusion pathway was identified in the $Si_3N_4/TiAl$ interfacial reaction. The diffusion layers of the interface reactions were identified and, to investigate the kinetics of the diffusion layer, the integrated diffusion coefficients were estimated.

• Korean Journal of Materials Research
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• v.5 no.2
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• pp.169-177
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• 1995

The diffusion barrier property of 100-nm-thick titanium nitride (TiN) film between Cu and Si was investigated using sheet resistance measurements, etch-pit observation, x-ray diffractometry, Auger electron spectroscopy, and transmission electron microscopy. The TiN barrier fails due to the formation of crystalline defects (dislocations) and precipitates (presumably Cu-silicides) in the Si substrate which result from the predominant in-diffusion of Cu through the TiN layer. In contrast with the case of Al, it is identified that the TiN barrier fails only the in-diffusion of Cu because there is no indication of Si pits in the Si substrate. In addition, it appears that the stuffing of TiN does not improve the diffusion barrier property in the Cu/TiN/Si structure. This indicates that in the case of Al, the chemical effect that impedes the diffusion of Al by the reaction of Al with $TiO_{2}$ which is present in the grain boundaries of TIN is very improtant. On the while, in the case of Cu, there is no chemical effect because Cu oxides, such as $Cu_{2}O$ or CuO, is thermodynamically unstable in comparison with $TiO_{2}$. For this reason, it is considered that the effect of stuffing of TiN on the diffusion barrier property is not significant in the Cu/ TiN/Si structure.

• Proceedings of the KIEE Conference
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• 2001.11a
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• pp.9-11
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• 2001

차세대 고속 DRAM기술에 사용될 금속인 Cu의 확산 방지막(diffusion harrier) 물질로는 Ta 또는 W 같은 Refractory metal 이 융점(melting point)이 높고 저항값이 낮아 많이 연구 보고되고 있으나, 본 논문에서는 초고주파 소자에서 Au의 확산 방지 막으로 많이 사용되고 있으며. 선택적 증착이 용이한 Pt과 Ni를 MOS 소자의 Cu 확산 방지 막으로 적용하며 어닐링한 후 소자의 게이트 산화막 누설전류($I_{leak}$), 그리고. Si/$SiO_2$ 계면의 trap density 등의 변이를 측정하여 Cu가 소자의 특성 열화에 미치는 영향을 연구하였다. 실험 결과 Pt/Ti($200{\AA}/100{\AA}$)를 적용한 경우 소자 측성 열화가 가장 적었으며. 이는 Copper의 확산 방지막으로 Pt/Ti를 사용하여 전기적 특성 및 계면 특성을 개선시킬 수 있음을 보여 주었다. 이는 SIMS Profile을 통해서도 확인하였다.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.03a
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• pp.141-141
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• 2003

전기-광 효과를 이용한 광변조기, 스위치 등의 소자 구현을 위해 고품질의 Ti:LiNbO$_3$ 광도파로 제작은 필수적이다. LiNbO$_3$ 광도파로는 양자교환(APE) 및 Ti 확산 법으로 제조할 수 있으며 전자의 경우 ne 는 증가, no는 감소되는 경향이 있어 편광도 파로의 제작에 용의하며 후자의 경우 ne 와 no 모두 증가하는 도파로 특성을 갖는다. 이러한, 도파로 소자의 특성 향상을 위해서는 Li out-diffusion 이 억제된 손실이 적은 도파로 제작이 필수적이다. 본 연구에서는 Ti 내부 확산법을 이용한 LiNbO$_3$ 광도파로를 확산분위기를 조건으로 하여 제작하였으며, 온도에 따른 각 이온의 반응 메커니즘에 관하여 관찰하였다.

• Journal of the Korean Vacuum Society
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• v.7 no.2
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• pp.112-117
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• 1998

TiN has been investigated as a good candidate for a diffusion barrier of Cu. Therefore, in this study, the grain boundary diffusion of Cu in TiN film was investigated by X-ray photoelectron spectroscopy(XPS). In general, TiN has a columnar grain structure. In the relatively lower temperature, less than 1/3 of the melting point, it was observed that Cu diffused into TiN mainly along the grain boundaries of TiN. The grain size of TiN was measured by atomic force microscope (AFM). In order to estimate the grain boundary diffusion constants, we used the modified surface accumulation method. The activation energy, $Q_b$ was 0.23 eV, and the diffusivity, $D_{bo}$ was $5.5\times10^{-12{\textrm{cm}^2$/sec.

• Korean Journal of Materials Research
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• v.5 no.1
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• pp.87-95
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• 1995

The effect of stuffing of TiN on the diffusion barrier property between A1 and Si was investigated. The stuffing of TiN was performed by annealing in a Nz ambient at $450^{\circ}C$ for 30min. By TEM analysis, it is identified that there are solid-free or open spaces of a b u t 10-20$\AA$ between the grains of asdeposited TiN. In the case of stuffed TiN, the width of solid-free or open spaces has been reduced to about 10$\AA$ or below. The combination of RBS and AES analyses showed that the asdeposited TiN had about 7at.% of oxygen, and that the stuffed TiN had about 10-15at.% of oxygen. The diffusion barrier test result shows that after annealing at $650^{\circ}C$ for lhour, the asdeposited TiN fails due to the formation of A1 spikes and Si pits in the Si substrate. However, in the case of stuffed TiN, there is no indication of Al spikes and Si pits at the same annealing condition. Thus, it is concluded that this stuffing of TiN significantly improves the diffusion barrier property of TiN between A1 and Si. It is considered that the stuffing effect results from the reduced diffusion through grain boundaries due to the reduced spacing of grain boundaries.

• Proceedings of the Optical Society of Korea Conference
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• 2003.02a
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• pp.168-169
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• 2003

Ti：LiNbO$_3$ 광도파로는 확산형 도파로이기 때문에 그 도파특성이 확산공정 조건에 크게 의존할 뿐만 아니라 굴절률 분포를 모델링하기가 어렵다. 이러한 이유로 설계된 Ti：LiNbO$_3$ 광도파로의 특성은 실제 제작된 소자와 큰 차이를 보이는 경우가 많은데, 이를 개선하기 위해서는 각 공정파라미터에 따른 도파 특성의 변화를 파악하는 작업이 우선적으로 수행되어야 한다. 본 논문에서는 서로 다른 너비를 갖는 Ti strip을 동일한 확산조건에서 확산시킨 후 제작된 광도파로의 도파손실 및 모드패턴을 측정하였다. (중략)

• Journal of the Korea Institute of Military Science and Technology
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• v.2 no.1
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• pp.183-193
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• 1999

Semiconducting (Sr0.85Ca0.15)TiO3 ceramics were prepared by conventional powder synthesis techniques, and then alkaline metallic cations were diffused into the ceramic bodies. The threshold voltage of the ceramics increases with increasing diffusion time and the amount of diffused materials. The ceramics had boundary potential heights of 0.01 ~ 2.89 eV, while their boundary resistance ranged from 2.2 $M{\Omega}$ to 120.4 $M{\Omega}$. Such electrical characteristics of the boundaries were correlated with the boundary structure of the ceramics obtained by transmission electron microscopy.

• Journal of the Korean Vacuum Society
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• v.10 no.3
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• pp.321-327
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• 2001

Ti-Si-N films obtained by using RF reactive sputtering of targets with various Ti/Si ratios in a $N_2(Ar+N_2)$ gas mixture have been investigated in terms of films resistivity and diffusion barrier performance. The chemical bonding state of Si in the Ti-Si-N film which contained a higher Si content was in the form of amorphous $Si_3N_4$, producing increased film resistivity with increased $N_2$flow rate. Lowering the Si content in the deposited Ti-Si-N film favored the formation of crystalline TiN even at low $N_2$flow rates, and leads to low film resistivity. In addition increasing the N content led to Ti-Si-N films having a higher density and compressive stress, suggesting that the N content in the films appear to be one of the most important factors affecting the diffusion barrier characteristics. Consequently, we proposed the optimum composition in the range of 29~49 at.% of Ti, 6~20 at.% of Si, and 45~55 at.% of N for the Ti-Si-N films having both low resistivity and excellent diffusion barrier performance.

• Journal of the Korean Vacuum Society
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• v.21 no.5
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• pp.242-248
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• 2012

Valence band of a vacuum-reduced $TiO_2$ (001) surface has been carefully examined using synchrotron x-ray photoelectron spectroscopy to investigate variation of the gap state upon oxidation and thermal diffusion of $Ti^{3+}$ interstitials from the bulk. We compare our results with that obtained from $TiO_2$ (110) and aim to address a crystal-face dependency in the oxidation and diffusion rates of $Ti^{3+}$ interstitials. We find very similar behaviors in the oxidation and thermal diffusion rate of $Ti^{3+}$ interstitials between the two crystal faces suggesting a negligible crystal-face dependency in this case.