• Design & Manufacturing
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• 제10권3호
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• pp.39-45
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• 2016

The purpose of this study is to build effective cooling circuit design in injection mold to improve glass fiber reinforced laptop computer cover plastics' transcription and gloss. Moldflow Insight and Ansys CFD CAE program used to verify efficiency and the experiment mold is precision machined and brazing soldered to make three-dimension cooling channel. The temperature of mold in injection test are fixed to $80^{\circ}C$ and $160^{\circ}C$. The result of this experiment is the improved surface quality of plastics with 85% improvement of transcription in high temperature mold.