• Journal of Advanced Marine Engineering and Technology
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• 제24권1호
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• pp.59-66
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• 2000

To investigate the optimum brazing condition, variation of bonded structure and mechanical properties of novel brazed pure Al with bonding condition (brazing temperature, time and Si/flux ratio) was studied. A basic study of the bonding mechanism was also examined. The optimum brazing condition was obtained at $590^{\circ}$ for 2 minutes and the bonded structure showed that it is composed of almost entirely eutectic Al-Si with near eutectic composition. At higher brazing temperature $630^{\circ}$, hypoeutectic Al-Si structure was observed in the bonded area and resulted in erosion of base metal. The thickness of eutectic layer formed in optimum brazing temperature increased linearly with the square root of time, showing a general diffusion controlled process. The ultimate tensile strength of bonded joint brazed at an optimum brazing condition was about 60% of base metal and its fracture surface showed a brittle mode.

• Nuclear Engineering and Technology
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• 제55권10호
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• pp.3535-3542
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• 2023

Eutectic reactions of five kinds of Cr-coated Zr alloy cladding with different base materials (Zr-Nb-Sn alloy or Zr-Nb alloy), different coating thicknesses (6~22.5 mm), and different coating materials (Cr single layer or Cr/CrN bilayer) were studied using Differential Scanning Calorimetry (DSC). The DSC experiments demonstrated that the onset temperatures of the Cr single layer coated specimens were almost identical to ~1308 ℃, regardless of base materials or coating thicknesses. This study demonstrated that the Cr/CrN bilayer coated Zr-Nb-Sn alloy has a slightly (~10 ℃) higher eutectic onset temperature compared to the single Cr-coated specimen. The eutectic region characterized by post-eutectic microstructure proportionally increases with coating thickness. The post-eutectic characterization with different holding times at high temperature (1310-1330 ℃) reveals that progression of Zr-Cr eutectic requires time, and it dramatically changed with exposure time and temperature. The practical value of the time gain in non-instantaneous eutectic formation in terms of safety margin, however, seems to be limited.

• Nuclear Engineering and Technology
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• 제35권2호
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• pp.144-153
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• 2003

The object of this paper is the probabilistic failure analysis on the cladding performance of WPF(Whole Pin Furnace) test fuel pins under transient conditions, and analysis of the KALIMER fuel pin using the preceding analysis. The cumulative damage estimation and Weibull probability estimation of WPF test are performed. The probabilistic method was adapted for these analyses to determine the effective thickness thinning due to eutectic penetration depth. In the results, it is difficult to assume that a brittle layer depth made by eutectic reaction is all of the thickness reduction due to cladding thinning. About 93% cladding thinning of the eutectic penetration depth is favorable as an effective thickness of cladding. And the unreliability of the KALIMER driver fuel pin under the same WPF test condition is lower than that of the WPF pin because of the higher plenum-fuel volume ratio and lower cladding inner radius vs. thickness ratio. KALIMER fuel pin developed from conceptual design has a more stable transient performance for a failure mechanism due to fission gas buildup than the WPF pin.

• 한국분말재료학회지
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• 제4권3호
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• pp.196-204
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• 1997

Joining of AIN ceramics to W and Cu by active-metal brazing method was tried with use of (Ag-Cu)-Ti alloy as insert-metal. Joints were produced under various conditions of temperature, holding time and Ti-content in (Ag-Cu) alloy Reaction and microstructural development in bonded interface were investigated through observation and analysis by SEM/EDS, EPMA and XRD. Joint strengths were measured by shear test. Bonded interface consists of two layers: an insert-metal layer of eutectic Ag- and Cu-rich phases and a reaction layer of TiN. Thickness of reaction layer increases with bonding temperature, holding time and Ti-content of insert-metal. It was confirmed that the growth of reaction layer is a diffusion-controlled process. Activation energy for this process was 260 KJ/mol which is lower than that for N diffusion in TiN. Maximum shear strength of 108 MPa and 72 MPa were obtained for AIN/W and AIN/Cu joints, respectively. Relationship between processing variables, joint strength and thickness of reaction layer was also explained.

• Corrosion Science and Technology
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• 제9권6호
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• pp.233-238
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• 2010

Hot-dipped Al-Mg-Si coatings to alternate Zn and Zn alloy coatings for steel were examined on metallographic structure, corrosion resistance, sacrificial ability, formation and growth of inter-metallic compounds, and mechanical properties. Near the eutectic composition of quasi-binary system of Al-$Mg_2Si$, very fine eutectic structure of ${\alpha}$-Al and $Mg_2Si$ was obtained and it showed excellent corrosion resistivity and sacrificial ability for a steel in sodium chloride solutions. Formation and growth of Al-Fe inter-metallic compounds at the interface of substrate steel and coated layer was suppressed by addition of Si. The inter-metallic compounds layer was usually brittle, however, the coating layer did not peel off as long as the thickness of the inter-metallic compounds layer was small enough. During sacrificial protection of a steel, amount of hydrogen into the steel was more than ten times smaller than that of Zn coated steel, suggesting to prevent hydrogen embrittlement. Al-Mg-Si coating is expected to apply for several kinds of high strength steels.

• Journal of Welding and Joining
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• 제18권3호
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• pp.89-96
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• 2000

As solder becomes small and fine, the reliability and solderability of solder joint are the critical issue in present electronic packaging industry. Besides the use of lead(Pb) containing solders for the interconnections of microelectronic subsystem assembly and packaging has enviromental problem. In this study, using Sn/Pb and Sn/Ag eutectic solder paste, in order to obtain decrease of solder joint strength with increasing aging time, initial solder joint strength and aging strength after 1000 hour aging at $100^{\circ}C$ were measured by peel test. And in order to obtain the growth of intermetallic compound(IMC) layer thickness, IMC layer thickness was measured by scanning electron microscope(SEM). As a result, solder joint strength was decreased with increasing aging time. The mean IMC layer thickness was increased linearly with the square root of aging time. The diffusion coefficient(D) of IMC layer was found to $1.29{\times}10^{-13}{\;}cm^2/s$ at using Sn/Pb solder paste, 7.56{\times}10^{-14}{\textrm}{cm}^2/s$ at using Sn/Ag solder paste.

• 한국결정성장학회지
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• 제8권2호
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• pp.269-277
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• 1998

수소화된 비정질규소 박막의 결정화 방법은 물질의 질과 후속으로 제작되는 성능을 결정한다. 본 논문은 다양한 기판위에 성장된 비정질규소 박막의 결정화 특성조사와 고용체 형성 금속 박막의 유.무에 따른 결정화 효과를 분석하였다. 다양한 기판조사로부터 Mo 기판이 비정질규소 박막을 성장하기위해 선택되었다. 고용체 형성 금속을 사용하지않은 경우 $1100^{\circ}C$ 열처리후에 결정립의 크기가 $0.8{\mu}m$에 달하는 다결정을 얻었다. 결정화 온도를 줄이기 위해 고용체 형성 금속인 Au, Al, Ag등을 사용하였다. 금속 Au를 사용하여 $700^{\circ}C$ 열처리 후에 결정입경 크기가 $10{\mu}m$ 이상이며 (111) 면 우선배향 특성을 갖는 다결정규소 박막이 달성되었다. 광전소자 응용을 위하여 규소박막과 고용체를 형성하는 금속종류, 금속두께 등의 결정화 영향을 조사하였다.

• 한국주조공학회지
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• 제17권4호
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• pp.371-378
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• 1997

The study for direct synthesis of TaC carbide which was a reaction product of tantalum and carbon in the cast iron was performed. Cast iron which has hypo-eutectic composition was cast bonded in the metal mold with tantalum thin sheet of thickness of $100{\mu}m$. The contents of carbon and silicon of cast iron matrix was controlled to have constant carbon equivalent of 3.6. The chracteristics of microstructure and the formation mechanism of TaC carbide in the interfacial reaction layer in the cast iron/tantalum thin sheet heat treated isothermally at $950^{\circ}C$ for various time were examined. TaC carbide reaction layer was grown to the dendritic morphology in the cast iron/tantalum thin sheet interface by the isothermal heat treatment. The composition of TaC carbide was 48.5 at.% $Ti{\sim}48.6$ at.% C-2.8 at.% Fe. The hardness of reaction layer was MHV $1100{\sim}1200$. The thickness of reaction layer linearly increased with increasing the total content of carbon in the cast iron matrix and isothermal heat treating time. The growth constant for TaC reaction layer was proportional to the log[C] of the matrix. The formation mechanism of TaC reaction layer at the interface of cast iron/tantalum thin sheet was proved to be the interfacial reaction.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년도 춘계 학술대회 개요집
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• pp.30-32
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• 2006

The interfacial reaction and reliability of eutectic Sn-Pb and Pb-free eutectic Sn-Ag ball-grid-array (BGA) solders with an immersion Ag-plated Cu substrate were evaluated following isothermal aging at $150^{\circ}C$. During reflowing, the topmost Ag layer was dissolved completely into the molten solder, leaving the Cu layer exposed to the molten solder for both solder systems. A typical scallop-type Cu-Sn intermetallic compound (IMC) layer was formed at both of the solder/Cu interfaces during reflowing. The thickness of the Cu-Sn IMCs for both solders was found to increase linearly with the square root of isothermal aging time. The growth of the $Cu_3Sn$ layer for the Sn-37Pb solder was faster than that for the Sn-3.5Ag solder, In the case of the Sn-37Pb solder, the formation of the Pb-rich layer on the Cu-Sn IMC layer retarded the growth of the $Cu_6Sn_5$ IMC layer, and thereby increased the growth rate of the $Cu_3Sn$ IMC layer. In the ball shear test conducted on the Sn-37Pb/Ag-plated Cu joint after aging for 500h, fracturing occurred at the solder/$Cu_6Sn_5$ interface. The shear failure was significantly related to the interfacial adhesion strength between the Pb-rich and $Cu_6Sn_5$ IMC layers. On the other hand, all fracturing occurred in the bulk solder for the Sn-3.5Ag/Ag-plated Cu joint, which confirmed its desirable joint reliability.

• 마이크로전자및패키징학회지
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• 제6권3호
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• pp.9-18
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• 1999

본 연구에서는 융점 이상에서의 유지시간에 따른 Sn-3.5Ag 및 Sn-37Pb 공정솔더볼과 Au/Ni/Cu 기판 사이의 야금학적 특성을 고찰하였다. 현재 상용되는 리플로 솔더링 장비를 사용하여, 최고 솔더링 온도와 Conveyor 속도를 변화시킴으로써 융점이상에서의 유지시간을 측정하였다. 결과로서 접합부 계면에서 스캘럽 형태의 $Ni_3Sn_4$금속간화합물이 형성되었고, Cu-Sn계 화합물은 관찰되지 않았다. Ni층이 Cu의 확산 장벽으로 작용하였다. 최고 솔더링 온도가 증가함에 따라 금속간화합물 층의 두께가 최고 2.2$\mu\textrm{m}$까지 성장하였다. 스캘럽의 형상은 반구형에서 지름이 더 작은 볼록한 형상으로 변하게 된다. 접합부의 미세경도값은 Sn-3.5Ag와 Sn-37Pb의 공정조직이 성장함에 따라 감소하였다.