• Title/Summary/Keyword: Thermo-mechanical analysis

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Thermo-mechanical Design for On-orbit Verification of MEMS based Solid Propellant Thruster Array through STEP Cube Lab Mission

  • Oh, Hyun-Ung;Ha, Heon-Woo;Kim, Taegyu;Lee, Jong-Kwang
    • International Journal of Aeronautical and Space Sciences
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    • v.17 no.4
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    • pp.526-534
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    • 2016
  • A MEMS solid propellant thruster array shall be operated within an allowable range of operating temperatures to avoid ignition failure by incomplete combustion due to a time delay in ignition. The structural safety of the MEMS thruster array under severe on-orbit thermal conditions can also be guaranteed by a suitable thermal control. In this study, we propose a thermal control strategy to perform on-orbit verification of a MEMS thruster module, which is expected to be the primary payload of the STEP Cube Lab mission. The strategy involves, the use of micro-igniters as heaters and temperature sensors for active thermal control because an additional heater cannot be implemented in the current design. In addition, we made efforts to reduce the launch loads transmitted to the MEMS thruster module at the system level structural design. The effectiveness of the proposed thermo-mechanical design strategy has been demonstrated by numerical analysis.

Degradation Behavior and Micro-Hardness Analysis of a Coolant Rubber Hose for Automotive Radiator (자동차용 냉각기 고무호스의 노화거동과 미소경도분석)

  • Kwak, Seung-Bum;Shin, Sei-Moon;Shin, Wae-Gi;Choi, Nak-Sam
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.31 no.9
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    • pp.915-923
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    • 2007
  • Rubber hoses for automobile radiators are apt to be degraded and thus failed due to the influence of contacting stresses of air and coolant liquid under thermal and mechanical loadings. The aging behaviors of the skin part of the hoses due to thermo-oxidative and electro-chemical stresses were experimentally analyzed. Through the thermo-oxidative aging test, it was shown that the surface hardness IRHD(International Rubber Hardness Degrees) of the rubber increased with a considerable reduction of failure strain as the aging time and temperature increased. On account of the penetration of coolant liquid into the skin part influenced by the electro-chemical degradation(ECD) test the weight of the rubber hose increased, whereas their failure strain and IRHD hardness decreased. The hardness of the hose in the side of the negative pole was the most deteriorated at the test site of the hose skin just below the coolant surface.

Safety margin and fuel cycle period enhancements of VVER-1000 nuclear reactor using water/silver nanofluid

  • Saadati, Hassan;Hadad, Kamal;Rabiee, Ataollah
    • Nuclear Engineering and Technology
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    • v.50 no.5
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    • pp.639-647
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    • 2018
  • In this study, the effects of selecting water/silver nanofluid as both a coolant and a reactivity controller during the first operating cycle of a light water nuclear reactor are investigated. To achieve this, coupled neutronic-thermo-hydraulic analysis is employed to simulate the reactor core. A detailed VVER1000/446 reactor core is modeled in monte carlo code (MCNP), and the model is verified using the porous media approach. Results show that the maximum required level of silver nanoparticles is 1.3 Vol.% at the beginning of the cycle; this value drops to zero at the end of cycle. Due to substitution of water/boric acid with water/Ag nanofluid, reactor operation time at maximum power extends to 357.3 days, and the energy generation increases by about 27.3%. The higher negative coolant temperature coefficient of reactivity in the presence of nanofluid in comparison with the water/boric acid indicates that the reactor is inherently safer. Considering the safety margins in the presence of the nanofluid, minimum departure from nucleate boiling ratio is calculated to be 2.16 (recommendation is 1.75).

The Effect of Finite Element Models in Thermal Analysis of Electronic Packages (반도체 패키지의 열변형 해석 시 유한요소 모델의 영향)

  • Choi, Nam-Jin;Joo, Jin-Won
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.33 no.4
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    • pp.380-387
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    • 2009
  • The reliability concerns of solder interconnections in flip chip PBGA packages are produced mainly by the mismatch of coefficient of thermal expansion(CTE) between the module and PCB. Finite element analysis has been employed extensively to simulate thermal loading for solder joint reliability and deformation of packages in electronic packages. The objective of this paper is to study the thermo-mechanical behavior of FC-PBGA package assemblies subjected to temperature change, with an emphasis on the effect of the finite element model, material models and temperature conditions. Numerical results are compared with the experimental results by using $moir{\acute{e}}$ interferometry. Result shows that the bending displacements of the chip calculated by the finite element analysis with viscoplastic material model is in good agreement with those by $moir{\acute{e}}$ inteferometry.

Warpage Analysis of Fiber Reinforced Injection Molded Parts (단섬유 보강 이방성 사출성형품의 휨 해석)

  • Chung, Seong-Taek;Kim, Jin-Gon;Koo, Bon-Heung
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.24 no.8 s.179
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    • pp.1968-1799
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    • 2000
  • A warpage analysis program has been developed for fiber-reinforced injection molded parts. The warpage is predicted from the residual stress and anisotropic thermo-mechanical properties coupled with fiber orientation in the integrated injection molding simulation. A simple elastic model is used for the calculation of thermally and pressure-induced residual stresses which are employed as the initial conditions in the structural analysis. To improve the reliability of warpage analysis, a new triangular flat shell element superimposing well-known efficient plate bending and membrane element is presented. The numerical examples address the necessity to use anisotropic models for fiber-reinforced materials and show that predicted warpage is in good agreement with experimentally measured one.

Development of an Ultra-Slim System in Package (SiP)

  • Gao, Shan;Hong, Ju-Pyo;Kim, Jin-Su;Yoo, Do-Jae;Jeong, Tae-Sung;Choi, Seog-Moon;Yi, Sung
    • Journal of the Microelectronics and Packaging Society
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    • v.15 no.1
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    • pp.7-18
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    • 2008
  • This paper reviews the current development of an ultra-slim SiP for Radio Frequency (RF) application, in which three flip chips, additional passive components and Surface Acoustic Wave (SAW) filters are integrated side-by-side. A systematic investigation is carried out for the design optimization, process and reliability improvement of the package, which comprises several aspects: a design study based on the 3D thermo-mechanical finite element analysis of the packaging, the determination of stress, warpage distribution, critical failure zones, and the figuration of the effects of material properties, process conditions on the reliability of package. The optimized material sets for manufacturing process were determined which can reduce the number of testing samples from 75 to 2. In addition the molded underfilling (MUF) process is proposed which not only saves one manufacturing process, but also improves the thermo-mechanical performance of the package compared with conventional epoxy underfilling process. In the end, JEDEC's moisture sensitivity test, thermal cycle test and pressure cooker tests have also been carried out for reliability evaluation. The test results show that the optimized ultra-slim SiP has a good reliability performance.

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THERMO-MECHANICAL ANALYSIS OF OPTICALLY ACCESSIBLE QUARTZ CYLINDER UNDER FIRED ENGINE OPERATION

  • Lee, K.S.;Assanis, D.N.
    • International Journal of Automotive Technology
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    • v.1 no.2
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    • pp.79-87
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    • 2000
  • Analytical approach was followed in this work under both the steady state and transient operating conditions to find optimum boundary conditions, where the optically accessible quartz engine can run safely without breaking. Temperature and stress distribution was predicted by FEM analysis. In order to validate thermal boundary condition, model reliability and constraint, outside cylinder temperature was measured and previous study was also followed up numerically. To reduce thermal stress level, three types of outside cooling (natural, moderate forced and intensive forced convection) were considered. Effects of clamping force and combustion pressure were conducted to investigate mechanical stress level. Cylinder thickness, was changed to fine the optimum cylinder thickness. The versatile results achieved from this work can be basic indication, which is capable of causing a sudden quartz cylinder breaking during fired operation.

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Nondestructive Characterization of Degradation of EPDM Rubber for Automotive Radiator Hoses (자동차 냉각기 호스용 EPDM고무의 노화에 대한 비파괴 특성평가)

  • Kwak, Seung-Bum;Choi, Nak-Sam;Choi, Youn-Joung;Shin, Sei-Moon
    • Journal of the Korean Society for Nondestructive Testing
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    • v.25 no.5
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    • pp.368-376
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    • 2005
  • Coolant rubber hoses for automobile radiators can be degraded and thus failed due to the influence of contacting stresses of air and coolant liquid under thermal and mechanical loadings. In this study, for EPDM(ethylene-propylene diene monomer) rubber conventionally used as a radiator hose material the aging behaviors of the skin part due to thermo-oxidative and electro-chemical stresses were nondestructively evaluated. Through the thermo-oxidative aging test, it was shown that the surface hardness IRHD(International Rubber Hardness Degrees) of the rubber increased with a considerable reduction of failure strain. On account of the penetration of coolant liquid into the skin part the weight of rubber specimens degraded by electro-chemical degradation(ECD) test increased, whereas their. failure strain and IRHD hardness decreased largely. The penetration of coolant liquid seemed to induce some changes in inner structure and micro hardness distribution of the rubbers. Consequently, EPDM rubbers degraded by thermo-oxidative aging and ECD could be characterized nondestructively by micro-hardness and chemical structure analysis methods.