• Advanced Composite Materials
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• v.18 no.3
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• pp.233-249
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• 2009

Safe installation and operation of high-pressure composite cylinders for hydrogen storage are of primary concern. It is unavoidable for the cylinders to experience temperature variation and significant thermal input during service. The maximum failure pressure that the cylinder can sustain is affected due to the dependence of composite material properties on temperature and complexity of cylinder design. Most of the analysis reported for high-pressure composite cylinders is based on simplifying assumptions and does not account for complexities like thermo-mechanical behavior and temperature dependent material properties. In the present work, a comprehensive finite element simulation tool for the design of hydrogen storage cylinder system is developed. The structural response of the cylinder is analyzed using laminated shell theory accounting for transverse shear deformation and geometric nonlinearity. A composite failure model is used to evaluate the failure pressure under various thermo-mechanical loadings. A back-propagation neural network (NNk) model is developed to predict the maximum failure pressure using the analysis results. The failure pressures predicted from NNk model are compared with those from test cases. The developed NNk model is capable of predicting the failure pressure for any given loading condition.

• Coupled systems mechanics
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• v.3 no.1
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• pp.89-110
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• 2014

In this work we provide the theoretical formulation, discrete approximation and solution algorithm for instability problems combing geometric instability at large displacements and material instability due to softening under combined thermo-mechanical extreme loads. While the proposed approach and its implementation are sufficiently general to apply to vast majority of structural mechanics models, more detailed developments are provided for truss-bar model. Several numerical simulations are presented in order to illustrate a very satisfying performance of the proposed methodology.

• Journal of Welding and Joining
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• v.29 no.1
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• pp.46-51
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• 2011

TSV technology raises several reliability concerns particularly caused by thermally induced stress. In traditional package, the thermo-mechanical failure mostly occurs as a result of the damage in the solder joint. In TSV technology, however, the driving failure may be TSV interconnects. In this study, the thermomechanical reliability of TSV technology is investigated using finite element method. Thermal stress and thermal fatigue phenomenon caused by repetitive temperature cycling are analyzed, and possible failure locations are discussed. In particular, the effects of via size, via pitch and bonding pad on thermo-mechanical reliability are investigated. The plastic strain generally increases with via size increases. Therefore, expected thermal fatigue life also increase as the via size decreases. However, the small via shows the higher von Mises stress. This means that smaller vias are not always safe despite their longer life expectancy. Therefore careful design consideration of via size and pitch is required for reliability improvement. Also the bonding pad design is important for enhancing the reliability of TSV structure.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.11a
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• pp.621-622
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• 2010

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.35-43
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• 2017

The three-dimensional integrated circuit (3D-IC) is a general trend for the miniaturized and high-performance electronic devices. The through-silicon-via (TSV) is the advanced interconnection method to achieve 3D integration, which uses vertical metal via through silicon substrate. However, the TSV based 3D-IC undergoes severe thermo-mechanical stress due to the CTE (coefficient of thermal expansion) mismatch between via and silicon. The thermo-mechanical stress induces mechanical failure on silicon and silicon-via interface, which reduces the device reliability. In this paper, the thermo-mechanical reliability of TSV based 3D-IC is reviewed in terms of mechanical fracture, heat conduction, and material characteristic. Furthermore, the state of the art via-level and package-level design techniques are introduced to improve the reliability of TSV based 3D-IC.

• Korean Journal of Materials Research
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• v.19 no.6
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• pp.337-343
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• 2009

In this study, we optimized Pb-free Sn/Ni plating thickness and conditions were optimized to counteract the environmental regulations, such as RoHS and ELV(End-of Life Vehicles). The $B_{10}$ life verification method was also suggested to have been successful when used with the accelerated life test(ALT) for assessing Pb-free solder joint life of piezoelectric (PZT) ceramic resonator. In order to evaluate the solder joint life, a modified Norris-Landzberg equation and a Coffin-Manson equation were utilized. Test vehicles that were composed of 2520 PZT ceramic resonator on FR-4 PCB with Sn-3.0Ag-0.5Cu for ALT were manufactured as well. Thermal shock test was conducted with 1,500 cycles from $(-40{\pm}2)^{\circ}C$ to $(120{\pm}2)^{\circ}C$, and 30 minutes dwell time at each temperature, respectively. It was discovered that the thermal shock test is a very useful method in introducing the CTE mismatch caused by thermo-mechanical stress at the solder joints. The resonance frequency of test components was measured and observed the microsection views were also observed to confirm the crack generation of the solder joints.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.3
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• pp.14-19
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• 2008

In the semiconductor IC(Integrated Circuit) package, the top surface of silicon chip is directly attached to the area of the leadframe with a double-sided adhesive layer, in which the base layer have the upper adhesive layer and the lower adhesive layer. The IC package structure has been known to encounter a thermo-mechanical failure mode such as delamination. This failure mode is due to the residual stress on the adhesive surface of silicon chip and leadframe in the curing-cooling process. The induced thermal stress in the curing process has an influence on the cooling residual stress on the silicon chip and leadframe. In this paper, for the minimization of the chip surface damage, the adhesive topologies on the silicon chip are studied through the finite element analysis(FEA).

• Interaction and multiscale mechanics
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• v.4 no.3
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• pp.207-217
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• 2011

International efforts have focused recently on the development of tungsten surfaces that can intercept energetic ionized and neutral atoms, and heat fluxes in the divertor region of magnetic fusion confinement devices. The combination of transient heating and local swelling due to implanted helium and hydrogen atoms has been experimentally shown to lead to severe surface and sub-surface damage. We present here a computational model to determine the relationship between the thermo-mechanical loading conditions, and the onset of damage and failure of tungsten surfaces. The model is based on thermo-elasticity, coupled with a grain boundary damage mode that includes contact cohesive elements for grain boundary sliding and fracture. This mechanics model is also coupled with a transient heat conduction model for temperature distributions following rapid thermal pulses. Results of the computational model are compared to experiments on tungsten bombarded with energetic helium and deuterium particle fluxes.

• Transactions of the Korean hydrogen and new energy society
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• v.29 no.5
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• pp.538-548
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• 2018

The thermo-acoustic instability in the combustion process of a gas turbine is caused by the interaction of the heat release mechanism and the pressure perturbation. These acoustic vibrations cause fatigue failure of the combustor and decrease the combustion efficiency. This study is to develop a segmented dynamic thermo-acoustic model to understand combustion instability of gas turbine. Therefore, this study required a dynamic analysis rather than static analysis, and developed a segmented model that can analyze the performance of the system over time using the Matlab/Simulink. The developed model can confirm the thermo-acoustic combustion instability and exhaust gas concentration in the combustion chamber according to the equivalent ratio change, and confirm the thermo-acoustic combustion instability for the inlet temperature and the load changes. As a result, segmented dynamic thermo-acoustic model has been developed to analyze combustion instability under the operating condition.

• Nuclear Engineering and Technology
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• v.54 no.12
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• pp.4522-4533
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• 2022

For severe accident assessment of reactor pressure vessel (RPV), it is important to develop an accurate model that can predict transient thermo-mechanical behavior of the RPV lower head under the given condition. The present study revisits the lower head failure with two- and three-dimensional finite element models. In particular, we aim to give clear insight regarding the effect of the three-dimensionality present in the distribution of the thickness and thermal load of the lower head. For a rigorous validation of the result, both the OLHF-1 and the OLHF-2 tests are considered in this study. The result suggests that the three-dimensional effect is not negligible as far as the failure location is concerned. The non-uniformity of the thickness distribution is found to affect the failure location and time. The thermal load, which may not be axisymmetric in general, has the most significant effect on the failure assessment. We also observe that the creep property can affect the global deformation of the lower head, depending on the applied mechanical load.