• Journal of Mechanical Science and Technology
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• v.16 no.7
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• pp.919-926
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• 2002

In this study, the numerical prediction of the thermal fatigue lie? of a $\mu$BGA (Micro Ball Grid Array) solder joint was focused. Numerical method was performed using the three-dimensional finite element analysis for various solder alloys such as Sn-37%Pb, Sn-3.5%Ag, Sn-3.5%Ag-0.7%Cu and Sn-3.5%Ag-3%In-0.5%Bi during a given thermal cycling. Strain values obtained by the result of mechanical fatigue tests for solder alloys, were used to predict the solder joint fatigue life using the Coffin-Manson equation. The numerical results showed that Sn-3.5%Ag with the 50-degree ball shape geometry had the longest thermal fatigue life in low cycle fatigue. A practical correlation for the prediction of the thermal fatigue life was also suggested by using the dimensionless variable γ. Additionally Sn-3.5Ag-0.75Cu and Sn-2.0Ag-0.5Cu-2.0Bi were applied to 6$\times$8$\mu$BGA obtained from the 63Sn-37Pb Solder. This 6$\times$8$\mu$BGA were tested at different aging conditions at 130$\^{C}$, 150$\^{C}$, 170$\^{C}$ for 300, 600 and 900 hours. Thickness of the intermetallic compound layer was measured thor each condition and the activation energy thor their growth was computed. The fracture surfaces were analyzed using SEM (Scanning Electron Microscope) with EDS ( Energy Dispersive Spectroscopy).

• Journal of Mechanical Science and Technology
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• v.20 no.1
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• pp.59-65
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• 2006

A half-scaled large test model for the main components of the real annular structure was built and the thermal behaviors were experimented and obtained by thermal cyclic loads. The model design and the test conditions for the thermal loads were determined to take into consideration the thermal and mechanical loads acting on the real annular structure by finite element analyses. Temperature profiles and strains of the main components of the model were measured at an early stage of the test and periodically throughout the test in the given test conditions. After completion of the thermal cyclic tests, no evidence of crack initiation and propagation were identified by a dye penetration test. The measured strains at the critical parts were slightly increased proportionally with the increase in the number of the thermal cycles.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.20 no.1
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• pp.172-179
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• 1996

For mechanical systems operating at high tempertature, thermal fatigue phenomenon has been recognized as a major cause of mechanical component failures. To evaluate cumulative fatigue damage as a conesquence of thermal fatugue on real time, the stress tranfer function(Green's function) approach is popularly used. The objective of this paper is to investigate the effect of thermophsical properties on the stress tranfer function. For this purpose a modified Green's function approach considering temperature-dependent thermophysical properties is proposed. Two case studies were performed and the proposed approach agrees well with full finite element analysis.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.8
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• pp.835-841
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• 2012

We measured the mechanical and thermal properties of four types of cast irons used for manufacturing the brake discs of railway vehicles. It was found that these properties could be controlled by varying the composition of Ni, Cr, and Mo. Thermal fatigue tests were carried out by using a thermal fatigue tester in which thermal cycles could be controlled. Thermal crack initiation and propagation were measured on cylindrical specimens. Finally, we simulated the thermal fatigue test procedure by finite element analysis and calculated the thermal fatigue lifetimes by Manson-Coffin's equation and the maximum principal strain. The estimated thermal fatigue lifetimes corresponded to the measured lifetimes when the total crack length was $40{\mu}m{\sim}1mm$.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.11-16
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• 2007

The existence of grooves on the surface of bond coat has significant effect on the instability of thermal barrier system. In this work, the thermal-mechanical fatigue experiments were performed under various thermal and mechanical loads for FeCralloy specimens with and without yttrium dopant to observe the deformation of surface grooves. The effect of temperature, fatigue load and the ratio of curvature on the deformation of grooves were investigated. As the results, it has been found that the higher load level and the higher curvature ratio induces the larger deformation near the grooves. However, the addition of yittrium dopant induces the adverse results.

• International Journal of Korean Welding Society
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• v.4 no.1
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• pp.61-66
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• 2004

In this paper, the effect of underfill packages was investigated by numerical approach and experimental test. Reliability improvement was the main issue in the package technology. BGA, CSP and small-sized packages, have problems due to concentration of the stress in solder joints. One of the latest technologies to overcome is underfill encapsulant. Mainly, it is noticed the effect of the underfill in the packages. The predicted thermal fatigue lifes are performed by Coffin-Manson's equation with ANSYS (v.5.62). Also, thermal cycle test during from 218K to 423K was included. Finally we could find that underfill greatly reduce the concentration stress in solder joint, thus the fatigue life was improved than without underfill.

• Journal of Ceramic Processing Research
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• v.20 no.5
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• pp.499-504
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• 2019

The effect of coating thickness on the contact fatigue and wear of thermal barrier coatings (TBCs) are investigated in this study. The same bondcoat material thickness (250 ㎛) are used for each sample, which allows the effect of the coating thickness of the topcoat to be investigated. TBCs with different coating thicknesses (200, 400, and 600 ㎛) are prepared by changing processing parameters such as the feeding rate of the feedstock, spraying speed, and spraying distance during APS(air plasma spray) coating. The damage size on the surface are strongly affected by the coating thickness effect. Although the damage size from contact fatigue using a spherical indenter diminish at a TBC of 200 ㎛, a high wear resistance such as a low friction coefficient and little mass change are found at a TBC of 600 ㎛. These results indicate that the coating thickness strongly affects the mechanical behavior in TBCs during gas turbine operation.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.6
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• pp.677-684
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• 2004

Plastic and creep deformations of solder joints during thermal cycling are the main factors of misalignments and power losses in optical telecommunication components. Furthermore, the increased mismatch between solder Joint-bonded areas may cause severe failure in the components. Darveaux's creep model was implemented into a finite element program (ABAQUS) to simulate creep response of solder. Based on the finite element results, thermal fatigue reliability was predicted by using various fatigue life prediction models. Also, the effects of ramp conditions, dwelling time, and solder joint-embedding materials on the reliability were investigated under the thermal cycling conditions of the Telcordia schedule (-40∼75$^{\circ}C$).

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.9
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• pp.1408-1414
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• 2004

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue lift of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear hi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2$^{nd}$ DOE was conducted to obtain RSM equation far the choose 3 design parameter. The coefficient of determination ($R^2$) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430$\mu$m, and 78$\mu$m, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter should be controlled within 3% of average value.

• Journal of Welding and Joining
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• v.19 no.4
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• pp.406-412
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• 2001

This study is focussed on the numerical prediction of the thermal fatigue life of a ${\mu}BGA$(Micro Ball Grid Array) solder joint. Numerical method is used to perform three-dimensional finite element analysis for Sn-37mass%Pb. Sn-3.5mass%Ag solder alloys during the given thermal cycling. Strain values, along with the result of mechanical fatigue tests for solder alloys were then used to predict the solder joint fatigue life using the Coffin-Manson equation. In this study, a practical correlation for the prediction of the thermal fatigue life is suggested by using the dimensionless variable $\gamma$. As a result. it could be found that Sn-3.5mass%Ag has longer fatigue life than Sn-37mass%Pb in low cycle fatigue. In addition. the result with ${\gamm}ashow$a good agreement with the FEA results.