• 마이크로전자및패키징학회지
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• 제6권4호
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• pp.41-48
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• 1999

실리카는 에폭시를 기지재로 하는 전자봉지재의 충진제로써 널리 사용되고 있는 재료이나 이의 낮은 방열성으로 인해 고방열성을 요구하는 부분에는 적용이 어렵다. 충진제 입자들의 지름비를 조합함으로써 최대충진 밀도를 높혀 고충진을 가능하게 하며 유동성도 향상된다는 점을 고려하여 높은 유동성을 가진 결정성 실리카(crystalline silica)를 큰 입자로 하고, 높은 열전도도와 낮은 열팽창계수를 가지지만 상대적으로 고각인 AlN을 작은 입자로 선정하여 혼합충진에 따른 EMC의 물성을 평가하였다. 실리카/AlN의 혼합비에 따른 EMC의 물성측정 결과, AlN의 투입분율을 0.3으로 하였을 때가 AlN의 투입에 따른 물성향상 효과가 가장 뛰어남을 확인 할 수 있었다. 따라서 AlN을 결정성 실리카와 최대 충진밀도에서 혼합하여 EMC에 적용할 경우에, 유동성의 저하없이 AlN의 소량투입만으로 뚜렷한 물성향상 효과를 얻을 수 있음을 확인할 수 있었다.

• Transactions on Electrical and Electronic Materials
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• 제12권3호
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• pp.110-114
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• 2011

Polymeric films of high chemical stability and mechanical strength covered with a thin metallic film have been extensively used in various fields as electric and electronic materials. In this study, we have chosen polypropylene (PP) as the polymer due to its outstanding chemical resistance and good creep resistance. We coated thin nickel film on PP films by the electroless plating process. The surfaces of PP films were pre-treated and modified to increase the adhesion strength of metal layer on PP films, prior to the plating process, by an environment-friendly process with atmospheric plasma generated using dielectric barrier discharges in air. The surface morphologies of the PP films were observed before and after the surface modification process using a scanning electron microscope (SEM). The static contact angles were measured with deionized water droplets. The cross-sectional images of the PP films coated with thin metal film were taken with SEM to see the combined state between metallic and PP films. The adhesion strength of the metallic thin films on the PP films was confirmed by the thermal shock test and the cross-cutting and peel test. In conclusion, we made a composite material of metallic and polymeric films of high adhesion strength.

• Journal of Welding and Joining
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• 제31권5호
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• pp.59-63
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• 2013

A bendable electronic module has been developed for a mobile application by using a low-cost roll-to-roll manufacturing process. In flexible embedded electronic module, a thin silicon chip was embedded in a polymer-based encapsulating adhesive between flexible copper clad polyimide layers. To confirm reliability and durability of prototype bendable module, the following tests were conducted: Moisture sensitivity level, thermal shock test, high temperature & high humidity storage test, and pressure cooker tester. Those experiments to induce failure of the module due to temperature variations and moisture are the experiment to verify the reliability. Failure criterion was 20% increase in bump resistance from the initial value. The mechanism of the increase of the bump resistance was analyzed by using non-destructive X-ray analysis and scanning acoustic microscopy. During the pressure cooker test (PCT), delamination occurred at the various interfaces of the bendable embedded modules. To investigate the failure mechanism, moisture diffusion analysis was conducted to the pressure cooker's test. The hygroscopic characteristics of the encapsulating polymeric materials were experimentally determined. Analysis results have shown moisture saturation process of flexible module under high temperature/high humidity and high atmosphere conditions. Based on these results, stress factor and failure mechanism/mode of bendable embedded electronic module were obtained.

• 한국해양공학회지
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• 제10권2호
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• pp.88-97
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• 1996

The pupose of this study is to improve the mechanical properies and to evaluate the residual stresses of flame-sprayed Alumina ceramic coating layer. The first work in this study is to investigate the effects of strengthening heat treatments on the mechanical properties of coating layer. Strengthening heat treatments for sprayed specimens were carried out in vaccum furnace. The mechanical properties such as microhardness, thermal shock resistance, adhesive strength and erosion resistance were tested for the sprayed specimens after strengthening heat treatments. And it was clear that the mechanical properties of coating layer were much improved by strengthening heat treatments. The second work in this study is to evalute the residual stresses in coating lsyer by numerical analysis. FDM and FEM were used to analyze temperature distribution and residul stresses in coating layer. It was proved that are tensile stresses in coating layer and that residual stresses can be controlled by the appropriate selection of the spraying parameters such as preheat temperature, coating thickness and bond coat thickness.

• 한국세라믹학회지
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• 제46권5호
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• pp.534-539
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• 2009

Reaction Bonded Silicon Carbide(RBSC) has been used for engineering ceramics due to low-temperature fabrication and near-net shape products with excellent structural properties such as thermal shock resistance, corrosion resistance and mechanical strength. Recently, attempts have been made to develop hot gas filter with gradient pore structure by RBSC to overcome weakness of commercial clay-bonded SiC filter such as low fracture toughness and low reliability. In this study a fabrication process of porous RBSC with multi-layer pore structure with gradient pore size was developed. The support layer of the RBSC with multi-layer pore structure was fabricated by conventional Si infiltration process. The intermediate and filter layers consisted of phenolic resin and fine SiC powder were prepared by dip-coating of the support RBSC in slurry of SiC and phenol resin. The temperature of $1550^{\circ}C$ to make Si left in RBSC support layer infiltrate into dip-coated layer to produce SiC by reacting with pyro-carbon from phenol resin.

• 한국세라믹학회지
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• 제41권12호
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• pp.893-899
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• 2004

Nitrided Pressureless Sintering(NPS) 공정에 의한 질화규소 세라믹스의 기계적 특성, 미세구조 및 열적 특성을 세 가지조성을 갖는 $Al_{2}O_3,\;Y_{2}O_3$ 소결조제의 변화에 따라 조사하였다. 또한 각 조성에서 금속 실리콘의 첨가량을 0, 5, 10, 15, 그리고 $20wt\%$로 변화를 주어 실리콘의 첨가효과를 조사하였다. $5wt\%\;Al_{2}O_3,\;5wt\%\;Y_{2}O_3$, 그리고 $5wt\%$ Si 조성에서 질화규소 소결체의 치밀화가 진행되었으며, 4점 꺽임강도와 상대밀도는 각각 500 MPa과 $98\%$를 나타내었다. 또한 상온에서 열팽창계수와 열전도도는 각각 $2.89{\times}10^{-6}/^{\circ}C$와 $28W/m^{\circ}C$를 나타내었으며, 20,000회의 열충격 싸이클을 반복한 후, 꺽임강도를 측정한 결과, 초기 500MPa의 강도를 유지하고 있었다.

• 한국세라믹학회지
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• 제36권6호
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• pp.662-670
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• 1999

Porous alumina was fabricated from pressureless powder packing forming method using powders granulated by spray drying. It was investigated the pore size distribution of fabricated porous alumina. The results of microstructural observation showed that intraganular pore size and intragranular pore size. At 1700$^{\circ}C$ there were no intragranular pores but it showed homogeneous distribution of intergranular pore size. The bending strength and shrinkage increased as porosity decreased. In case of thermal shock resistance sudden decrease of bending strength to $\Delta$T was not shown because intergranular large pore prevented sudden crack propagation.

• 한국세라믹학회지
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• 제36권6호
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• pp.671-678
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• 1999

Porous ceramics were fabricated from pressureless powder packing forming method using mullite and cordierite powders granulate by spray drying. The bending strength and shrinkage of porous ceramics were increased and their porosity were decreased with increasing temperature. It showed homogeneous distribution of 2$\mu\textrm{m}$ intergranular pores of mullite at 1400$^{\circ}C$, 2.5$\mu\textrm{m}$ intergranular pores of cordierite at 1300$^{\circ}C$ respedtively. Above that temperature intragranular particles were sintered and sintering by intergranular necking was extremely proceeded. In the test of thermal shock resistance sudden decrease of bending strength to $\Delta$T was not shown because intergranular large pore prevented sudden crack propagation.

• 한국세라믹학회지
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• 제25권3호
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• pp.284-292
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• 1988

Alumina-zirconia composite powders for the purpose of improving fracture toughness and thermal shock resistance of alumina were prepared by the emulsion-kerosene drying method. The average particle size of composite powders was less then 1 $\mu\textrm{m}$ and their shapes were spherical. It was shown that the average particle size of composite powders decreased with the concentration of metal-salt in solution and the amount of span 80 added when preparing emulsions. The structure of all zirconia in composite powders heat-treated at 1200$^{\circ}C$ was a tetragonal form at room temperature. This result implied that fine zirconia particles were homogeneously dispersed in the alumina matrix.

• 한국세라믹학회지
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• 제20권3호
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• pp.243-249
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• 1983

This study has examined on the effect for the fitting in porcelain body of MgO-SiO system. The mixture was made of correponding in the theoretical composition of enstatite with Kyul Sung Talc and sea water magnesia cake. Hyup Jin Kaolin as clay minerals to give the mixture plasticity was added 10% by weight of the mixture. Feldspar was added inv various kinds of 1%-20% by weight of the above mixture. After the physical properties and microstructures were carefully examined the following results were obtained. 1. The addition amount of feldspar should generally be from 5% to 10% by weight of the mixture to be good for the properties of the strength and the range of the firing temperature. 2. The 5% addition amount of feldspar was good for the apparent bulk density. 3. 5% and 10% additions showed up stably excellant with respect to the various properties Therefore when we considered the apparent bulk density and the thermal shock resistance 5% addition amount of feldspar showed the most excellant properties between $1350^{\circ}C$ and $1400^{\circ}C$.