• Title/Summary/Keyword: Thermal mechanism

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Mechanism Analysis of Thermal Overload Relay (열동형 과부하 계전기의 메커니즘 해석)

  • Lee, Kyung-Ku
    • Proceedings of the KIEE Conference
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    • 1999.07a
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    • pp.287-289
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    • 1999
  • This paper proposes mechanism analysis in thermal overload relay. Overload protection performance is closely connected with mechanism of thermal overload relay. In shortage of analytical technique, we have experienced many difficulties in development of thermal overload relay. We applied analytical results to develop optimum thermal overload relay.

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Numerical analysis of NOx formation characteristics in CH$_{4}$-air jet diffusion flame (CH$_{4}$-공기 분류 확산화염의 NOx 생성특성에 관한 수치해석)

  • O, Chang-Bo;Lee, Chang-Eon
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.22 no.2
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    • pp.193-204
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    • 1998
  • Numerical analysis was performed with multicomponent transport properties and detailed reaction mechanisms for axisymmetric 2-D CH$_{4}$ jet diffusion flame. Calculations were carried out twice with the $C_{2}$-Thermal Mechanism including $C_{2}$ and thermal NO reactions and the $C_{2}$-Full Mechanism including prompt NO reactions in addition to the above $C_{2}$-Thermal NO mechanism. The results show that the flame structures such as flame temperature, major and minor species concentration are indifferent to respective mechanisms. The production path of Thermal NO is dominant comparing with that of Prompt NO in total NO production of pure CH$_{4}$ jet diffusion flame. This is because thermal NO mechanism mainly contributes to positive formation of NO in the whole flame region, but Prompt NO mechanism contributes to negative formation in the fuel rich region. In addition, 0$_{2}$ penetration near the nozzle outlet affects the flame structures, especially N0$_{2}$ formation characteristics.

Topology Optimization of Thermal Actuated Compliant Mechanisms (열 컴플라이언트 메커니즘의 위상 최적설계)

  • Lee, Won-Gu;Im, Min-Gyu;Park, Jae-Yong;Han, Seog-Young
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.19 no.4
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    • pp.434-439
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    • 2010
  • A compliant mechanism is a mechanism that produces its motion by the flexibility of some or all of its members when input force or thermal load is applied. Whereas the topology optimizations based on homogenization and SIMP parameterization have been successfully applied for compliant mechanism design, ESO approach has been hardly considered yet for the optimization of these types of systems. In this paper, traditional ESO method is adopted to achieve the optimum design of a compliant mechanism for thermal load, since AESO method cannot consider the effect of both heat conduction and convection. Sensitivity number, a criterion for element removal in traditional ESO, was newly defined for input thermal loading. The procedure has been tested in numerical applications and compared with the results obtained by other methods to validate these approaches.

DETERMINATION OF THERMAL CONDUCTIVITY FROM TRANSIENT REFLECTIVITY MEASUREMENTS OF AMOPHOUS SILICON THIN FILMS (A-Si 박막의 반사율변화에 따른 열전달계수 결정)

  • Ryu, Ji-Hyung;Kim, Hyang-Jung;Moon, Seung-Jae
    • Proceedings of the KSME Conference
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    • 2007.05b
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    • pp.2453-2458
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    • 2007
  • The performance of polysilicon thin film transistor (p-Si TFT) has an important role in the operation of active matrix liquid crystal displays. To fabricate the p-Si TFTs that have uniform characteristics, understanding of the recrystallization mechanism of silicon is crucial. Especially, the analysis of the transient temperature variation and the liquid-solid interface motion is required to find the mechanism. The thermal conductivity is one of the most important parameters to understand the mechanism. In this work, a KrF eximer laser beam was irradiated to amorphous silicon thin films. We measured the transient reflectivity at the wavelength of 633 nm. We carried out the numerical simulation of one dimension conduction equation so that we determined the most well-fitted thermal conductivity by comparing the numerically obtained transient reflectivity with the experimentally measured one. The experimentally determined thermal conductivity of amorphous silicon thin films is 1.5 W/mK.

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A Research on the reappearance of delamination and the characteristic of LED package by thermal shock test (열충격 시험을 통한 LED Package의 박리재현 및 특성에 관한 연구)

  • Jang, In-Hyeok;Lim, Houng-Woo
    • Journal of Applied Reliability
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    • v.13 no.3
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    • pp.207-216
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    • 2013
  • This paper, we classified LED failure mechanisms that occur due to the delamination and analyzed each of the mechanism that gives the LED PKGs the effect. Usually, the LED is composed of several materials which are LED chips, gold wire, phosphor, epoxy resin, adhesive, reflector and lead frame. These different materials are usually delaminated in trouble conditions which are huge temperature difference, hot and humid or mechanical shocked. When the components are delaminated, a luminance will be lost and moisture be absorbed easily, a thermal resistance be increased attendantly. In this paper, we experimented to investigate failure mechanism of the thermal resistance and failure mechanism of the decrease of luminance that occur due to the delamination. A thermal shock test was performed to reproduce this phenomena by subjecting samples to a cold-hot cyclling process between $-30^{\circ}C$(15min) and $110^{\circ}C$(15min). The samples were inspected at 200, 600 and 1,000 cycles. We measured feature of LED using the spatial analyzer, optical microscope, thermal resistance, photometer, scanning electron microscope (SEM). As a result, the progression of the crack and the thermal resistance and decrease in luminance are proportional to number of thermal shock.

Effects of Methacrylamide Treatment on Silk Fibers II. Thermal Behavior of Methacrylamide-treated Silk Fibers (견섬유에 대한 메타크릴아미드의 처리효과 II. 메타크릴아미드 처리견의 열적 거동에 관하여)

  • 신봉섭;남중희
    • Journal of Sericultural and Entomological Science
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    • v.34 no.1
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    • pp.49-56
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    • 1992
  • Treatment of vinyl monomers onto silk fiber modifies the properties of the original silk fiber considerably. This field has been the subject of investigation by many workers using chemical and radiation initiation. Many studies on the reaction conditions, polymerization mechanism, physical properties and practical performances of methacrylamide-treated silk fiber have been continued. However, the polymerization mechanism has not been clearly revealed yet and this remains ambiguously whether the grafting is formed on fiber or not. In general, it has been accepted that free radicals were formed and vinyl monomers were polymerized in silk fibroin by graft polymerization mechanism, while active sties were varied by the types of monomer and initiator as well as by the reaction conditions. On the other hand, there is another argument on polymerization mechanism, in which monomers are polymerized and impregnated in the internal side of the fiber by homopolymerization. Though a large number of analytical methods are used to examine the polymerization mechanism of methacrylamide-treated silk fiber, the results on the basis of thermal analysis are merely reported in this paper. In differential scanning calorimetry (DSC) analysis, the thermal decomposition behaviors of the methacrylamie-treated silk fibers were determined and compared to those of the controlled silk fibers. DSC curves obtained from the methacrylamide-treated silk fibers showed double peaks at around 290$^{\circ}C$ (A peak) and 320$^{\circ}C$ (B peak) which are attributed to the thermal decomposition of the methacrylamide polymer and silk fibroin fiber, respectively. The temperature of A and B peak shifted to higher value with the increase of add-on. Also, the moisture regain of the treated silk fibers increased with add-on.

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NOx Formation Characteristics in Diffusion, Partial Premixed and Premixed Jet flame (가스 연료의 연소 방식에 따른 NOx 생성 특성)

  • Choi, Young-Ho;Lee, Chang-Eon
    • 한국연소학회:학술대회논문집
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    • 1998.10a
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    • pp.155-164
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    • 1998
  • Numerical analysis was performed with multicomponent transport properties and detailed reaction mechanisms for axisymetric 2-D CH4 jet diffusion, partial premixed, premixed flame. Calculations were carried out twice with C2-Full Mechanism including prompt NO reaction in addition to the above C2-Thermal NO Mechanism. The role of thermal NO mechanism and prompt NO mechanism on each flame's NO production is investigated by using the numerical result. The NOx production of each flame were evaluated Quantitatively in terms of the NOx emission index

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Influence of Oxidation Inhibitor on Carbon-Carbon Composites : 8. Studies on Thermal Decomposition Mechanism and Thermal Stability of Composites Impregnated with TEOS (산화억제제를 첨가한 탄소/탄소 복합재료의 물성에 관한 연구 : 8. TEOS를 함유한 복합재료의 열분해 메카니즘 및 열안정성 연구)

  • 박수진;서민강;이재락
    • Polymer(Korea)
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    • v.25 no.6
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    • pp.866-875
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    • 2001
  • In this work, thermal decomposition mechanism based on kinetic parameters and thermal stability of carbon fiber-reinforced carbon matrix composites (C/C composites), have been studied under high temperature oxidative conditions with addition of tetra-ethylorthosilicate (TEOS) as an oxidation inhibitor. Thermogravimetric analysis (TGA) was executed to evaluate the thermal decomposition mechanism and thermal stability of C/C composites in the temperature range of 30 ~ $850^{\circ}C$. As a result, the kinetic parameters of the composites impregnated with TEOS, i.e., activation energy for thermal decomposition ($E_d$), order of reaction (n) , and pre-exponential factor (A) were evaluated as 136 kJ/mol, 0, and 2.3$\times$$10^9s^{-1}$, respectively. Especially, the IPDT and $E_d$ of C/C composites impregnated with TEOS were improved largely compared with the composites impregnated without TEOS, due to the formation of $SiO_2$ on composite surfaces, resulting in interrupting the oxygen attack to carbon active site in the composites.

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Numerical and Experimental Thermal Validation on Pogo-pin based Wire Cutting Mechanism for CubeSat Applications (큐브위성용 포고핀 기반 열선절단 분리장치의 열적 거동 분석 및 검증)

  • Min-Young Son;Bong-Geon Chae;Hyun-Ung Oh
    • Journal of Aerospace System Engineering
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    • v.17 no.2
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    • pp.94-102
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    • 2023
  • A nylon wire holding and release mechanism (HRM) has been widely used for deployable applications of CubeSat owing to its simplicity and low cost. In general, structural safety of solar panel with an HRM has been designed by performing structural analysis under a launch environment. However, previous studies have not performed thermal analysis for HRM in an on-orbit environment. In this study, Launch and Early Orbit Phase (LEOP) thermal analysis was performed to evaluate thermal stability of the mechanism in the orbital thermal environment of the pogo pin-based HRM applied to CubeSat. In addition, the effectiveness of the thermal design and performance of the pogo pin-based HRM were verified through a thermal vacuum test.