• 제목/요약/키워드: Thermal low

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위킹 및 후속 열분해 탈지에 의한 저압 사출제의 가속탈지 (Rapid Debinding of Low Pressure Injection Molded Parts by Wicking and Subsequent Thermal Pyrolysis)

  • 최인묵;김민기;김상우;이해원;송휴섭;최성철
    • 한국세라믹학회지
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    • 제35권6호
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    • pp.635-639
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    • 1998
  • When the low pressure injection molded parts are debinded by wicking and subsequent thermal pyrolysis the optimum transition point from wicking to thermal pyrolysis is just after the completion of the constant wicking rate period. Even when the partially debinded parts were heated at 5$^{\circ}C$/min after reaching the 1st falling rate period the debinding defects such as distortion and cracks were not found.

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저궤도 위성에서 별센서의 가시성을 위한 Yaw Motion에 따른 열적 영향 고찰 (An Investigation in the Thermal Effect on a Low Earth Orbit Satellite under Yaw Motion for the Visibility of a Star Sensor)

  • 김희경;이장준;현범석
    • 한국항공우주학회지
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    • 제37권7호
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    • pp.709-716
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    • 2009
  • 위성 궤도 자세는 위성 열설계에 영향을 주는 중요한 요소로서, 궤도 운용 자세에 대한 열적 조건을 정확히 파악하는 것을 필요로 한다. 본 연구에서는 저궤도 위성의 yaw motion의 운영 자세에 따른 우주 열환경의 변화와 열설계의 열적 영향을 검토하였다. 본 위성은 고정형의 태양 전지판을 가지고 있기 때문에 태양광 구간 동안에 태양지향(sun-pointing)자세를 유지하고, 위성에 장착되는 별센서인 별추적기의 가시 방향이 심층 우주방향을 향하도록 하기 위하여 위성의 길이 방향을 축으로 일정한 각속도로 회전을 하는 yaw motion을 하도록 운용된다. 이것은 위성이 정밀한 자세 제어의 성능을 발휘할 수 있도록 별추적기가 별의 시야각을 확보하기 위한 것이다. 또한 위성 열설계 측면에서는 이러한 운용을 위한 자세 변화에 따른 열적 영향을 파악하는 것을 필요로 한다. 연구에서는 위성의 열모델에 이러한 궤도 운용 자세를 반영한 후의 궤도 열해석을 통하여 이를 알아보고자 한다.

Microstructure control and change in thermal conductivity of 8YSZ/SiO2 multi-compositional coating by suspension plasma spraying

  • Jeon, Hak-Beom;Lee, In-Hwan;An, Gye Seok;Oh, Yoon-Suk
    • Journal of Ceramic Processing Research
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    • 제19권6호
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    • pp.450-454
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    • 2018
  • In recent years, thermal insulation coating technology for automotive engine parts has received significant attention as a means of improving the thermal efficiency of automotive engines. One of the characteristics of thermal insulation coatings is their low thermal conductivity, and, materials such as YSZ (Yttria-stabilized zirconia), which have low thermal conductivity, are used for this purpose. This research presents a study of the changes in the microstructure and thermal conductivity of $8YSZ/SiO_2$ multi compositional thermal insulation coating for different compositions, and particle size distributions of suspension, when it is subjected to suspension plasma spraying. To obtain a porous coating structure, the mixing ratio of 8YSZ and $SiO_2$ particles and the particle sizes of the $SiO_2$ were changed. The microstructure, phase formation behavior, porosity and thermal conductivity of the coatings were analyzed. The porosities were found to be 1.2-32.1%, and the thermal conductivities of the coatings were 0.797-0.369 W/mK. The results of the study showed that the microstructures of the coatings were strongly influenced by the particle size distributions, and that the thermal conductivities of the coatings were greatly impacted by the microstructures of the coatings.

열충격 사이클에 따른 SnAgCu 솔더별 솔더 접합부의 신뢰성 및 계면반응 (The Interfacial Reactions and Reliability of SnAgCu Solder Joints under Thermal Shock Cycles)

  • 오철민;박노창;한창운;방만수;홍원식
    • 대한금속재료학회지
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    • 제47권8호
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    • pp.500-507
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    • 2009
  • Pb-free solder has recently been used in electronics in efforts to meet environmental regulations, and a number of Pb-free solder alloy choices beyond the near-eutectic SnAgCu solder are now available. With increased demand for thin and portable electronics, the high cost of alloys containing significant amounts of silver and their poor mechanical shock performance have spurred the development of low Ag SnAgCu solder, which provides improved mechanical performance at a reasonable cost. Although low Ag SnAgCu solder exhibits significantly higher fracture resistance under high-strain rates, little thermal fatigue data exist for this solder. Therefore, it is necessary to investigate thermal fatigue reliability of low Ag SnAgCu solder under variation of thermal stress in order to allow its implementation in electronic products with high reliability requirements. In this study, the reliability of Sn0.3Ag0.7Cu(SAC0307), a low Ag solder alloy, is discussed and compared with that of Sn3Ag0.5Cu(SAC305). Three sample types and six samples size are evaluated. Mechanical properties and microstructure of the solder joint are investigated under thermal shock cycles. It was observed that the mechanical strength of SAC0307 dropped slightly with thermal cycling relative to that of SAC305. This reveals that the failure mode of SAC0307 is different from that SAC305 under this critical condition.

대용량 이차전지 관리 시스템용 전력형 션트저항의 열기전력 안정화 (Stabilization of Thermo Electromotive Force of Power Type Shunt Resistor for Mass Storage Secondary Battery Management System)

  • 김은민;이선우
    • 한국전기전자재료학회논문지
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    • 제30권6호
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    • pp.376-380
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    • 2017
  • In this paper, we prepared a metal alloy resistor with stable thermal electro motive force (thermal EMF) as well as a low temperature coefficient of resistance (TCR) by adjusting the manganese proportion from 3 to 12 wt% in the Cu-Mn-Ni alloy. Composition of the fabricated metal alloy was investigated using energy dispersive X-ray (EDX) analysis. The TCR of each sample was measured as 44.56, 40.54, 35.60, and 31.56 ppm for Cu-3Mn-2Ni, Cu-5Mn-2Ni, Cu-10Mn-2Ni, and Cu-12Mn-2Ni, respectively. All the resistor samples were available for the F grade (${\pm}1%$ of the allowable error of resistance) high-precision resistor. All the samples satisfied the baseline of high thermal EMF (under 3 mV at $60^{\circ}C$); however, Cu-3Mn-2Ni and Cu-5Mn-2Ni satisfied the baseline of low thermal EMF (under 0.3 mV at $25^{\circ}C$). We were thus able to design and fabricate the metal alloy resistor of Cu-3Mn-2Ni and Cu-5Mn-2Ni to have low TCR and stable thermal EMF at the same time.

적외선 램프를 이용하여 소결한 구리 나노잉크의 전기적 특성 평가에 관한 연구 (Electrical Property Evaluation of Printed Copper Nano-Ink Annealed with Infrared-Lamp Rapid Thermal Process)

  • 한현숙;김창규;양승진;김윤현
    • 한국재료학회지
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    • 제26권4호
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    • pp.216-221
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    • 2016
  • A sintering process for copper based films using a rapid thermal process with infrared lamps is proposed to improve the electrical properties. Compared with films produced by conventional thermal sintering, the microstructure of the copper based films contained fewer internal and interfacial pores and larger grains after the rapid thermal process. This high-density microstructure is due to the high heating rate, which causes the abrupt decomposition of the organic shell at higher temperatures than is the case for the low heating rate; the high heating rate also induces densification of the copper based films. In order to confirm the effect of the rapid thermal process on copper nanoink, copper based films were prepared under varying of conditions such as the sintering temperature, time, and heating rate. As a result, the resistivity of the copper based films showed no significant changes at high temperature ($300^{\circ}C$) according to the sintering conditions. On the other hand, at low temperatures, the resistivity of the copper based films depended on the heating rate of the rapid thermal process.

복합금속비누와 안정화조제를 이용한 PVC의 열안정화에 대한 연구 (Study of thermal stability on PVC using mixed metal soap and stabilizer)

  • 전인기;안성환;정광보
    • 한국응용과학기술학회지
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    • 제27권4호
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    • pp.552-558
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    • 2010
  • Zinc soap and Zn/Ba mixed metal soap were synthesized and PVC plastisol with mixed metal soap and various costabilizers were also synthesized with good structures and characterized by IR and $^1H$-NMR. The IR spectrums and $^1H$-NMR spectrums of the synthesized soaps were in very good accordance with the structures proposed by earlier workers. In using phosphite as a costabilizer, TIDP phosphite was shown to be the excellent thermal stabilization effect at the low temperature and TNPP phosphite was shown to be the excellent thermal stabilization effect at the high temperature. In case of antioxidant, it was revealed that antioxidant was not effective in the low temperature thermal stabilization effect while highly effective in the high temperature thermal stability. $NaClO_4$ solution with sorbitol solvent had the best thermal stabilization effect among $NaClO_4$ solution series at low and high temperature.

더블로이유리 적용 창호의 구성요소에 따른 단열성능 비교 실험 (A Comparison of Thermal Performance of Double Low-E Glazing Window according to Various Material)

  • 장철용;안병립;김치훈;김준섭;이성재
    • 한국태양에너지학회:학술대회논문집
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    • 한국태양에너지학회 2011년도 춘계학술발표대회 논문집
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    • pp.133-137
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    • 2011
  • Low-e glazing is classified as soft low-e glazing and hard low-e glazing. Hard low-e glazing can be temperable and its handling is comfortable because its coating film is a oxide film generated at high temperatures. But there is a fatal weakness that its insulation performance and shielding performance are lower compared to soft low-e glazing by low electrical conductivity of coating film. Soft low-e glazing is excellent because its coating film consists of Ag that is excellent electrical conductivity and it has strength that can supply various product consumers want. But soft low-e glazing has weaknesses that temperable and handling are difficult because Ag is oxidized easily. Therefore this study analyzes thermal performance of glazing by changing filling gas according to applying low-e glazing through simulation to judge performance before making sample. After this process, a comparative experimental study was done through TVS by making temperable low-e glazing.

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국내 저온용 집열기의 열성능 특성 (Thermal Characteristics of Domestic Solar Collector for Low-Temperature Applications)

  • 김정배;이순명;윤응상;이진국;주문창;이동원;곽희열;백남춘
    • 한국태양에너지학회 논문집
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    • 제27권3호
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    • pp.155-160
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    • 2007
  • This study shows the results on thermal performance test with domestic solar collector for low-temperature applications using KS, then reveals the efficiency difference between KS and EN standard. Using the test results, this study Presents the status of thermal performance with domestic solar collector including flat-plate, single evacuated, and double evacuated (with mirror or U-tube) solar collector.

A Review on Thermal Conductivity of Polymer Composites Using Carbon-Based Fillers : Carbon Nanotubes and Carbon Fibers

  • Hong, Jin-Ho;Park, Dong-Wha;Shim, Sang-Eun
    • Carbon letters
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    • 제11권4호
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    • pp.347-356
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    • 2010
  • Recently, the use of thermal conductive polymeric composites is growing up, where the polymers filled with the thermally conductive fillers effectively dissipate heat generated from electronic components. Therefore, the management of heat is directly related to the lifetime of electronic devices. For the purpose of the improvement of thermal conductivity of composites, fillers with excellent thermally conductive behavior are commonly used. Thermally conductive particles filled polymer composites have advantages due to their easy processibility, low cost, and durability to the corrosion. Especially, carbon-based 1-dimensional nanomaterials such as carbon nanotube (CNT) and carbon nanofiber (CNF) have gained much attention for their excellent thermal conductivity, corrosion resistance and low thermal expansion coefficient than the metals. This paper aims to review the research trends in the improvement of thermal conductivity of the carbon-based materials filled polymer composites.