• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1998.03a
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• pp.88-93
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• 1998

The service life of tools in metal forming process is to a large extent limited by wear, fatigue fracture and plastic deformation. In warm forging processes wear is the predominant factor for operating lives of tools. To predict tool life by wear, Archard's wear model is generally applied. Usually hardness of die is considered to be a function of temperature in Archard's wear model. But hardness of die is a function of not only temperature but also operating time of die. To consider softening of die by repeated operations, it is necessary to express hardness of dies by a function of temperatures and operating time. By experiment of reheating of dies, die softening curves were obtained. Finally modified Archard's wear model in which hardness of die was expressed as a function of main tempering curve was proposed.

• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.1657-1659
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• 1996

The objective of this study is to provide a life prediction of isothermal fatigue using strain partitioning of high temp. steel for power plants. The experimental system was composed of Instron 8501, induction heating system, extensometer and pyrometer with hydraulic power system

• Journal of the Computational Structural Engineering Institute of Korea
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• v.21 no.1
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• pp.35-42
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• 2008

In the nuclear power plant, early detection of fatigue crack by non-destructive test (NDT) equipment due to the thermal cyclic load is very important in terms of strict safety regulation. To this end, many efforts are exerted to the fabrication of artificial cracked specimen for practicing engineers in the NDT company. The crack of this kind, however, cannot be made by conventional machining, but should be made under thermal cyclic load that is close to the in-situ condition, which takes tremendous time due to the repetition. In this study, thermal loading condition is investigated to minimize the time for fabricating the cracked specimen using simulation technique which predicts the crack initiation and propagation behavior. Simulation and experiment are conducted under an initial assumed condition for validation purpose. A number of simulations are conducted next under a variety of heating and cooling conditions, from which the best solution to achieve minimum time for crack with wanted size is found. In the simulation, general purpose software ANSYS is used for the stress analysis, MATLAB is used to compute crack initiation life, and ZENCRACK, which is special purpose software for crack growth prediction, is used to compute crack propagation life. As a result of the study, the time for the crack to reach the size of 1mm is predicted from the 418 hours at the initial condition to the 319 hours at the optimum condition, which is about 24% reduction.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.10 s.181
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• pp.2654-2663
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• 2000

Steam turbine rotors are the most critical and highly stressed components of a steam power plant; therefore, the life expectancy of the turbine rotor is an important consideration for the safety of a steam power plant. The objective of this paper is to develop a life estimation program for turbine rotors for all possible operating conditions. For this purpose, finite element analysis was carried out for four normal operating modes (cold, warm, hot and very hot starts) using ABAQUS codes. The results are made into databases to evaluate the life expenditure for an actual operating condition. For any other possible abnormal operating condition, the operating data are transmitted to the server (workstation) through a network to carry out finite element analysis. Damage estimation is carried out by transmitting the finite element analysis results to the personal computer, and then the life expectancy is calculated.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.103-111
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• 2017

In this study, the thermomechanical stress and fatigue analysis of a high voltage and high current (3,300 V/1200 A) insulated gate bipolar transistor (IGBT) module used for electric locomotive applications were performed under thermal cycling condition. Especially, the reliability of the copper wire and the ribbon wire were compared with that of the conventional aluminum wire. The copper wire showed three times higher stress than the aluminum wire. The ribbon type wire showed a higher stress than the circular type wire, and the copper ribbon wire showed the highest stress. The fatigue analysis results of the chip solder connecting the chip and the direct bond copper (DBC) indicated that the crack of the solder mainly occurred at the outer edge of the solder. In case of the circular wire, cracking of the solder occurred at 35,000 thermal cycles, and the crack area in the copper wire was larger than that of the aluminum wire. On the other hand, when the ribbon wire was used, the crack area was smaller than that of the circular wire. In case of the solder existing between DBC and base plate, the crack growth rate was similar regardless of the material and shape of the wire. However, cracking occurred earlier than chip solder, and more than half of the solder was failed at 40,000 cycles. Therefore, it is expected that the reliability of the solder between DBC and base plate would be worse than the chip solder.

• Elastomers and Composites
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• v.53 no.4
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• pp.220-225
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• 2018

Resilient pads play a major role in reducing the impact of loads on a rail in a rail-fastening system, which is essentially used for a concrete track. Although a compression set test is commonly used to measure the durability of a resilient pad, the static spring constant is often observed to be different from the fatigue test. In this study, a modified compression set test method was proposed to monitor the variations in the compression set and static spring constant of a resilient pad with respect to temperature and time. In addition, the life of the resilient pad was predicted by performing an acceleration test based on the Arrhenius equation.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.2
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• pp.225-231
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• 2012

Drop simulations of the board level in the flip chips with solder joints have been highlighted for years, recently. Also, through the study on the life prediction of thermal fatigue in the flip chips considering underfill, its importance has been issued greatly. In this paper, dynamic analysis using the implicit method in the Finite Element Analysis (FEA) is carried out to assess the factors effecting on flip chips considering underfill. The design parameters are size and thickness of chip, and size, pitch and array of solder ball with composition of Sn1.0Ag0.5Cu. The board systems by JEDEC standard is modeled with various design parameter combinations, and through these simulations, maximum yield stress and strain at each chip are shown at the solder balls. Modal analysis is simulated to find out the relation between drop impact and vibration of the board system.