• Proceedings of the Korean Society of Precision Engineering Conference
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• 1993.10a
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• pp.660-665
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• 1993

An elastic model is developed to predict the average thermal residual stresses in the matrix and fiber of a misoriented short fiber composite. The thermal residual stresses are induced by the mismatch in the coefficient of the thermal expansion of the matrix and fiber when the composite is subjected to a uniform temperature change. The model considers two special cases of fiber misorientation ; two-dimensional in-plane and three-dimensional axisymmetric. The analytical formulation of the model is based on Eshelby's equivalent inclusion method and is nuque in that it is able to account for interactions among fibers. The model is more general than past models and it is able to treat prior analyses of the simpler composite systems as extram cases. The present model is to investigate the effects of fiber volume fraction, distribution type, distribution cut-off angle, and aspect ratio on thermal residual stress for both in-plane and axisymmetric fiber misorientation. Fiber volum fraction, aspect ratio, and disturbution cut-off angle are shown to have more significant effects on the magnitude of the thermal residual stress than fiber distrubution type for both in-plane and axisymmetric misorientation.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.4 s.33
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• pp.49-53
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• 2004

Polymeric materials are widely used in the electronic industry as a common dielectric material or adhesive. The polymeric layer coated on Si substrate can be subjected to thermal stresses due to difference in thermal expansion coefficients. The mismatch in thermal properties between the polymeric layer and the substrate results in significant residual stresses. In this study, the thermal deformation is measured by a curvature measurement method using laser scanning, and the elastic modulus is calculated by an analytic model.

• Journal of Welding and Joining
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• v.17 no.6
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• pp.78-83
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• 1999

Solder joint is the weakest part which connects in mechanically and electronically between package body and PCB(Printed Circuit Board). Recently, the reliability of solder joint become the most critical issue in surface mounted technology. The solder joint interconnection between plastic package and PCB is susceptible to shear stress during thermal storage due to the mismatch in coefficient of thermal expansion between plastic package and PCB. A general computational approach to determine the effect of solder joint shape on the fatigue life presented. The thermal fatigue life was estimated from the engelmaier equation which was obtained from the temperature cycling loading($-65^{\circ}C$ to $150^{\circ}C$). As result of the simulation, TSOP structure has the shortest thermal fatigue life and the same structure Copper lead has 2.5 times as much fatigue life as Alloy 42 lead. In BGA structure, fatigue life time extended 80 times when underfill material exists.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.4
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• pp.380-387
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• 2009

The reliability concerns of solder interconnections in flip chip PBGA packages are produced mainly by the mismatch of coefficient of thermal expansion(CTE) between the module and PCB. Finite element analysis has been employed extensively to simulate thermal loading for solder joint reliability and deformation of packages in electronic packages. The objective of this paper is to study the thermo-mechanical behavior of FC-PBGA package assemblies subjected to temperature change, with an emphasis on the effect of the finite element model, material models and temperature conditions. Numerical results are compared with the experimental results by using $moir{\acute{e}}$ interferometry. Result shows that the bending displacements of the chip calculated by the finite element analysis with viscoplastic material model is in good agreement with those by $moir{\acute{e}}$ inteferometry.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2002.04b
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• pp.11-11
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• 2002

Plastic deformation was observed by TEM around the intragranular SiC particles in the $Al_2O_3$ matrix for $Al_2O_3/SiC$ nanocomposite system. The dislocations are generated at selected planes and there is a tendency for the dislocations to form a subgrain boundary structure with low-angel grain boundaries and networks. In this study, dislocation generated in the $Al_2O_3$ matrix during cooling down from sintering temperatures by the highly localized thermal stresses within and/or around SiC particles caused from the thermal expansion mismatch between $Al_2O_3$ matrix and SiC particle was observed. In monolithic $Al_2O_3$ and $Al_2O_3/SiC$ microcomposite system. These phenomena is closely related to the plastic relaxation of the elastic stress and strain energy associated with both thermal misfitting inclusions and creep behaviors. The plastic relaxation behavior was explained by combination of yield stress and internal stress.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.11
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• pp.1646-1655
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• 2004

A description of the basic principles of moire interferometry leads to the design of a eight-mirror four-beam interferometer for obtaining fringe patterns representing contour-maps of in-Plane displacements. The technique is implemented by the optical system using an environmental chamber for submicro-displacement mesurement. In order to estimate the reliability and applicabili쇼 of the system developed, the measurement of coefficient of thermal expansion (CTE) for a aluminium block is performed. Consequently, the system is applied to the measurement of thermal deformation of a WB-PBGA package assembly. Temperature dependent analyses of global and local deformations are presented to study the effect of the mismatch of CTE between materials composed of the package assemblies. Bending displacements of the packages and average strains of solder balls are documented. Thermal induced displacements calculated by FEM agree quantitatively with experimental results.

• The Journal of Korean Academy of Prosthodontics
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• v.29 no.2
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• pp.67-84
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• 1991

This study was carried out to investiagate the residual stress caused by the mismatch of thermal expansion and the bond failure resistance of alloy-porcelain specimens. The thermal expansions of alloys and porcelains were measured by using a straight push-rod dilatometer. Porcelain glass transition temperatures, thermal expansion coefficients, and thermal compatibility indices were derived from length-versus-temperature curves. Strain gauges were used to experimentally determine the Young's moduli of porcelains, the residual stresses of porcelain surface, and tensile bond strengths of the specimens of simulated porcelain metal crown. The obtained results were as follows: 1. The coefficients of thermal expansion for alloys were the minimum of $13.53\mu/^{\circ}C$ and the maximum of $20.11\mu/^{\circ}C$ in the range of $100\sim600^{\circ}C$ and those for porcelains were the minimum of $7.72\mu/^{\circ}C$ and the maximum of $31.24\mu/^{\circ}C$ in the range of $100\sim500^{\circ}C$. 2. The glass transition temperature of porcelains exhibited the same value without my relation to the healing rate, and the thermal disharmony of porcelain and alloy was more affected by porcelains than by the alloys. 3. The Young's moduli of body porcelains were larger than those of opaque porcelains(P<0.01) 4. It seemed that the residual stresses of porcelain surfaces in the porcelainalloy systems were more affected by porcelains than by alleys. 5. The bond strengths of the procelain-base metal alloy systems were larger than those of the porcelain-precious metal alloy systems. The fracture strengths of porcelain surfaces showed significant difference between porcelains (P<0.05).

• Journal of the Korean Society for Nondestructive Testing
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• v.17 no.2
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• pp.89-99
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• 1997

Although discontinuously reinforced metal matrix composite(MMC) is one of the most promising materials for applications of aerospace, automotive industries, the thermal residual stresses developed in the MMC due to the mismatch in coefficients of thermal expansion between the matrix and the fiber under a temperature change has been pointed out as one of the serious problem in practical applications. There are very limited nondestructive techniques to measure the residual stress of composite materials. However, many difficulties have been reported in their applications. Therefore it is important to establish analytical model to evaluate the thermal residual stress of MMC for practical engineering application. In this study, an elastic model is developed to predict the average thermal residual stresses in the matrix and fiber of a misoriented short fiber composite. The thermal residual stresses are induced by the mismatch in the coefficient of the thermal expansion of the matrix and fiber when the composite is subjected to a uniform temperature change. The model considers two-dimensional in-plane fiber misorientation. The analytical formulation of the model is based on Eshelby's equivalent inclusion method and is unique in that it is able to account for interactions among fibers. This model is more general than past models to investigate the effect of parameters which might influence thermal residual stress in composites. The present model is to investigate the effects of fiber volume fraction, distribution type, distribution cut-off angle, and aspect ratio on thermal residual stress for in-plane fiber misorientation. Fiber volume fraction, aspect ratio, and distribution cut-off angle are shown to have more significant effects on the magnitude of the thermal residual stresses than fiber distribution type for in-plane misorientation.

• Computational Structural Engineering
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• v.8 no.1
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• pp.173-186
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• 1995

It is well known that structures constructed by bonding two or more materials and then subjected to temperature change experience thermal stress. This stress results from thermal expansion mismatch of materials. The present paper derives formulas for the stresses in a bimaterial axisymmetric disk which is subjected to a uniform temperature change. First, an approximate solution following strength-of-materials principles is developed. However, the strength-of-materials solution has difficulty in predicting both the peak value of interfacial stresses and its associated distribution. Next, a solution consistent with the theory of elasticity is developed by way of an eigenfunction expansion approach. The eigenfunction analysis is compared with finite element stress analysis results for a specific numerical example. Finite element analysis results show that the interfacial stresses are adequately predicted by eigenfunction solution. Therefore, the method developed in this paper will be useful in determination of the interfacial stress state.

• Journal of the Korean Ceramic Society
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• v.38 no.2
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• pp.158-165
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• 2001

고체산화물 연료전지용 밀봉재로서 전지 구성원과 열팽창계수가 유사하고 비젖음성 특성을 가지며 전지 작동온도에서 화학적 안정성을 갖는 밀봉유리를 개발하고자, BaO-Al$_2$O$_3$-La$_2$O$_3$-Ba$_2$O$_3$-SiO$_2$계 유리를 제조하여 조성 변화에 따른 열적 특성 변화와 접합후의 젖음성 및 반응성 등을 조사하였다. 유리망목 형성산화물인 B$_2$O$_3$와 SiO$_2$의 함량비 및 BaO의 망목 형성산화물(B$_2$O$_3$+SiO$_2$)에 대한 함량비 변화에 따른 유리의 열적 특성을 조사한 결과, 0.33~0.71의 B$_2$O$_3$/SiO$_2$함량비하에서 BaO/(B$_2$O$_3$+SiO$_2$)가 0.70일 때 유리의 열팽창계수는 106~111$\times$$10^{-7}$/K 이었으며 이때 연료전지 구성원인 YSZ(yttria stabilized zirconia)와의 열팽창 불일치(thermal expansion mismatch)가 가장 작았다. 또한 이러한 조성의 유리로부터 분말성형체를 제조하여 YSZ에 접합을 시도한 결과, 우수한 접합성 및 비젖음성을 확인할 수 있었으며, 800~8$50^{\circ}C$의 전지 작동온도에서 100시간까지 유지시에도 YSZ와의 계면반응이 일어나지 않음을 관찰할 수 있었다.