• 제목/요약/키워드: Thermal expansion coefficients

검색결과 211건 처리시간 0.023초

Ball Grid Array 63Sn-37Pb Solder joint 의 건전성 평가 (Reliability Estimation of Ball Grid Array 63Sn-37Pb Solder Joint)

  • 명노훈;이억섭;김동혁
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2004년도 추계학술대회 논문집
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    • pp.630-633
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    • 2004
  • Generally, component and FR-4 board are connected by solder joint. Because material properties of components and FR-4 board are different, component and FR-4 board show different coefficients of thermal expansion (CTE) and thus strains in component and board are different when they are heated. That is, the differences in CTE of component and FR-4 board cause the dissimilarity in shear strain and BGA solder joint s failure. The first order Taylor series expansion of the limit state function incorporating with thermal fatigue models is used in order to estimate the failure probability of solder joints under heated condition. A model based on plastic-strain rate such as the Coffin-Manson Fatigue Model is utilized in this study. The effects of random variables such as frequency, maximum temperature, and temperature variations on the failure probability of the BGA solder joint are systematically investigated by using a failure probability model with the first order reliability method(FORM).

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분자동역학(MD) 시뮬레이션을 이용한 조암광물의 열팽창 계수 산정 (Calculations of the Thermal Expansion Coefficient for Rock-Forming Minerals Using Molecular Dynamics (MD) Simulation)

  • 서용석;배규진
    • 지질공학
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    • 제11권3호
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    • pp.269-278
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    • 2001
  • MD 시뮬레이션을 이용하여 $\alpha$-quartz, 백운모, 조장석의 열팽창계수를 산정하였다. MD 시뮬레이션에서 가장 중요한 포텐셜 함수로는 부분이온성 두입자간 포텐셜을 이용하였다. 열팽창계수는 격자구조의 온도에 따라 변화를 NPT-ensemble 시뮬레이션을 통하여 계산하여 산정하였으며 그 결과를 실험결과와 비교하였다. 시뮬레이션을 통하여 산정된 열팽창계수는 시험결과와 잘 일치하고 있으며, 유효한 수준의 결과를 보이고 있다.

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LMC와 RSLMC의 열팽창 특성에 관한 연구 (A Study on Thermal Expansion of LMC and RSLMC)

  • 임홍범;최성용;최판길;윤경구
    • 산업기술연구
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    • 제24권A호
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    • pp.165-171
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    • 2004
  • Latex modification of concrete provides the material with higher flexural strength, as well as high bond strength and reduced water permeability. However, If the thermal expansion properties of overlay concrete (latex-modified concretes) are big different from that of substrate (ordinary portland cement concrete), these would cause a big interfacial stresses and result in premature failure. Therefore, the purposes of this study were to investigate thermal expansion characteristics of latex-modified concrete with cement types. The result of thermal expansion showed the coefficient of thermal expansion of concretes increased with latex inclusion. The coefficient of thermal expansion of RSLMC was a little smaller than that of LMC, which might be due to the finer cement grain, compacter internal, and stiffer properties of concrete. However, the coefficients of LMC and RSLMC were quite similar to that of ordinary cement concrete. Thus, this would not cause an interfacial stresses and will enable to ensure long-term performance of concrete bridge deck overlays.

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Thermal Strain Analysis of Composite Materials by Electronic Speckle Pattern Interferometry

  • Kim, Koung-Suk;Jang, Wan-Shik;Hong, Myung-Seak;Kang, Ki-Soo;Jung, Hyun-Chul;Kang, Young-Jun;Yang, Sung-Pil
    • Journal of Mechanical Science and Technology
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    • 제14권5호
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    • pp.477-482
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    • 2000
  • This study discusses a non-contact optical technique (electronic speckle pattern interferometry) that is well suited for thermal deformation measurement without any surface preparation and compensating process. Fiber reinforced plastics ($[0]_{16},\;[0/90]_{8S}$) were analyzed by ESPI to determine their thermal expansion coefficients. The thermal expansion coefficient of the transverse direction of a uniaxial composite is evaluated as $48.78{\times}10^{-6}(1/^{\circ}C)$. Also, the thermal expansion coefficient of the cross-ply laminate $[0/90]_{8S}$ is numerically estimated as $3.23{\times}10^{-6}(1/^{\circ}C)$ that is compared with that measured by ESPI.

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탄소섬유 복합재료의 온도변화에 대한 열팽창계수 특성 변화 규명 (Characterization of Thermal Expansion Coefficients of Carbon/Epoxy Composite for Temperature Variation)

  • 김주식;윤광준
    • Composites Research
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    • 제12권6호
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    • pp.1-7
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    • 1999
  • 본 논문은 탄소/에폭시 적층판의 온도변화에 대한 열팽창계수 변화를 예측하고 실험적으로 검증한 것으로 재료의 주축 방향에 대한 기계적 탄성 특성과 열팽창계수를 상온에서 경화온도 범위까지 측정하였으며 온도 함수로 특성화 하였다. 온도 함수로 특성화된 물성을 고전 적층판 이론에 적용함으로써 온도 변화에 대해 일반 적층각 적층판 복합재료의 열팽창계수를 예측할 수 있는 해석적 모델을 제시하였다. 이를 증명하기 위해서 일반 적층각 적층판의 열팽창계수를 측정하였으며 이를 해석적 모델로 계산된 예측치와 비교하였다. 실험적 검증 결과 온도 변화에 대한 일반 적층판의 열팽창계수의 변화가 제시된 해석적인 계산 방법을 사용함으로써 적절하게 예측될수 있음을 볼수 있다.

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열수축을 하는 필라멘트 와인딩 복합재료 관의 설계 (Design of Filament Wound Composite Tubes under Thermal Contraction)

  • 정태은;신효철
    • 대한기계학회논문집
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    • 제17권10호
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    • pp.2407-2417
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    • 1993
  • Thermal deformations and stresses due to temperature changes are the serious problems in cryogenic structures such as the torque tube in a superconducting generator, In this paper, the equations of thermal expansion coefficients expressed only by material properties and winding angles are derived for the filament wound composite tubes. The experimental results of thermal contraction of CFRP tubes are compared with those from theoretical approach. Composite tubes with optimally regulated thermal expansion coefficient are designed on the basis of the study for the torque tube in the superconducting generator with temperature distributions varying from 300K to 4.2 K. The filament winding angle of composites resisting thermal stresses properly is sought by the finite element method using layered shell elements. The results show that the composite tubes designed for the requirements in cryogenic environments can effectively cope with the thermal stress problem.

순수점성 비뉴톤유체의 물성치들에 대한 농도 및 온도의 영향 (Effects of the Concentration and the Temperature on the Thermophysical Properties of Purely-Viscous Non-Newtonian Fluid)

  • 조금남
    • 대한기계학회논문집
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    • 제18권3호
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    • pp.670-680
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    • 1994
  • The thermophysical properties of Non-Newtonian fluid as the function of the temperature and the concentration are needed in many rheological heat transfer and fluid mechanics problems. The present work investigated the effects of the concentration and the temperature on the thermophysical properties of purely-viscous Non-Newtonian fluids such as the isobaric thermal expansion coefficient, density, zero-shear-rate viscosity, and zero-shear-rate dynamic viscosity within the experimental temperature range from $25^{\circ}C$ to $55^{\circ}C$. The densities of the test fluids were determined as the function of the temperature by utilizing a reference density and the least square equation for the measured isobaric thermal expansion coefficient. As the concentration of purely-viscous Non-Newtonian fluid was increased up to 10,000 wppm, the densities were proportionally increased up to 0.4%. The zero-shear-rate viscosities of test fluids were measured before and after the measurements of the first thermal expansion coefficients and the densities of Non-Newtonian fluid. Even though they were changed up to approximately 22% due to thermal aging and cycling, they had no effects on the thermal expansion coefficients and the densities of Non-Newtonian fluid. The zero-shear-rate dynamic viscosities for purely-viscous Non-Newtonian fluids were compared with the values for distilled water. They showed the similar trend with the zero-shear-rate viscosities due to small differences in the densities for both distilled water and purely-viscous Non-Newtonian fluid.

탄소나노튜브로 강화된 에폭시 복합재료의 기계적 물성과 열팽창 계수 측정 (Measurement of Mechanical Property and Thermal Expansion Coefficient of Carbon-Nanotube-Reinforced Epoxy Composites)

  • 구민예;김정현;강희용;이교우
    • 대한기계학회논문집A
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    • 제37권5호
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    • pp.657-664
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    • 2013
  • 에폭시 수지에 다중벽 탄소나노튜브를 첨가하여 초음파 처리와 전단혼합 방법으로 분산시켜 다중벽 탄소나노튜브로 강화된 에폭시 복합재료를 제조하였으며, 에폭시 수지 내 다중벽 탄소나노튜브의 분산 적정성을 판단하고 기계적 및 열적 물성을 고찰하였다. 충전재 분산에 대한 평가를 위해 정성적인 방법으로 주사전자현미경(scanning electron microscope, SEM) 이미지를 사용하였고, 정량적인 판단을 위해 인장실험을 실시하였다. 또한, 열적 특성을 평가하기 위해 열팽창계수(coefficient of thermal expansion, CTE)를 측정하였다. 주사전자현미경 사진 및 인장 강도와 영률(Young's modulus)의 작은 편차를 통해서 다중벽 탄소나노튜브가 에폭시 수지 내에 적절히 분산되었음을 확인하였다. 충전재 함량에 따라 인장 강도와 영률이 증가함을 보였고 열팽창계수 측정에서는 열안정성 개선을 고찰하였다.

$Li_2O-Al_2O_3-SiO_2$계 소지의 Mullite 첨가에 의한 열적, 기계적 특성에 관한 연구 (Thermal, Mechanical Properties of LAS with the Addition of Mullite)

  • 최도문;유재근;이응상
    • 한국세라믹학회지
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    • 제30권5호
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    • pp.381-388
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    • 1993
  • Due to the anisotropy of thermal expansion, LAS system which has low thermal expansion property is hard to obtain a dense sintered body. Therefore, the thermal expansion coefficient and the mechanical strength were decreased. In this study, mullite, which has good mechanical properties in high temperature and comparatively low thmeral expansion coefficient, was taken as a additive in LAS system. And then, sintering, thermal, and mechanical properties were investigated. The results are follows; When mullite is added in eucryptite composition (Li2O.Al2O3.2SiO2) of LAS system, the creation of liquid phase results in the densification of sintered body and the specimen sintered at 136$0^{\circ}C$ for 2 hours shows optimum sintering condition. With the addition of mullite in eucryptite composition, mechanical strength is increased by the control of grain growth. Especially, flexual strength of EM0 specimen was about double value than the basic composition. Thermal expansion coefficients of EM0 and EM15 specimens sintered at 136$0^{\circ}C$ were -8.23$\times$10-6/$^{\circ}C$ and -4.90$\times$10-6/$^{\circ}C$ in the temperature range of RT.~80$0^{\circ}C$. As the mullite content are increased, negative thermal expansion ratios are decreased.

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63Sn-37Pb 땜납의 크리프 특성에 관한 연구 (A Study on the Creep Characteristics of Solder of 63 Sn-37Pb)

  • 이억섭;김의상
    • 한국정밀공학회지
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    • 제21권2호
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    • pp.138-144
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    • 2004
  • The initiation and the propagation of solder joint crack depend on its environmental conditions, such as high temperature creep and thermal fatigue. Creep is known to be the most important factor for the mechanical failure of solder joints in micro-electronic components and micro-systems. This is mainly caused by the different thermal expansion coefficients of the materials used in the micro-electronic packages. To determine the reliability of solder joints and consequently the electronic components, the characterization of the creep behavior of this group of materials is crucial. This paper is to apply the theory of creep into solder joints and to provide related technical information needed for evaluation of reliability of solder joint to failure. 63Sn-37Pb solder was used in this study. This paper experimentally shows a way to enhance the reliability of solder joints.