• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.214.2-214.2
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• 2013

Device performance for the 45 and 32 nm node CMOS technology requires the integration of ultralow-k materials. To lower the dielectric constant for PECVD and spin-on materials, partial replacement of the solid network with air (k=1.01) appears to be more intuitive and direct option. This can be achieved introducting of second "labile" phase during depositoin that is removed during a subsequent UV curing and annealing step. Besides, with shrinking line dimensions the resistivity of barrier films cannot meet the International Technology Roadmap for Semiconductors (ITRS) requirements. To solve this issue self-forming diffusion barriers have drawn attention for great potential technique in meeting all ITRS requirments. In this present work, we report a Cu-V alloy as a materials for the self-forming barrier process. And we investigated diffusion barrier properties of self-formed layer on low-k dielectrics with or without UV curing treatment. Cu alloy films were directly deposited onto low-k dielectrics by co-sputtering, followed by annealing at various temperatures. X-ray diffraction revealed Cu (111), Cu (200) and Cu (220) peaks for both of Cu alloys. The self-formed layers were investigated by transmission electron microscopy. In order to compare barrier properties between V-based interlayer on low-k dielectric with UV curing and interlayer on low-k dielectric without UV curing, thermal stability was measured with various heat treatment temperature. X-ray photoelectron spectroscopy analysis showed that chemical compositions of self-formed layer. The compositions of the V based self-formed barriers after annealing were strongly dominated by the O concentration in the dielectric layers.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.3
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• pp.24-37
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• 2024

Due to the thin nature of semiconductor packages, even minor thermal loads can cause significant warpage, impacting product reliability through issues like delamination or cracking. The mold curing process, which encloses the package to protect the semiconductor chip, is particularly challenging to predict due to the complex thermal, chemical, and mechanical interactions. This study proposes a cost-effective machine learning model to predict warpage in the mold curing process. We developed methods to characterize the curing degree based on time and temperature and quantify the material's mechanical properties accordingly. A Finite Element Method (FEM) simulation model was created by integrating these properties into ABAQUS UMAT to predict warpage for various design factors. Additionally, a Warpage formula was developed to estimate local warpage based on the package's stacking structure. This formula combines bending theory with thermo-chemical-mechanical properties and was validated through FEM simulation results. The study presents a method to construct a machine learning model for warpage prediction using this formula and proposes a cost-effective approach for building a training dataset by analyzing input variables and design factors. This methodology achieves over 98% prediction accuracy and reduces simulation time by 96.5%.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.6
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• pp.1080-1086
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• 2007

The aim of this paper is to establish the optimum fabrication condition of specimens, using the Vapor Deposition Polymerization Method(VDPM), which is one of modesto prepare functional organic thin films using a dry process, and to develop a thin film type humidity sensor which has good humidity sensitive characteristics. The inner part of the film became denser and roughness of the film surface eased as curing temperature increased so that thickness of the film could be made uniform. This also shows the appropriate curing temperature was $250^{\circ}C$. The basic structure of the humidity sensor is a parallel capacitor which consists of three layers of Aluminum/Polyimide/Aluminum. The result of SEM and AFM measurement shows that the thickness of PI thin films decreased and the refraction increased as curing temperature increased, which indicates that a capacitance-type humidity sensor utilizing polyimide thin film is fabricated on a glass substrate. The characteristics of fabricated samples were measured under various conditions, and the samples had linear characteristics in the range of 20-80 %RH, independent of temperature change, and low hysteresis characteristic.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2002.05a
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• pp.215-225
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• 2002

In order to enhance the thermal stability of binder materials of bonded type solid lubricants, several combinations of metal-alkoxide based sol-gel materials such as methyltrimethoxysilane(MTMOS), $titaniumisopropoxide(Ti(Opr^{j})_{4})$, $zirconiumisopropoxide(Zr(Opr^{j})_{4})$ and $aluminumbutoxide(Al(Obu^{t})_{4})$ were chemically modified by epoxy-, acrylic- and fluoro-silane compounds, respectively, in this work. Friction and wear characteristics of these hybrid ceramic materials were tested with a micro tribe-tester where a reciprocating steel ball slid on a test material, and the tribological property was also evaluated with respect to both heat-curing temperature and tile time. Test results generally showed that hybrid ceramic materials modified by epoxy-silane compounds had a low friction compared to others. And the higher heat-curing temperature and the longer heat treatment time resulted in the higher friction and the lower wear. IR spectroscopic analyses revealed that it was caused mainly by the increased metal oxide content in hybrid ceramics when the heat-curing temperature was over $320^{\circ}C$.

• Proceedings of the KIEE Conference
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• 1998.07d
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• pp.1487-1489
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• 1998

In this paper, thin films of PI were fabricated VDPM of dry processes which are easy to control the film's thickness and hard to pollute due to volatile solvents. From FT-lR, PAA thin films fabricated by VDP were changed to PI thin films by thermal curing. From SEM, AFM and Ellipsometer experimental, as the higher curing temperatures the films thickness decreases and reflectance increases. Therefore, Pl could be fabricated stable by increasing curing temperature. The relative permitivity and dissipation loss factor were 3.7 and 0.008. Also, the resistivity was about $1.05{\times}10^{15}{\Omega}cm$ at $30^{\circ}C$.

• Tribology and Lubricants
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• v.18 no.5
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• pp.324-332
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• 2002

In order to enhance the thermal stability of binder materials of bonded type solid lubricants, several metal-alkoxide based sol-gel materials such as methyltrimethoxysilane(MTMOS), titaniumisopropoxide$(Ti(Opr^i)_4),$ zirconiumisopropoxide $(Zr(Opr^i)_4)$ and aluminumbutoxide$(Al(Obu^t)_4)$ were chemically modified by epoxy-, acrylic- and fluoro-silane compounds, respectively. Friction and wear characteristics of these hybrid ceramic materials were tested with a micro tribo-tester, and evaluated with respect to both heat-curing temperature and the time. Test results generally showed that hybrid ceramic materials modified by epoxy-silane compounds had a low friction compared to others. And the higher het-curing temperature and the longer heat treatment time resulted in the higher friction and the lower wear. IR spectroscopic analyses revealed that these results were caused mainly by the increased metal oxide content in hybrid ceramics when the heat-curing temperature was over $320^{\circ}C.$

• Korean Chemical Engineering Research
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• v.58 no.1
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• pp.44-51
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• 2020

The basic catalyst 1-benzyl-3-methyl-imidazolium hexafluoroantimonate (BMH) was synthesized and analyzed by FT-IR and ¹H-NMR. A crystalized biphenyl-based epoxy was synthesized by using tetramethyl biphenol (TMBP) and epichlorohdrine. In order to consider the curing tendency of the synthesized BMH, the mass ratio was changed to 0.5, 1.0, 2.0 wt.% under heated conditions and the curing tendency was analyzed by differential scanning calorimeter (DSC). As a result, the BMH catalyst showed a fast curing result in the stepwise heating pr℃ess of the biphenol-A epoxy and the cationic polymer. From these results, the BMH catalyst showed excellent thermal stability as a potential heat curing catalyst. In addition, we considered the application possibility of epoxy molding compound (EMC) which required a skeleton structure and a high heat resistance because the synthesized biphenyl epoxy had a characteristic of rapidly lowering viscosity at a constant temperature and a rigid skeleton structure of biphenol. As a result, it was confirmed that the TMBP-based epoxy developed in this study was composed of a crystalline structure, and a curing reaction was observed with a Novolac resin at a high temperature. In the presence of a catalyst, a curing reaction was observed around 150 ℃ and thus TMBP-based epoxy was successfully applied as a raw material of EMC.

• Bulletin of the Korean Chemical Society
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• v.30 no.2
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• pp.334-338
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• 2009

Trifunctional epoxy resin triglycidyl paraaminophenol (TGPAP)/$CaCO_3$ nanocomposites were prepared using the melt blending method. The effects of nano-$CaCO_3$ content on the thermal behaviors, such as cure behavior, glass transition temperature ($T_g$), thermal stability, and the coefficient of thermal extension (CTE), were investigated by several techniques. Differential scanning calorimetry (DSC) results indicated that the cure reaction of the TGPAP epoxy resin was accelerated with the addition of nano-$CaCO_3$. When the nano-$CaCO_3$ content was increased, the $T_g$ of the TGPAP/$CaCO_3$ nanocomposites did not obviously change, whereas the crosslinking density was linearly increased. The nanocomposites showed a higher thermal stability than that of the neat epoxy resin. This result could be attributed to the increased surface contact area between the nano-$CaCO_3$ particles and the epoxy matrix, as well as the high crosslinking density in the TGPAP/$CaCO_3$ nanocomposites. The CTE of the nanocomposites in the rubbery region was significantly decreased as the nano-$CaCO_3$ content was increased.

• Elastomers and Composites
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• v.40 no.4
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• pp.284-289
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• 2005

Changes of crosslink densities of resole-cured NR composites by thermal aging were studied. The thermal aging was performed at $50-90^{\circ}C$. The crosslink density change increased with increase of the aging temperature and then decreased. Level of the crosslink density change decreased with increase of the resole content. Increase of the crosslink density by the thermal aging was explained with the formations of new crosslinks by combination reactions of pendent groups terminated by resoles and crosslinking reactions by pendent groups having methylol or o-methylene quinone intermediate. And decrease of the crosslink density by the thermal aging was explained with the dissociations of the existing crosslinks having dimethylene ether linkages.

• Textile Coloration and Finishing
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• v.4 no.3
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• pp.122-130
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• 1992

To improve the physical properties and the dyeing properties of silk, the silk fabric was treated with urea resin and reactive dyeing. The effects of urea resin concentration, pH of padding bath and curing condition were investigated in order to find optimum condition and the following results are obtained The optimum condition for the crease recovery of silk fabric was urea resin concentration of 80 g/ι, pH of 7, the curings temperature of about 135$^{\circ}C$, and the curing time of 3 minutes. The crease recovery and the thermal insulation ratio of silk fabric were increased by the above treatment. K/S increased as the adding amount of Na$_2$SO$_4$ increased, K/S, however was not affected by the adding amount of Na$_2$CO$_3$. Co1or fastness of the dyed fabrics treated with urea resin were improved slightly compared with untreated ones.