• Design & Manufacturing
• /
• v.6 no.1
• /
• pp.84-89
• /
• 2012

Silicone is recently used for LED chip encapsulment due to its good thermal stability and optical transmittance. In order to predict residual stress which causes optical briefringence and mechanical warpage of silicone, finite element analysis was conducted for both curing and cooling process during silicone molding. For analysis of curing process, a cure kinetics model was derived based on the differential scanning calorimetry(DSC) test and applied to the material properties for finite element analysis. Finite element simulation result showed that the curing as well as the cooling process should be designed carefully so as to reduce the residual stress although the cooling process plays the bigger role than curing process in determining the final residual stress state. In addition, birefringence experiment was carried out in order to observe residual stress distribution. Experimental results showed that cooling-induced birefringence was larger than curing-induced birefringence.

• Journal of the Korean Graphic Arts Communication Society
• /
• v.22 no.1
• /
• pp.39-52
• /
• 2004

A novel evaluation method is investigated for measuring the ability of acid amplification of acid amplifier. The method is based on the measurement of conductivity change by the acid generation according to UV radiation. It is found that the decrease of conductivity is caused by photopolymerization of epoxy monomer during UV curing process of ink film and the by the rate of UV curing. In this paper, the novel acid amplifiers were synthesized and measured thermal stability by means of DSC. It was found that mono-type acid amplifiers were more stable than di-type. It is possible to make the dynamical evaluation the curing rate of UV curable ink in curing process by this method.

• Proceedings of the Korean Society For Composite Materials Conference
• /
• 2003.10a
• /
• pp.1-2
• /
• 2003

While aromatic polyimides and polyamides have found widespread use as high performance polymers, the present work addressed the need for organosoluble materials through the use of a hyperbranching scheme. The $AB_2$ monomers were prepared. The $AB_2$ monomers were then polymerized via aromatic fluoride-displacement and Yamazaki reactions to afford the corresponding hydroxyl-terminated hyperbranched polyimides (HT-PAEKI) and amine-terminated hyperbranched polyamides, respectively. HT-FAEKI was then functionalized with allyl and propargyl bromides as well as epichlorohydrin to afford allyl-terminated AT-PAEKI, propargyl-terminated PT-PAEKI, and epoxy (glycidyl)-terminated ET-PAEKI, in that order. All hyperbranched poly(ether-ketone-imide)s were soluble in common organic solvents. AT-PAEKI was blended with a bisphenol-A-based bismaleimide (BFA-BMI) in various weight ratios. Thermal, rheological, and mechanical properties of these blend systems were evaluated. Two characteristic hyperbranched polyamides, which the one has para-electron donating groups to the surface amine groups and the other has para-electron withdrawing groups to the surface amine groups, were selected to compare BMI curing behaviors. The electron rich polymer displayed ordinary Michael addition type exothermic reaction, while electron deficient polymer did display unusual curing behaviors. Based on analytical data, the later system provided the strong evidences to support room temperature curing of BMI by reactive intermediates instead of reactive primary amine groups on the macromolecule surface.

• Textile Coloration and Finishing
• /
• v.29 no.1
• /
• pp.37-44
• /
• 2017

An issue of major concern in the utilization of laminated composites based epoxy resin is associated with the occurrence of delaminations or interlaminar cracks, which may be related to manufacturing defects or are induced in service by low-velocity impacts. A strong interfacial filament/brittle epoxy resin bonding can, however, be combined with the high fracture toughness of weak interfacial bonding, when the filaments are arranged to have alternate sections of shear stress. To improve this drawback of the epoxy resin, UV-thermal dual curable resin were developed. This paper presents UV-thermal dual curable resin which were prepared using epoxy acrylate oligomer, photoinitiators, a thermal-curing agent and thermoset epoxy resin. The UV curing behaviors and characteristics of UV-thermal dual curable epoxy resin were investigated using Photo-DSC, DMA and FTIR-ATR spectroscopy. The mechanical properties of UV-thermal dual curable epoxy resin impregnated CF prepreg by UV curable resin content were measured with Tensile, Flextural, ILSS and Sharpy impact test. The obtained results showed that UV curable resin content improves the epoxy toughness.

• Elastomers and Composites
• /
• v.52 no.1
• /
• pp.22-26
• /
• 2017

The thermal conductivity and the adhesive properties were measured, after synthesis of thermal conductive composite which was obtained as a result of mixing alumina or graphite with acrylic adhesive synthesized by UV polymerization. The adhesive properties of the composite were evaluated measuring the peel strength at 180 degrees, the retention, and the initial tack;the thermal conductivity was estimated using laser flash analysis. As the filler contents increased, a decrease in peel strength and initial tack and an increase in retention and thermal conductivity were observed. When compared to alumina, the adhesion of graphite showed a dramatic decrease, whereas the thermal conductivity was further enhanced. It was found out that the small size of graphite increased the mechanical interlocking between the polymer and the filler, and it was easier for graphite to come into contact with other graphite in the matrix.

• Journal of the Korea Concrete Institute
• /
• v.13 no.4
• /
• pp.305-313
• /
• 2001

Conductivity is an important thermal property which governs heat transfer in a solid medium. Generally, the determination of conductivity in concrete is very difficult, because concrete is a heterogeneous material composed of cement, water, aggregate, et cetera and time dependent material of which properties change with curing age. In this study, influencing factors on thermal conductivity of concrete are quantitatively investigated by QTM-D3, a conductivity tester developed in Japan. Then, a prediction equation of thermal conductivity of concrete is suggested from the regression analysis of test results. To consider the factors influencing thermal conductivity of concrete, mortar, and cement paste, seven testing variables (age, amount of cement, types of admixtures, amount of coarse aggregate, fine aggregate ratio, temperature, and humidity condition) of the specimens are used. According to the experimental results, the amount of coarse aggregate and humidity condition of specimen are the main factors affecting the conductivity of concrete. Meanwhile, the conductivity of mortar and cement paste is strongly affected by the amount of cement and types of admixtures. However, the curing age has minor effect on the conductivity variation. Finally, the prediction formula of concrete conductivity as a function of aggregate amount, fine aggregate ratio, specimen temperature, and humidity condition is developed.

• Bulletin of the Korean Chemical Society
• /
• v.22 no.4
• /
• pp.424-426
• /
• 2001

• Bulletin of the Korean Chemical Society
• /
• v.22 no.12
• /
• pp.1393-1396
• /
• 2001

• Composites Research
• /
• v.14 no.6
• /
• pp.47-58
• /
• 2001

This paper describes applications of cure monitoring techniques by using embedded fiber optic strain sensors, which are extrinsic Fabry-Perot interoferometric (EFPI) and/or fiber Bra99 grating (FBG) sensors, to three kinds of molding methods of autoclave, FW and RTM molding methods. In these applications, internal strain of high-temperature curing resin was monitored by EFPI sensors. From theme experimental results, it was shown that strain caused by thermal shrink at cooling stage could be measured well. In addition, several specific matters to these molding methods were considered. As thor an autoclave molding of unidirectional FRP laminates, it was confirmed that off-axis strain of unidirectional FRP could be monitored by EFPI sensors. As for FW molding using room-temperature (RT) cured resin, it was found that the strain outputs from EFPI sensors represented curing shrinkage as well as thermal strain and the convergence meant finish of cure reaction. It was also shown that this curing shrinkage should be evaluated with consideration on logarithmic change in stiffness of matrix resin. As for a RTM melding, both EFPI and FBC sensors were employed to measure strain. The results showed that FBG sensors hale also good potential for strain monitoring at cooling stage, while the non-uniform thermal residual strain of textile affected the FBG spectrum after molding. This study has proven that embedded fiber optic strain sensors hale practical ability of cure monitoring of FRP. However, development of automatic installation methods of sensors remains as a problem to be solved for applications to practical products.

• Macromolecular Research
• /
• v.13 no.2
• /
• pp.120-127
• /
• 2005

Conventional poly(methyl methacrylate) (PMMA) bone cement has been widely used as an useful biopolymeric material to fix bone using artificial prostheses. However, many patients had to be reoperated, due to the poor mechanical and thermal properties of conventional PMMA bone cement, which are derived from the presence of unreacted MMA liquid, the shrinkage and bubble formation that occur during the curing process of the bone cement, and the high curing temperature ($above 100^{\circ}C$) which has to be used. In the present study, a composite PMMA bone cement was prepared by impregnating conventional PMMA bone cement with ultra high molecular weight polyethylene (UHMWPE) powder, in order to improve its mechanical and thermal properties. The UHMWPE powder has poor adhesion with other biopolymeric materials due to the inertness of the powder surface. Therefore, the surface of the UHMWPE powder was modified with two kinds of silane coupling agent containing amino groups (3-amino propyltriethoxysilane ($TSL 8331^{R}$) and N-(2-aminoethyl)-3-(amino propyltrimethoxysilane) ($TSL 8340^{R}$)), in order to improve its bonding strength with the conventional PMMA bone cement. The tensile strengths of the composite PMMA bone cements containing $3 wt\%$ of the UHMWPE powder surface-modified with various ratios of $TSL 8331^{R}$ and $TSL 8340^{R}$ were similar or a little higher than that of the conventional PMMA bone cement. However, no significant difference in the tensile strengths between the conventional PMMA bone cement and the composite PMMA bone cements could be found. However, the curing temperatures of the composite PMMA bone cements were significantly decreased.