• Proceedings of the Korean Nuclear Society Conference
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• 2002.05a
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• pp.242-242
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• 2002

Two MIMAS MaX fuel rods base-irradiated in a commercial PWR have been reinstrumented and irradiated at a test reactor. The fabrication data for two MOX roda are characterized together with base irradiation information. Both Rods were reinstrumented to be fitted with thermocouple to measure centerline temperature of fuel. One rod was equipped with pressure transducer for rod internal pressure whereas the other with cladding elongation detector. The post irradiation examinations for various items were performed to determine fuel and cladding in-pile behavior after base irradiation. By using well characterized fabrication and re-instrumentation data and power history, the fuel performance code, COSMOS, is verified with measured in-pile and PIE information. The COMaS code shows good agreement for the cladding oxidation and creep, and fission gas release when compared with PIE dad a after base irradiaton. Based on the re-instrumention information and power history measured in-pile, the COSMOS predicts re-instrumented in-pile thermal behaviour during power up-ramp and steady operation with acceptable accuracy. The rod internal pressure is also well simulated by COSMOS code. Therfore, with all the other verification by COSMOS code up to now, it can be concluded that COSMOS fuel performance code is applicable for the design and license for MaX fuel rods up to high burnup.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.2
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• pp.245-253
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• 2010

The reliability problems of flip chip packages subjected to temperature change during the packaging process mainly occur due to mismatches in the coefficients of thermal expansion as well as features with time-dependent material properties. Resin molding compounds like glass fiber reinforced epoxy composites used as the dielectric layer in printed circuit boards (PCB) strongly exhibit viscoelastic behavior, which causes their Young's moduli to not only be temperature-dependent but also time-dependent. In this study, the stress relaxation and creep tests were used to characterize the viscoelastic properties of the glass fiber reinforced epoxy composite. Using the viscoelastic properties, finite element analysis (FEA) was employed to simulate thermal loading in the pre-baking process and predict thermal warpage. Furthermore, the effect of viscoelastic features for the major polymeric material on the dielectric layer in the PCB (the glass fiber reinforced epoxy composite) was investigated using FEA.

• Computers and Concrete
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• v.8 no.6
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• pp.647-675
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• 2011

Our ability to predict hydration behavior is becoming increasingly relevant to the concrete community as modelers begin to link material performance to the dynamics of material properties and chemistry. At early ages, the properties of concrete are changing rapidly due to chemical transformations that affect mechanical, thermal and transport responses of the composite. At later ages, the resulting, nano-, micro-, meso- and macroscopic structure generated by hydration will control the life-cycle performance of the material in the field. Ultimately, creep, shrinkage, chemical and physical durability, and all manner of mechanical response are linked to hydration. As a way to enable the modeling community to better understand hydration, a review of hydration models is presented offering insights into their mathematical origins and relationships one-to-the-other. The quest for a universal model begins in the 1920's and continues to the present, and is marked by a number of critical milestones. Unfortunately, the origins and physical interpretation of many of the most commonly used models have been lost in their overuse and the trail of citations that vaguely lead to the original manuscripts. To help restore some organization, models were sorted into four categories based primarily on their mathematical and theoretical basis: (1) mass continuity-based, (2) nucleation-based, (3) particle ensembles, and (4) complex multi-physical and simulation environments. This review provides a concise catalogue of models and in most cases enough detail to derive their mathematical form. Furthermore, classes of models are unified by linking them to their theoretical origins, thereby making their derivations and physical interpretations more transparent. Models are also used to fit experimental data so that their characteristics and ability to predict hydration calorimetry curves can be compared. A sort of evolutionary tree showing the progression of models is given along with some insights into the nature of future work yet needed to develop the next generation of cement hydration models.

• Computers and Concrete
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• v.18 no.5
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• pp.1041-1051
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• 2016

In this study, the construction of a reinforced concrete bridge pier was analyzed from durability point of view. The goal of the study is to analyze the crack iniation condition due to construction and present some recommendations for construction conditions of the reinforced concrete bridge pier. The bridge is located at the western port area of Shenzhen, where the climate is high temperature and humidity. To control the cracking of concrete, a construction simulation was carried out for a heat transfer problem as well as a thermal stress problem. A shrinkage model for heat produced due to cement hydration and a Burger constitutive model to simulate the creep effect are used. The modelling based on Femmasse(C) is verified by comparing with the testing results of a real underground abutment. For the bridge pier, the temperature and stress distribution, as well as their evolution with time are shown. To simulate the construction condition, four initial concrete temperatures ($5^{\circ}C$, $10^{\circ}C$, $15^{\circ}C$, $20^{\circ}C$) and three demoulding time tips (48h, 72h, 96h) are investigated. From the results, it is concluded that a high initial concrete temperature could result in a high extreme internal temperature, which causes the early peak temperature and the larger principle stresses. The demoulding time seems to be less important for the chosen study cases. Currently used 72 hours in the construction practice may be a reasonable choice.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.1262-1265
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• 2004

송전용량 증가를 위해 개발되어 최근 본격적으로 사용되고 있는 STACIR/AW 송전선은 송전용량의 증가에 따라 그 운전환경도 변화하여 연속사용온도의 경우, 기존 ACSR 전선의 90t에 비해 높은 $210^{\circ}C$로 규정 되어 있을 만큼 고온에서 운전되고 있다. 따라서 STACIR/AW 송전선은 이도설계와 그 운용에 있어서 운전 온도 상승에 따른 각별한 주의관리가 필요하다 실제 STACIR/AW송전선은 그 설계단계에서도 이와 같은 고온운전 환경을 고려하여 고온에서도 소정강도를 유지하는 내열 Al도체와 이도제어를 위한 낮은 열팽창 특성의 INVAR합금(Fe-35Ni계 합금)을 강선으로 하는 특화된 재료로 구성되어 있다. 그러나 이와 같은 재료 설계적 보완책에도 불구하고 실제 송전선은 전선의 자중, 철탑 간에 형성된 가설장력과 같은 다양한 응력이 고온환경에서 부하되는 복합 열화 상태에 노출되어 있고, 이것은 재료학적인 관점에서 크릴 변형 발생의 가능성을 높이고 있으나 이것에 대한 연구 또는 실험결과는 크게 미미한 실정이다. 본 연구에서는 STACIR/AW $410mm^2$ 송전선과 그 구성소재를 대상으로 $200^{\circ}C$, $300^{\circ}C$에서 장시간 열화한 후, 구성소재의 탄성계수, 열팽창계수 및 STACIR/AW전선의 크림변형 거동을 조사하여 열화에 노출된 STACIR/AW 송전선의 이도변화 거동을 규명하고자 하였다.

• Journal of Korea Foundry Society
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• v.38 no.5
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• pp.103-110
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• 2018

The effects of a heat treatment on the carbide formation behavior and mechanical properties of the cobalt-based superalloy X-45 were investigated here. Coarse primary carbides formed in the interdendritic region in the as-cast specimen, along with the precipitation of fine secondary carbides in the vicinity of the primary carbides. Most of the carbides formed in the interdendritic region were dissolved into the matrix by a solution treatment at $1274^{\circ}C$. Solutionizing at $1150^{\circ}C$ led to the dissolution of some carbides at the grain boundaries, though this also caused the precipitation of fine carbides in the vicinity of coarse primary carbides. A solution treatment followed by an aging treatment at $927^{\circ}C$ led to the precipitation of fine secondary carbides in the interdendritic region. Very fine carbides were precipitated in the dendritic region by an aging heat treatment at $927^{\circ}C$ and $982^{\circ}C$ without a solution treatment. The hardness value of the alloy solutionized at $1150^{\circ}C$ was somewhat higher than that in the as-cast condition; however, various aging treatments did not strongly influence the hardness value. The specimens as-cast and aged at $927^{\circ}C$ showed the highest hardness values, though they were not significantly affected by the aging time. The specimens aged only at $982^{\circ}C$ showed outstanding tensile and creep properties. Thermal exposure at high temperatures for 8000 hours led to the precipitation of carbide at the center of the dendrite region and an improvement of the creep rupture lifetimes.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.12
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• pp.737-742
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• 2016

We prepared five different ethylene-propylene copolymers (EPCs) for use as the encapsulant of a photovoltaic module. All of the polymers were of commercial grade from ExxonMobile company and had different ethylene/propylene compositions. The crystallization behaviors and crystal structures of the polymers were analyzed by differential scanning calorimetry and wide angle X-ray scattering diffractometry, respectively. We observed the general trend that the degree of crystallization, density and glass transition temperature of the EPCs decreased with increasing ethylene content. However, an unexpected result was also observed: the EPC with the highest ethylene content (22.2 mol. %) showed the highest melting temperature. As a result, the EPC with 22.2 mol. % of ethylene shows the highest light transmittance, due to its having the lowest degree of crystallization and highest thermal creep resistance. This abnormal result is attributed to the blocky structure prepared by ExxonMobile's special catalyst technology. It was also observed that new additional melting peaks appeared as the crystallization time increased. Using wide angle X-ray scattering diffractometry, it was confirmed that these additional peaks originated from the formation of a new crystal structure caused by annealing.

• Korean Journal of Materials Research
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• v.9 no.10
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• pp.1018-1024
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• 1999

The effects of operating temperature and stress on degradation of components in high temperature steam generator were investigated. Several 2.25CrlMo tubes which had operated over 20 years and an unused 9CrlMoVNb tube were tested. For the former samples, the amount of $\textrm{M}_{6}\textrm{C}$ carbide and its size are increased with the aging or operating time. The precipitation behavior of carbides ($\textrm{M}_{2}\textrm{O}$, $\textrm{M}_{6}\textrm{C}$) is changed with the operating temperature of the tubes. However, unused 9CrlMoVNb samples show a different carbide precipitation process due to high chromium, vanadium, and niobium contents. The amount of Cr-rich $\textrm{M}_{23}\textrm{C}_{6}$ carbide is significantly increased with aging time, but that of $\textrm{M}_{6}\textrm{C}$ type carbide is rarely changed with aging time at elevated temperatures.