• Tribology and Lubricants
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• 제19권5호
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• pp.274-279
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• 2003

$Al-SiC_{p}$ composite layer was prepared by plasma thermal spray on aluminum substrate. The homogeneously dispersed composite powder for thermal spray was fabricated by mechanical alloying with ball mill. The friction tests of the composite layers and commercial aluminum alloys for comparison were performed in the temperature range of 20∼$260^{\circ}C$ with the interval of $40^{\circ}C$ with steel counter-face. Friction coefficient was recorded during test sequence, and the microstructure of surface and debris was investigated by optical and scanning electron microscope. Friction coefficients of composite and aluminum alloys at room temperature were similar except pure aluminum. As the temperature increase, friction coefficient was increased rapidly in AC4C, AC2A. But friction coefficient of $Al-SiC_{p}$ composite was not increased so much up to $220^{\circ}C$. Consequently, the reinforcement of $SiC_{p}$ into aluminum matrix increased the stability of friction coefficient as well as wear resistance.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2009년도 춘계학술대회 논문집
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• pp.349-352
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• 2009

In this study, the relation between the performance degradation of SOFC single cell and the increase of polarization resistance for the cathode is investigated. $Pr_{0.3}Sr_{0.7}Co_{0.3}Fe_{0.7}O_3$(PSCF3737, $19.4{\times}10^{-6}K^{-1}$) and $Gd_{0.1}Ce_{0.9}O_2$ (CGO91, $12{\times}10^{-6}K^{-1}$) are used as a cathode and an electrolyte, respectively. The polarization resistance of cathode is increased due to the delamination caused by thermal expansion coefficient difference. The voltage drop with 10%/1000h decline rate occurs during long-term, when the interface between the cathode and the electrolyte is delaminated due to TEC difference.

• 한국전기전자재료학회논문지
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• 제29권6호
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• pp.365-369
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• 2016

In this paper, we fabricated Cu/Mn alloy shunt resistor with low resistance and thermal stability for use of mobile electronic devices. We designed metal alloy composed of copper (Cu) and manganese (Mn) to embody in low resistance and low TCR which are conflict each other. Cu allows high electrical conductivity and Mn serves thermal stability in this Cu/Mn alloy system. We confirmed the elemental composition of the designed metal alloy system by using energy dispersive X-ray (EDX) analysis. We obtained low resistance below $10m{\Omega}$ and low temperature coefficient of resistance (TCR) below $100ppm/^{\circ}C$ from the designed Cu/Mn alloy resistor. And in order to minimize resistance change caused by alternative frequency on circuit, shape design of the metal alloy wire is performed by rolling process. Finally, we conclude that design of the metal alloy system was successfully done by alloying Cu and 3 wt% of Mn, and the Cu/Mn alloy resistor has low resistance and thermal stability.

• 한국세라믹학회:학술대회논문집
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• 한국세라믹학회 2003년도 추계총회 및 연구발표회 초록집
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• pp.130.2-130
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• 2003

• 한국소음진동공학회논문집
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• 제22권2호
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• pp.103-114
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• 2012

Nowadays membrane material is widely used for large indoor spaces and long spaces such as traditional market. Thermal insulation and sound field control performance is considered as a main properties for design of such buildings. In this paper sound absorption and thermal insulation properties of membrane material was investigated. Firstly, normal incidence sound absorption coefficient of 10 kinds of glass wool textiles showed that sound absorption coefficient was increased in proportion of thickness and surface density of textile. Sound absorption coefficient of 4 kinds of sound absorptive inner membrane with outer membrane was tested in the reverberation chamber. Sound absorption coefficient of mid frequency range was about 0.4 ~ 0.6. Also, sound absorption coefficient was changed by the air space behind the membrane material. Secondly, sound field control performance was investigated using mock-up space. By the installation of sound absorption membrane material, reverberation time was decreased and speech intelligibility was increased. Finally, thermal resistance and room temperature in two kinds of mock-up rooms were tested, simultaneously. Results of thermal properties showed thermal insulation properties ware increased by adding inner membrane material underneath the outer membrane.

• 센서학회지
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• 제27권1호
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• pp.40-46
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• 2018

In this paper, we focus on optimization of a boron ($^{11}B$)-implanted n type Si epi substrate for obtaining near-zero temperature coefficient of resistance (TCR) at temperature range from 25 to $125^{\circ}C$. The $^{11}B$-implantation on the N type-Si epi substrate formed isolation from the rest of the N-type Si by the depletion region of a PN junction. The TCR increased as the temperature of rapid thermal anneal (RTA) was increased at the temperature range from $900^{\circ}C$ to $1000^{\circ}C$ for the $p^+$ contact with implantation at dose of $1E16/cm^2$, but sheet resistance of this film was decreased. After the optimization of anneal process condition, the TCR of $1126.7{\pm}30.3$ (ppm/K) was obtained for the $p^-$ resistor-COB package chips contained $p^+$ contact with the implantation of $5E14/cm^2$. This shows the potential of the $^{11}B$-implanted n type Si epi substrate as a resistor for pressure sensor in thermal stable environment applications..

• Carbon letters
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• 제14권2호
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• pp.105-109
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• 2013

Effects of the amount of nickel powder (Ni) in Ni-carbon fiber (CF) hybrid filler systems on the conductivity(or resistivity) and thermal coefficient of resistance (TCR) of filled high density polyethylene were studied. Increases of the resistivity and TCR with increasing Ni concentration at a given hybrid filler content were observed. Using the fiber contact model, we showed that the main role of Ni in the hybrid filler system is to decrease the interfiber contact resistance when Ni concentration is less than the threshold point. The formation of structural defects leading to reduced reinforcing effect resulted in both a reduction of strength and an increase of the coefficient of thermal expansion in the composite film; these changes are responsible for the increases of both resistivity and TCR with increasing Ni concentration in the hybrid filler system.

• 전기학회논문지
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• 제59권11호
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• pp.2038-2042
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• 2010

In this paper, we confirmed the thermal & optical properties for improving the heat transfer coefficient by changing the via hole size and in FR4 PCB with the same area. Osram 1W power LED Package (Golden Dragon) was used and the K-factor which is relative constant between LED junction temperature and forward bias was measured with power source meter(KEITHLEY 2430) to measure the thermal resistance from PCB configuration. As results, thermal resistance in metal PCB came out to the lowest as $26 [^{\circ}C/W]$ and thermal resistance in FR4 PCB without via-holes emerged as the highest as $69 [^{\circ}C/W]$. However thermal resistance of FR4 PCB could have decreased until $32[^{\circ}C/W]$ in 0.6 mm by using the via hole. Also, the luminous flux could have improved, too.

• 한국태양에너지학회 논문집
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• 제35권1호
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• pp.61-68
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• 2015

The advanced counties effort to the supplement of the zero energy buildings for the global building energy saving. In the middle of the development of passive technology, the government has to effort to the energy saving of buildings by enhanced performance of the window thermal insulation. By the method of enhanced performance of window thermal insulation, the use of vacuum double glazing saves the energy consumption in building. This glazing has low U-value(heat transmission coefficient) than normal double glazing. The vacuum glazing enhanced thermal insulation performance by vacuum space of between the glass and glass. For this vacuum glazing, pillar maintain the space between glass and glass. But this structure cause the raising the heat transmission coefficient in pillar approaching glass. This study confirmed the U-value by the test method of thermal resistance for windows and doors. Also this study confirmed the variation of heat transmission coefficient by the structure of vacuum glazing. And this study measured the surface temperature of the vacuum glazing about pillar approaching glass and vacuum space in cool chamber and hot box. That result, this study confirmed U-value of $0.422W/m^2{\cdot}K$ of vacuum glazing. Also this study confirmed U-value of $0.300{\sim}0.422W/m^2{\cdot}K$ by various the structure of vacuum glazing. And this study confirmed the heat flow in pillar approaching glass.

• 대한기계학회논문집B
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• 제35권2호
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• pp.129-135
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• 2011

얼음 제조와 잠열 저장 등에서 수직관 내부를 저온의 냉매를 흘려, 관 외부의 물을 얼리는 과정에서 내부 냉매의 비등열저항과 외부 얼음열저항이 얼음형성에 미치는 영향에 대하여 조사되었다. 상변화 및 비등 열전달 관계식들이 도입되어 얼음두께와 관련변수들이 해석되었으며, 작동유체로는 냉매 22 와 냉매 134a가 사용되었다. 이들의 건도는 0-0.8 범위이다. 해석결과, 최초 약 30 분까지는 내부냉매의 대류저항이 얼음의 전도저항에 비하여 높으나, 그 이후 얼음의 두께 증가에 따른 얼음전도저항의 현저한 증가로 인하여 냉매에 공급되는 열플럭스가 감소되므로 냉매 측 건도와 비등 및 대류열전달계수도 현저히 감소함을 알 수 있었다. 냉매 22 는 대류열전달계수가 냉매 134a 보다 높아서 단위 면적 당 더 많은 얼음을 생성할 수 있음을 알 수 있었다.