• Journal of computational fluids engineering
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• v.15 no.1
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• pp.24-30
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• 2010

A preliminary thermal analysis is performed for the optical payload system of a geostationary satellite. The optical payload considered in this paper is GOCI(Geostationary Ocean Color Imager) of COMS of Korea. The radiative and conductive thermal models are employed in order to predict thermal responses of the GOCI on the geostationary orbit. The results of this analysis are as follows: 1) the GOCI instrument thermal control is satisfactory to provide the temperatures for the GOCI performances, 2) the thermal control is defined and interfaces are validated, and 3) the entrance baffle temperature and shutter wheel motor gradient are found slightly out their specification, therefore further detailed analyses should be continued on these elements.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.9
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• pp.50-55
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• 1998

A thermal printing head is used for heat transcription printing of facsimile or printer. The thermal printing head has multilayered thin films and heaters lined up. Thermal analysis of thermal printing head is important for a design of thermal printing head. Since the heating charateristics of thermal printing head is dependent on the thermal conductivities of multilayerd material, this study made numerical analysis for three dimensional transient heat conduction in mutilayered films by the finite difference method and investigated the effect of various thermal conductivities of thin films. The results of this study will be used to design thermal printing head and select the materials for thermal printing head.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1998.10a
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• pp.77-83
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• 1998

This study is object to thermal analysis of continuous casting mold. A two-dimensional transient finite element model was developed to compute the temperature distribution and stress behavior for continuous casting mold. For thermal analysis using analysis result from FEM code. In other to thermal analysis of continuous casting mold, many variables such as casting speed, cooling condition, film coefficient, convection and load condition re considered.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1999.10a
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• pp.287-292
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• 1999

This study is object to thermal analysis of continuous casting nickel-coated mold. A two-dimensional transient finite element model was developed to compute the temperature distribution and stress behavior for continuous casting nickel-coated mold. For thermal analysis using analysis result from FEM code. In other to thermal analysis of continuous casting nickel-coated mold, many variables such as casting speed, cooling condition, film coefficient, convection and load condition are considered.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.8 no.6
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• pp.43-49
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• 1999

This study is object to thermal analysis of continuous casting mold. A two-dimensional transient finite element model was developed to compute the temperature distribution and stress behavior for continuous casting mold. For thermal analysis using analysis result from FEM code. In order to thermal analysis of continuous casting mold, many variables such as casting speed, cooling condition, film coefficient, convection and load condition are considered.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2000.10a
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• pp.200-205
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• 2000

This study is object to thermal analysis comparison of continuous casting mold. A two-dimensional transient finite element model was developed to compute the temperature distribution for continuous casting mold. For thermal analysis using analysis result from ANSYS. In other to thermal analysis of continuous casting mold, many variables such as casting speed, cooling condition, film coefficient, convection and load condition are considered.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.8 no.4
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• pp.34-40
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• 2009

The effect of frictional factors on thermal stress and deformation volume of motorcycle brake disk was studied by using a disk-on-pad type friction tester. It has an effect on the frictional factor such as applied load, sliding speed, sliding distance and number of ventilated disk hole. However, it is difficult to know the mutual relation of these factors. In this study, thermal stress and deformation volume by using design of experiment with 4 elements were investigated for thermal analysis with regression analysis. Thermal stress and thermal deformation are obtained by the application of temperature from mechanical test. From this study, the result showed that the motorcycle brake disk with ventilated hole 3 had the most excellent thermal stress and deformation volume. The regression equation had a trust rate of 95% for the prediction of thermal stress and deformation volume of motorcycle brake disk was composed.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.208-213
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• 2002

When a thermoset conductive adhesive joints are subjected to the thermal cycles, the thermal stresses are developed around the joints. Most of in-plane, hi-axial components of these residual stresses induces large tensile peel stresses and weakens adhesive joints. Also these stresses vary with thermal cycles, and result in thermal fatigue loading and debonding propagation. In this study, the thermal ratchetting effect in conductive adhesive joints are evaluated by the finite element analysis with the viscoelastic material model. In order to Investigate the relationship between thermal ratchetting and glass transition temperature, the mathematical material model has been developed experimentally by dynamic mechanical analysis. These material models are implemented to the finite element analysis with thermal loading cycles. And the stress profiles around the conductive adhesive joints are calculated. It has been observed that the thermal ratchetting occurs when the maximum temperature of thermal cycles is above the glass transition temperature. The peel and shear stress components increase as the thermal loading time increases. This will contributes to thermal fatigue fracture of the joints.

• Ceramist
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• v.22 no.4
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• pp.393-401
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• 2019

Thermal analysis means the analysis of a change in a property of a sample, which is related to an imposed temperature alteration. Measurements are usually made with increasing temperature, but isothermal measurements or measurements made with decreasing temperatures are also possible. In fact, any measuring technique can be made into a thermal analysis technique by adding thermal control. Simultaneous use of multiple techniques increases the power of thermal analysis, and modern instrumentation has permitted extensive growth of application. The basic theories of thermal analysis are well developed and some of them are explained in this paper.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.34 no.6
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• pp.42-50
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• 2006

This paper addresses the optimized thermal modeling methodology for spacecraft board level thermal analysis. A direct thermal modeling of external and internal structure of active parts which have high power dissipation is newly proposed, based on conventional plate modeling for Printed Circuit Board(PCB). The parts thermal modeling results were compared with other generic methodologies and verified by thermal vacuum test. This parts thermal modeling was directly applied to thermal analysis of CS(Communication Subsystem) board of HAUSAT-2 small satellite. As a result, it was confirmed that the parts thermal modeling can complement other conventional modeling methodologies. A parts thermal modeling is very effective for thermal control design, since the existing thermal problems can be solved at the parts level in advance.