• Journal of Dental Rehabilitation and Applied Science
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• v.33 no.2
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• pp.114-118
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• 2017

Purpose: The aim of this study was to investigate the effects of a titanium component for the zirconia abutment in the internal connection implant system on screw loosening under thermocycling conditions. Materials and Methods: Internal connection titanium abutments and external connection zirconia abutments with titanium sockets were connected respectively to screw-shaped internal connection type titanium implants with 30 Ncm tightening. These implant-screw-abutment assemblies were divided into two groups of five specimens each; titanium abutments as control and zirconia abutments with titanium sockets as experimental group. The specimens were subjected to 2,000 thermocycles in water baths at $5^{\circ}C$ and $55^{\circ}C$, with 60 seconds of immersion at each temperature. The removal torque values (RTVs) of the abutment screws of the specimen were measured before and after thermocycling. RTVs pre- and post-thermocycling were investigated in statistics. Results: There was not screw loosening identified by tactile and visual inspection in any of the specimens during or after thermocycling. The mean RTV difference for the control group and the experimental group were $-1.34{\pm}2.53Ncm$ and $-1.26{\pm}2.06Ncm$, respectively. Statistical analysis using an independent t-test revealed that no significant differences were found in the mean RTV difference of the groups (P > 0.05). Conclusion: Within the limitations of this in vitro study, the titanium socket for the zirconia abutment did not show a significant effect on screw loosening under thermal stress compared to the titanium abutment in the internal connection implant.

• Restorative Dentistry and Endodontics
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• v.21 no.1
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• pp.321-338
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• 1996

The purpose of this study was to evaluate the effect of moistening and air-drying of acid conditioned dentin and enamel on the marginal microleakage. In this study, Class V cavity were prepared on both buccal and lingual surface of sixty extracted human premolars with cementum margin. These specimens were randomly devided into three groups and three dentin adhesives(Scotchbond Multi-Purpose, All bond 2, Prisma Universal Bond 3) were applied to each group. The specimens in each group were subdevided into four groups (Wet/primed, Dry/primed, Wet/not primed, Dry/not primed) and the etched dentin and enamel surface were treated these four surface treatments prior to the placement of a bonding agent or adhesive. Wet/primed group was simply blot-dried with a damp facial tissue before primer placement ; Dry/primed group was air dried for 30 seconds before the placement of a primer ; Wet/not primed group and Dry/not primed group were not primed after blot dried and air dried for 30 seconds each group. The bonding agent and composite resin were applied for each group. All specimens were exposed to 500 cycle of thermal stress. Specimens were placed in a silver nitrate solution and then sectioned buccolingually through the center of the restoration. The dye penetrations of the specimens were observed with a stereo microscope. The statistical test were applied to the results using a one way analysis variance (ANOVA) and Duncan's multiple range test. The aspects of silver ion penetration into the resin/dentin interface were examined under scanning electron microscopy. The results were as follows. 1. In all groups, the enamel margin showed significantly lower leakage value than the cementum margin (p<0.05). 2. Regardless of various surface treatment and dentin adhesives, there was no significant difference at the enamel margins (p>0.05). 3. At the dentin margins, the leakage values of Dry/not primed group showed significantly higher than that of the other groups (p<0.05). The leakage values of Wet/primed group showed significantly lower than that of the other groups, but, there was no significant difference between Wet group and Dry group. 4. There was no significantly difference between the dentin adhesives regarding the surface treatments in all groups(p>0.05). 5. On the backscatterd scanning electron microscopy observation, the penetration of the silver ion occured at the bonding resin/dentin interface. In the Wet/primed group, resindentin hybrid zone and resin penetration into the dentin was observed. The resin tags were compactively formed to a thickness of $3\sim4{\mu}m$ at the upper part of dentinal tubules. In the Dry/primed group, the thickness of the hybrid zone and the diameter, depth of the resin tags diminished. In the Non-primed groups, the hybrid zone was not identified and few resin tag was observed. There was the gap formation in the resin/dentin interface.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.3
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• pp.275-282
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• 2014

Particle-reinforced metal matrix composites exhibit a strengthening effect due to the particle size-dependent length scale that arises from the strain gradient, and thus from the geometrically necessary dislocations between the particles and matrix that result from their CTE(Coefficient of Thermal Expansion) and elastic-plastic mismatches. In this study, the influence of the size-dependent length scale on the particle-matrix interface failure and ductile failure in the matrix was examined using finite-element punch zone modeling whereby an augmented strength was assigned around the particle. The failure behavior was observed by a parametric study, while varying the interface failure properties such as the interface strength and debonding energy with different particle sizes and volume fractions. It is shown that the two failure modes (interface failure and ductile failure in the matrix) interact with each other and are closely related to the particle size-dependent length scale; in other words, the composite with the smaller particles, which is surrounded by a denser dislocation than that with the larger particles, retards the initiation and growth of the interface and matrix failures, and also leads to a smaller amount of decrease in the flow stress during failure.

• The Korean Journal of Pharmacology
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• v.31 no.3
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• pp.323-331
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• 1995

Monocyte/macrophage infiltration is the well known initial features associated with the development of glomerular disease including non-immune mediated nephropathy. Tumor necrosis factor ${\alpha}(TNF{\alpha})$, a cytokine produced primarily by monocyte/macrophage, exhibits similar effects as observed at the initial stages and during the progression of glomerular injury. Because the mesangial cells are target cells for glomerular injury, the present study examined the effect of $TNF{\alpha}$ on glomerular mesangial cell membrane lipid peroxidation as an index of cytotoxicity attributing to $TNF{\alpha}$. Primary culture of rat mesangial cell was established by incubation of glomeruli isolated from male Sprague-Dawley rat kidneys utilizing a standard sieving method. The levels of lipid peroxides in the mesangial cells were quantitated by malondialdehyde- thiobarbituric acid adduct formation. During an 8 hour incubation at $37^{\circ}C$, $TNF{\alpha}$ at 10 to 10,000 units/ml increased the levels of lipid peroxides dose dependently. Western blot analysis demonstrated that a short thermal stress induced heat shock response and the synthesis of heat shock protein 70(hsp70) in this mesangial cells. Further, this induction of hsp 70 prevented increase of lipid peroxides in the mesangial cells exposed to $TNF{\alpha}$. These data suggest that $TNF{\alpha}-induced$ lipid peroxidation in the mesangial cells may have pathophysiological relevance to glomerular injury and prior induction of heat shock response may play a role in the cellular resistance against $TNF{\alpha}-induced$ glomerular injury.

• The korean journal of orthodontics
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• v.40 no.1
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• pp.40-49
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• 2010

Objective: The aim of this research was to evaluate the mechanical properties (MP) and degree of the phase transformation (PT) of martensitic (M-NiTi), austenitic (A-NiTi) and thermodynamic nickel-titanium wire (T-NiTi). Methods: The samples consisted of $0.016\;{\times}\;0.022$ inch M-NiTi (Nitinol Classic, NC), A-NiTi (Optimalloy, OPTI) and T-NiTi (Neo-Sentalloy, NEO). Differential scanning calorimetry (DSC), three-point bending test, X-ray diffraction (XRD), and microstructure examination were used. Statistical evaluation was undertaken using ANOVA test. Results: In DSC analysis, OPTI and NEO showed two peaks in the heating curves and one peak in the cooling curves. However, NC revealed one single broad and weak peak in the heating and cooling curves. Austenite finishing ($A_f$) temperatures were $19.7^{\circ}C$ for OPTI, $24.6^{\circ}C$ for NEO and $52.4^{\circ}C$ for NC. In the three-point bending test, residual deflection was observed for NC, OPTI and NEO. The load ranges of NC and OPTI were broader and higher than NEO. XRD and microstructure analyses showed that OPTI and NEO had a mixture of martensite and austenite at temperatures below Martensite finishing ($M_f$). NEO and OPTI showed improved MP and PT behavior than NC. Conclusions: The mechanical and thermal behaviors of NiTi wire cannot be completely explained by the expected degree of PT because of complicated martensite variants and independent PT induced by heat and stress.

• Journal of the Society of Naval Architects of Korea
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• v.38 no.1
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• pp.99-107
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• 2001

Manufacture of fishing vessel is needed the effective material for light, strength, fire and corrosion of water in order to improve durability by high-speed and fishing. These fishing vessel can be divided into FRP and AI alloys fishing vessel. FRP fishing vessel is light and effective for strength but highly ignited and susceptible to heat during the manufacturing ship by-produce noxious component for human. In the case of a scrapped ship, it cause environmental pollution. On the other hand, aluminum is a material in return for FRP and has merit of high-strength and lightness. It's more heat proof and durable than FRP and superior to prevent from corrosion. Al alloys fishing vessel development is rising as an urgent matter. But, al alloy has some defect of bad weldability, welding transformation, cracks and overcost of construction. Therefore this study is to develop the new welding joint shape solving aluminum defects and mechanical behavior. First of all, strength was compared and reviewed by analysis of plate, stiffen plate, new model simplified by using plate theory. On the base of this result, plate and new model of temperature distribution, weld residual stress and strength of tensile, compressive force were compared and reviewed by finite element computer program has been developed to deal with heat conduction and thermal elasto plastic problem. Also, new model is proved application possibility and excellent mechanic by strength comparison is established to tensile testing result.

• The Bulletin of The Korean Astronomical Society
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• v.35 no.1
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• pp.40.1-40.1
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• 2010

The Main payload of the STSAT-3 (Korea Science & Technology Satellite-3), MIRIS (Multipurpose Infra-Red Imaging System) has been developed for last 3 years by KASI, and its Flight Model (FM) is now being developed as the final stage. All optical lenses and the opto-mechanical components of the FM have been completely fabricated with slight modifications that have been made to some components based on the Engineering Qualification Model (EQM) performances. The components of the telescope have been assembled and the test results show its optical performances are acceptable for required specifications in visual wavelength (@633 nm) at room temperature. The ensuing focal plane integration and focus test will be made soon using the vacuum chamber. The MIRIS mechanical structure of the EQM has been modified to develop FM according to the performance and environment test results. The filter-wheel module in the cryostat was newly designed with Finite Element Analysis (FEM) in order to compensate for the vibration stress in the launching conditions. Surface finishing of all components were also modified to implement the thermal model for the passive cooling technique. The FM electronics design has been completed for final fabrication process. Some minor modifications of the electronics boards were made based on EQM test performances. The ground calibration tests of MIRIS FM will be made with the science grade Teledyne PICNIC IR-array.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.140-140
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• 2018

The 3D interconnect technologies have been appeared, as the density of Integrated Circuit (IC) devices increases. Through Silicon Via (TSV) process is an important technology in the 3D interconnect technologies. And the process is used to form a vertically electrical connection through silicon dies. This TSV process has some advantages that short length of interconnection, high interconnection density, low electrical resistance, and low power consumption. Because of these advantages, TSVs could improve the device performance higher. The fabrication process of TSV has several steps such as TSV etching, insulator deposition, seed layer deposition, metallization, planarization, and assembly. Among them, TSV metallization (i.e. TSV filling) was core process in the fabrication process of TSV because TSV metallization determines the performance and reliability of the TSV interconnect. TSVs were commonly filled with metals by using the simple electrochemical deposition method. However, since the aspect ratio of TSVs was become a higher, it was easy to occur voids and copper filling of TSVs became more difficult. Using some additives like an accelerator, suppressor and leveler for the void-free filling of TSVs, deposition rate of bottom could be fast whereas deposition of side walls could be inhibited. The suppressor was adsorbed surface of via easily because of its higher molecular weight than the accelerator. However, for high aspect ratio TSV fillers, the growth of the top of via can be accelerated because the suppressor is replaced by an accelerator. The substitution of the accelerator and the suppressor caused the side wall growth and defect generation. The suppressor was used as Single additive electrodeposition of TSV to overcome the constraints. At the electrochemical deposition of high aspect ratio of TSVs, the suppressor as single additive could effectively suppress the growth of the top surface and the void-free bottom-up filling became possible. Generally, copper was used to fill TSVs since its low resistivity could reduce the RC delay of the interconnection. However, because of the large Coefficients of Thermal Expansion (CTE) mismatch between silicon and copper, stress was induced to the silicon around the TSVs at the annealing process. The Keep Out Zone (KOZ), the stressed area in the silicon, could affect carrier mobility and could cause degradation of the device performance. Cobalt can be used as an alternative material because the CTE of cobalt was lower than that of copper. Therefore, using cobalt could reduce KOZ and improve device performance. In this study, high-aspect ratio TSVs were filled with cobalt using the electrochemical deposition. And the filling performance was enhanced by using the suppressor as single additive. Electrochemical analysis explains the effect of suppressor in the cobalt filling bath and the effect of filling behavior at condition such as current type was investigated.

• Journal of the Korea institute for structural maintenance and inspection
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• v.14 no.4
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• pp.141-147
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• 2010

Liquefied natural gas(LNG) is natural gas that has been converted temporarily to liquid form for ease of storage and transport it. Natural gas is the worlds cleanest burning fossil fuel and it has emerged as the environmentally preferred fuel of choice. In Korea, the demand of this has been increased since the first import from the Indonesia in 1986. LNG takes up about 1/600th the volume of natural gas in the gaseous state by cooling it to approximately $-162^{\circ}C(-260^{\circ}F)$. The reduction in volume therefore makes it much more cost efficient to transport and store it. Modern LNG storage tanks are typically the full containment type, which is a double-wall construction with reinforced concrete outer wall and a high-nickel steel inner tank, with extremely efficient insulation between the walls. The insulation will be installed to LNG outer tank for the isolation of cryogenic temperature. The insulation will be installed in the base slab, wall and at the roof. According to the insulation's arrangement, the different aspects of temperature transmission is shown around the outer tank. As the result of the thermal & stress analysis, by the installing cellular glass underneath the perlite concrete, the temperature difference is greatly reduced between the ambient temperature and inside of concrete wall, also reducing section force according to temperature load.

• Korean Journal of Materials Research
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• v.28 no.9
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• pp.528-533
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• 2018

In recent years, solar cells based on crystalline silicon(c-Si) have accounted for much of the photovoltaic industry. The recent studies have focused on fabricating c-Si solar modules with low cost and improved efficiency. Among many suggested methods, a photovoltaic module with a shingled structure that is connected to a small cut cell in series is a recent strong candidate for low-cost, high efficiency energy harvesting systems. The shingled structure increases the efficiency compared to the module with 6 inch full cells by minimizing optical and electrical losses. In this study, we propoese a new Conductive Paste (CP) to interconnect cells in a shingled module and compare it with the Electrical Conductive Adhesives (ECA) in the conventional module. Since the CP consists of a compound of tin and bismuth, the module is more economical than the module with ECA, which contains silver. Moreover, the melting point of CP is below $150^{\circ}C$, so the cells can be integrated with decreased thermal-mechanical stress. The output of the shingled PV module connected by CP is the same as that of the module with ECA. In addition, electroluminescence (EL) analysis indicates that the introduction of CP does not provoke additional cracks. Furthermore, the CP soldering connects cells without increasing ohmic losses. Thus, this study confirms that interconnection with CP can integrate cells with reduced cost in shingled c-Si PV modules.