• Electrical & Electronic Materials
• /
• v.10 no.9
• /
• pp.881-888
• /
• 1997

This study demonstrats the profiles of phosphorus ions in silicon by MeV implantation(1∼3 MeV). Implanted profiles could be measured by SIMS(Cameca 4f) and compared with simulation results(TRIM program and analytical description method only using on Pearson function). The experimental result in the peak concentration region has a little bit deviation from simulation data. By RBS and Channeling measurements the defect distribution of implanted samples could be measured and spectrum are calibrated depth with RUMP simulation By XTEM measurement the thickness of defect zone also could be measured. Finally thermal annealing for the electrical activation of implanted ions carried out by RTA(rapid thermal annealing). The concentration-depth profiles after heat treatment was measured by SR(spreading resistance)-method.

• Proceedings of the SAREK Conference
• /
• 2008.06a
• /
• pp.877-882
• /
• 2008

The purpose of this study is to analyze the characteristics of outdoor thermal environment of flat-type apartment houses and tower-type apartment houses in summer by numerical simulation. After inputting a building condition at CAD, we calculated the surface temperature for two apartments by using the numerical simulation of a clear sky day in summer in Seoul. The results indicated that the variation in Heat Island Potential(HIP) of tow apartments were not only in the day but also in the night. According to form of apartment the flat-type apartment houses appeared $1.3^{\circ}C$ more highly tower-type apartment houses.

• Proceedings of the SAREK Conference
• /
• 2006.06a
• /
• pp.1069-1074
• /
• 2006

Heat loss by window in building occupies about 1/4 of energy amount used building. Therefore, high thermal insulation of windows system can speak as very important part in save energy of building. in this research, After select most suitable frame design and Glazing system for high thermal insulation of windows, execute simulation of mixing frame and Glazing System. Also, manufacture windows with the result and execute verification experiment, with verified simulation, this research evaluated thermal insulation performance of window by Glazing System's change.

• Proceedings of the KSME Conference
• /
• 2007.05b
• /
• pp.2182-2187
• /
• 2007

The relative contributions of phonon and electron to the thermal conductivity of silicon film with varying doping density are evaluated from the modified electron-phonon interaction model, which is applicable to the micro/nanoscale simulation of energy transport between energy carriers. The thermal conductivities of intrinsic silicon layer thicknesses from 20 nm to 500 nm are calculated and extended to the variation in n-type doping densities from 1.0 ${\times}$ $10^{18}$ to 5.0 ${\times}$ $10^{20}$ $cm^{-3}$, which agree well with the experimental data and theoretical model. From simulation results, the phonon and electron contributions to thermal conductivity are extracted. The electron contribution in the silicon is found to be not negligible above $10^{19}$ $cm^{-3}$, which can be classified as semimetal or metal by the value of its electrical resistivity at room temperature. The thermal conductivity due to electron is about 57.2% of the total thermal conductivity at doping concentration 5.0 ${\times}$ $10^{20}$ $cm^{-3}$ and silicon film thickness 100 nm.

• Journal of the Optical Society of Korea
• /
• v.20 no.2
• /
• pp.251-256
• /
• 2016

The prediction of thermal effects in lithography projection objective plays a significant role in the real-time dynamic compensation of thermal aberrations. For the illuminated lithography projection objective, this paper applies finite element analysis to get the temperature distribution, surface deformation and stress data. To improve the efficiency, a temperature distribution function model is proposed to use for the simulation of thermal aberrations with the help of optical analysis software CODE V. SigFit is approved integrated optomechanical analysis software with the feature of calculating OPD effects due to temperature change, and it is utilized to prove the validation of the temperature distribution function. Results show that the impact of surface deformation and stress is negligible compared with the refractive index change; astigmatisms and 4-foil aberrations dominate in the thermal aberration, about 1.7 λ and 0.45 λ. The system takes about one hour to reach thermal equilibrium and the contrast of the imaging of dense lines get worse as time goes on.

• Proceedings of the Korean Society of Propulsion Engineers Conference
• /
• 2009.05a
• /
• pp.311-314
• /
• 2009

A two-dimensional thermal response and ablation simulation code for predicting charring material ablation and shape change on solid rocket nozzle is presented. For closing the problem of thermal analysis, Arrhenius' equation and Zvyagin's ablation model are used. The moving boundary problem and endothermic reaction in thermal decomposition are solved by rezoning and effective specific heat method. For simulation of complicated thermal protection systems, this method is integrated with a three-dimensional finite-element thermal and structure analysis code through continuity of temperature and heat flux.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2001.09a
• /
• pp.121-145
• /
• 2001

Chip Size Packages (CSP) are now widely used in high speed DRAM. The major driving farce of CSP development is its superior electrical performance than that of conventional package. However, the power dissipation of high speed DRAM like DDR or RAMBUS DRAM chip reaches up to near 2W. This fact makes the thermal management methods in DRAM package be more carefully considered. In this study, the thermal performances of 3 type CSPs named $\mu-BGA$^{TM}$$ $UltraCSP^{TM}$ and OmegaCSP$^{TM}$ were measured under the JEDEC specifications and their thermal characteristics were of a simulation model utilizing CFD and FEM code. The results show that there is a good agreement between the simulation and measurement within Max. 10% of $\circledM_{ja}$. And they show the wafer level CSPs have a superior thermal performance than that of $\mu-BGA.$ Especially the analysis results show that the thermal performance of wafer level CSPs are excellent fur modulo level in real operational mode without any heat sink.

• Journal of the Korean Solar Energy Society
• /
• v.35 no.1
• /
• pp.1-8
• /
• 2015

In the present study, the effects of the heat spreader thickness and the heat sink size on the thermal performance of a cooling device for a concentrating photovoltaic (CPV) module were numerically investigated. Numerical simulation was conducted by using the simulation tool ICEPAK, commercial software based on the finite volume method. Numerical results were validated by comparing the existing experimental data. The thermal performance of a cooling device, which consisted of a heat spreader and a natural convective heat sink, was evaluated with varying the heat spreader thickness and the heat sink size. The geometric configuration of the natural convective heat sink, such as the fin height, the fin spacing, and the fin thickness, was optimized by using the existing correlation. The numerical results showed that the thermal performance of the cooling device increased as the heat spreader thickness or the heat sink size increased. Also, it was found that the spreading thermal resistance plays an important role in the thermal performance of the cooling device which has the localized heat source.

• Nuclear Engineering and Technology
• /
• v.54 no.10
• /
• pp.3928-3942
• /
• 2022

Thermal striping is a complex thermal-hydraulic phenomenon caused by fluid temperature fluctuations that can also cause high-cycle thermal fatigue to the structural wall of sodium-cooled fast reactors (SFRs). Numerical simulations using large-eddy simulation (LES) were performed to predict and evaluate the characteristics of the temperature fluctuations related to thermal striping in the upper internal structure (UIS) of the prototype generation-IV sodium-cooled fast reactor (PGSFR). Specific monitoring points were established for the fluid region near the control rod driving mechanism (CRDM) guide tubes, CRDM guide tube walls, and UIS support plates, and the normalized mean and fluctuating temperatures were investigated at these points. It was found that the location of the maximum amplitude of the temperature fluctuations in the UIS was the lowest end of the inner wall of the CRDM guide tube, and the maximum value of the normalized fluctuating temperatures was 17.2%. The frequency of the maximum temperature fluctuation on the CRDM guide tube walls, which is an important factor in thermal striping, was also analyzed using the fast Fourier transform analysis. These results can be used for the structural integrity evaluation of the UIS in SFR.

• Journal of the Korean Society for Aeronautical & Space Sciences
• /
• v.33 no.11
• /
• pp.106-114
• /
• 2005

This study addresses space simulation test results and thermal modelling verification of HAUSAT-2 nanosatellite STM (Structural-Thermal Model). The thermal modelling of the HAUSAT-2 has been modified in accordance with test results. Thermal analysis results were repeatedly compared with test results for modified thermal modelling. It is verified that the analysis results for modified thermal modelling agree well with test results. Some surface heaters were implemented to simulate solar illumination for HAUSAT-2 Thermal Vacuum/Balance Test. A low-cost and effective thermal test methodology, which is applicable to ultra-small satellite system, was proposed and verified by test results in this study.