• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.10
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• pp.894-900
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• 2006

This paper reports the fabrication and characterization of $32{\times}32$ thermal cantilever array for nano-scaled memory device applications. The $32{\times}32$ thermal cantilever array with integrated tip heater has been fabricated with micro-electro-mechanical systems(MEMS) technology on silicon on insulator(SOI) wafer using 9 photo masking steps. All of single-level cantilevers(1,024 bits) have a p-n junction diode in order to eliminate any electrical cross-talk between adjacent cantilevers. Nonlinear electrical characteristic of fabricated thermal cantilever shows its own thermal heating mechanism. In addition, n-channel high-voltage MOSFET device is integrated on a wafer for embedding driver circuitry.

• Proceedings of the Korean Vacuum Society Conference
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• 1997.02a
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• pp.152-153
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• 1997

• Journal of the Institute of Electronics Engineers of Korea TE
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• v.39 no.1
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• pp.31-36
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• 2002

Low energy boron ions were implanted into the preamorphized and crystalline silicon substrates to form 0.2${\mu}m$ $p^+-n$ junctions. The rapid thermal annealing(RTA) was used to annihilate the crystal defects due to implantation and to activate the implanted boron ions, and the furnace annealing was employed to reflow the BPSG(bolo-phosphosilicate glass). The implantation conditions for Gepreamorphization were the energy of 45keV and the dose of 3$\times$1014cm-2. BF2 ions employed as a p-type dopant were implanted with the energy of 20keV and the dose of 2$\times$1015cm-2. The thermal conditions of RTA and furnace annealing were $1000^{\circ}C$/10sec and $850^{\circ}C$/40min, respectively. The junction depths were measured by SIMS and ASR techniques, and the 4-point probe was used to measure the sheet resistances. The electrical characteristics were analyzed via the leakage currents of the fabricated diodes. The single thermal processing with RTA produced shallow junctions of good qualities, and the thermal treatment sequence of furnace anneal and RTA yielded better junction characteristics than that of RTA and furnace anneal.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.35 no.11
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• pp.1133-1137
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• 2011

A novel technique for the fabrication of a glass micropipette-based thermal sensor was developed utilizing inexpensive thermocouple materials. Thermal fluctuation with a resolution of ${\pm}0.002$ K was measured using the fabricated thermal probe. The sensors comprise unleaded low-melting point solder alloy (Sn) as a core metal inside a borosilicate glass pipette coated with a thin film of Ni, creating a thermocouple junction at the tip. The sensor was calibrated using a thermally insulated calibration chamber, the temperature of which can be controlled with a precision of ${\pm}0.1$ K and the thermoelectric power (Seebeck coefficient) of the sensor was recorded from 8.46 to $8.86{\mu}V$/K. The sensor we have produced is both cost-effective and reliable for thermal conductivity measurements of micro-electromechanical systems (MEMS) and biological temperature sensing at the micron level.

• Journal of the Korean Society for Nondestructive Testing
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• v.36 no.3
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• pp.202-210
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• 2016

A thermal barrier coating (TBC) has been widely applied to machine components working under high temperature as a thermal insulator owing to its critical financial and safety benefits to the industry. However, the nondestructive evaluation of TBC damage is not easy since sensing of the microscopic change that occurs on the TBC is required during an evaluation. We designed an eddy current probe for evaluating damage on a TBC based on the finite element method (FEM) and validated its performance through an experiment. An FEM analysis predicted the sensitivity of the probe, showing that impedance change increases as the TBC thermally degrades. In addition, the effect of the magnetic shield concentrating magnetic flux density was also observed. Finally, experimental validation showed good agreement with the simulation result.

• Korean Journal of Metals and Materials
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• v.46 no.3
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• pp.159-168
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• 2008

Thermally-evaporated 10 nm-Ni/1 nm-Ru/(30 nm or 70 nm-poly)Si structures were fabricated in order to investigate the thermal stability of Ru-inserted nickel monosilicide. The silicide samples underwent rapid thermal anne aling at $300{\sim}1,100^{\circ}C$ for 40 seconds. Silicides suitable for the salicide process were formed on the top of the single crystal and polycrystalline silicon substrates mimicking actives and gates. The sheet resistance was measured using a four-point probe. High resolution X-ray diffraction and Auger depth profiling were used for phase and chemical composition analysis, respectively. Transmission electron microscope and scanning probe microscope(SPM) were used to determine the cross-sectional structure and surface roughness. The silicide, which formed on single crystal silicon and 30 nm polysilicon substrate, could defer the transformation of $Ni_2Si $i and $NiSi_2 $, and was stable at temperatures up to $1,100^{\circ}C$ and $1,100^{\circ}C$, respectively. Regarding microstructure, the nano-size NiSi preferred phase was observed on single crystalline Si substrate, and agglomerate phase was shown on 30 nm-thick polycrystalline Si substrate, respectively. The silicide, formed on 70 nm polysilicon substrate, showed high resistance at temperatures >$700^{\circ}C$ caused by mixed microstructure. Through SPM analysis, we confirmed that the surface roughness increased abruptly on single crystal Si substrate while not changed on polycrystalline substrate. The Ru-inserted nickel monosilicide could maintain a low resistance in wide temperature range and is considered suitable for the nano-thick silicide process.

• Journal of the Korean Burn Society
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• v.24 no.2
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• pp.43-45
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• 2021

Magnetic Resonance Image (MRI) has been used as a safe, conventional and harmless diagnostic tool. However, thermal injuries have frequently been reported during MRI scanning due to the heat generated by the reaction with the magnetic field. It is recommended that metal-containing monitoring devices such as pulse oximetry and ECG monitoring leads should be removed prior to the start of the MRI scan, but these monitoring devices are inevitably placed in children or patients in the intensive care unit who have low compliance with the scan. Since the interaction between the metal probe or wire loop of pulse oximetry and the magnetic field can result in high thermal conduction, full-thickness burn can occur over the entire body surface during the MRI examination. Several cases of thermal burns from pulse oximetry on the fingers have been reported. However, we present a case of a full-thickness burn arising left earlobe in a 2-month-old child caused by the high conduction heat from pulse oximetry metal probe.

• Journal of Power System Engineering
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• v.10 no.2
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• pp.93-98
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• 2006

Metal matrix composites(MMCs) reinforced with ceramic particulates are receiving increasing attention because their high specific strength, low coefficient of thermal expansion and excellent wear resistance. Especially, Al-based composites(AMCs) have been widely applied for the aerospace and automotive industries. Such composites are mainly fabricated by the cast, powder metallurgy and infiltration process. In this study, SiC particulate reinforced Al-based composites were fabricated by thermal spray process and their wear behavior were investigated. Composites with different spray parameter were fabricated by using flame spray apparatus. Microstructure and wear behavior of the composites were observed by scanning electron microscope(SEM) and electron probe micro-analysis(EPMA).

• Proceedings of the KSME Conference
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• 2000.04b
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• pp.138-143
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• 2000

A new method of measuring the thermal diffusivity of solid material at room temperature with photothermal displacement method is proposed. The influence of the parameters on phase lag was studied. From the minimum position of phase of measured deflection with respect to the pump beam the thermal diffusivity of the materials can be obtained. The minimum position of phase is determined using multiparameter least-square regression fitting. The experimental values for different samples obtained by applying new method are in good agreement with the literature values.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.10a
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• pp.214-219
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• 2001

One of the major limitations of productivity and quality in metal cutting is the machining accuracy of machine tools. The machining accuracy is affected by geometric errors, thermally-induced errors, and the deterioration of the machine tools. Geometric and thermal errors of machine tools should be measured and compensated to manufacture high quality products. In metal cutting, the machining accuracy is more affected by thermal errors than by geometric errors. In this study, the compensation device and temperature-based algorithm have been presented in order to compensate thermal error of machine tools under the real-time. The thermal error is modeled by means of angularity errors of a column and thermal drift error of the spindle unit which are measured by the touch probe unit with a star type styluses, a designed spherical ball artifact, and five gap sensors. In order to compensate thermal characteristics under several operating conditions, experiments performed with five gap sensors and manufactured compensation device on the horizontal machining center.