• Proceedings of the KIEE Conference
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• 1999.07d
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• pp.1830-1832
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• 1999

고에너지 이온주입(1)에 기인한 격자 손상 발생 및 열처리에 따라 이들의 회복이 어느정도 가능한지에 대하여 측정 및 분석방법을 통하여 조사하였다. 그리고 본 실험에서는 이온주입시 형성되는 빈자리 결함(Vacancy defect)과 격자간 결함(interstitial defect)의 재결할(recombination)을 이용 점결합(point defect)를 감소 시킬 수 있는 effective RTA조건을 설정하여 well 특성을 개선하고자 하였다. 8inch p-type Si(100)기판에 pad oxide 100A을 형성한 후 NMOS 형성하기 위해 vtn${\sim}$p-well과 PMOS 형성을 위해 vtp$\sim$n-well을 이온주입 하였다. Mev damage anneal은 RTA(2)(Rapid Thermal Anneal)로 $1000\sim1150C$ 온도에서 $15\sim60$초간 spilt 하여 실험후 suprem-4 simulation data를 이용하여 실제 SIMS측정 분석결과를 비교하였으며 이온주입에 의해 발생된 격자손상이 열처리후 damage 정도를 알아보기 위해 T.W(Therma-Wave)을 이용하였으며 열처리후 면저항값은 4-point probe를 사용하였다. 이온주입후 열처리 전,후에 따른 불순물 분포를 SIMS(Secondary ion Mass Spectrometry)를 이용하여 살펴보았다. SIMS 결과로는 열처리 온도 및 시간의 증가에 따라서 dopant확산 및 활성화는 큰차이는 보이지 않고 오히려 감소하는 경향을 볼 수 있으며 또한 접합깊이와 농도가 약간 낮아지는 것을 볼 수 있었다. 결점(defect)을 감소시키기 위해서 diffusivity가 빠른 임계온도영역($1150^{\circ}C$-60sec)에서 RTA를 실시하여 dopant확산을 억제하고 점결점(point defect)의 재결합(recombination)을 이용하여 전위 (dislocation)밀도를 감소시켜 이온주입 Damage 및 면저항을 감소 시켰다. 이와 같은 특성을 process simulation(3)(silvaco)을 통하여 비교검토 하였다.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Korean Journal of Materials Research
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• v.20 no.11
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• pp.611-616
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• 2010

A cobalt oxide - tin oxide nanocomposite based gas sensor on an $SiO_2$ substrate was fabricated. Granular thin film of tin oxide was formed by a rheotaxial growth and thermal oxidation method using dc magnetron sputtering of Sn. Nano particles of cobalt oxide were spin-coated on the tin oxide. The cobalt oxide nanoparticles were synthesized by polymer-assisted deposition method, which is a simple cost-effective versatile synthesis method for various metal oxides. The thickness of the film can be controlled over a wide range of thicknesses. The composite structures thus formed were characterized in terms of morphology and gas sensing properties for reduction gas of $H_2$. The composites showed a highest response of 240% at $250^{\circ}C$ upon exposure to 4% $H_2$. This response is higher than those observed in pure $SnO_2$ (90%) and $Co_3O_4$ (70%) thin films. The improved response with the composite structure may be related to the additional formation of electrically active defects at the interfaces. The composite sensor shows a very fast response and good reproducibility.

• Polymer(Korea)
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• v.34 no.3
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• pp.226-236
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• 2010

UV irradiated acrylic pressure sensitive adhesives(PSAs) are prepared to be used for thermal pad in plasma display panel(PDP). The effect of the chemical structure of side-chain in comonomer and of crosslinking agent on wet-out property of acrylic PSAs in wide temperature range were investigated. The correlationship between viscoelastic behavior and adhesion properties, such as tack and peel strength, was also studied. The experimental results supported that wet-out and adhesion properties of acrylic PSAs were enhanced inversely proportional to side-chain length of comonomer in wide temperature range. The peel energy clearly increased in acrylic PSAs prepared by using di(ethylene glycol) dimethylacrylate (DEGDMA) for crosslinking agent. The results might be due to the difference in the glass transition temperature and viscoelastic behavior of acrylic PSAs.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.31A no.10
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• pp.87-93
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• 1994

Ohmic contacts between Au and p-HgHg_{0.7}Cd_{0.3}Te$ with low specific contact resistance have been obtained. The contact region of the wafer is first pre-heated for 5 seconds in a rapid thermal processing equipment. The temperature reaches a maximum value of about 200$^{\circ}C$ at the end of the 5 seconds. Next, a thin Au film is formed on the contact region by immersing the sample in AuCl$_{3}$ solution. the sample is then post-annealed in the same condition as the pre-heating after Pb/In pad metals are deposited on the electroless Au contacts. The specific contact resistance measured by transmission line model is 5${\times}10^{-3}{\Omega}cm^{2}$ at 80K. RBS and differential Hall measurement data suggest that the above low resistance ohmic contact is ascribed to surface traps and increased gold diffusion rate.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2012.10a
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• pp.247-250
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• 2012

This paper describes a DC-DC Boost converter for Thermoelectric Energy Harvesting. The designed converter boosts the $V_{DD}$ through a start-up block from a low output voltage of thermoelectric devices and the boosted $V_{DD}$ is used to operate the internal block circuits. When $V_{DD}$ reaches a predefined value, a detector circuit makes the start-up block turn off for minimizing current consumption. The final boosted $V_{OUT}$ is achieved by alternately operating the DC-DC converter for $V_{DD}$ and the other converter for final output $V_{OUT}$ according to the comparator output. Simulation results shows that the designed converter outputs 2.8V from an input voltage of 200mV. The area of the chip designed using a 0.35um CMOS process is $1.52mm{\times}0.95mm$ including pads.

• Korean Journal of Materials Research
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• v.27 no.3
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• pp.132-136
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• 2017

We synthesized potassium hexatitanate, ($K_2Ti_6O_{13}$, PT6), with a non-fibrous shape, by acid leaching and subsequent thermal treatment of potassium tetratitanate ($K_2Ti_4O_9$, PT4), with layered crystal structure. By controlling nucleation and growth of PT4 crystals, we obtained splinter-type crystals of PT6 with increased width and reduced thickness. The optimal holding temperature for the layered PT4 was found to be ${\sim}920^{\circ}C$. The length and width of the PT4 crystals were increased when the nucleation and growth time were increased. After a proton exchange reaction using aqueous 0.3 M HCl solution, and subsequent heat treatment at $850^{\circ}C$, the PT4 crystal transformed into splinter-type PT6 crystals. The frictional characteristics of the friction materials show that as the particle size of PT6 increases, the coefficient of friction (COF) and wear amounts of both the friction materials and counter disc increase.

• Journal of the Korean Society of Clothing and Textiles
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• v.17 no.4
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• pp.577-586
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• 1993

Pesticide protective clothing has not been frequently worn due to its lack of thermal comfort. It is important to develop fabrics which can allow the wearer to work in comfort. One of the possible way to achieve the goal is to produce fabrics with a water- and oil-repellent finish which would resist pesticide penetration but maintain some breathability. The purpose of this study were to evaluate the pesticide barrier properties of untreated and water- and oil-repellent finished nonwoven fabrics. Three types of nonwoven fabrics(Tyvek, Sontara and Kimlon) were used as test specimens. By pad-dry-cure method, each of the specimen was treated with fluorocarbon. The pesticide barrier properties (amount of pesticide penetration and residue) were measured by the gas chromatography. The performance properties of untreated and treated specimens were evaluated with respects to water pepellency(KS K 0590), oil repellency(AATCC 118), water resistance(KS K 0591, AATCC 42), water vapor transmission (KS A 1013) and air permeability(KS K 0570). The results of this study were as follows : 1) The untreated Sontara showed much more amount of pesticide penetration than untreated Tyvek and Kimlon, while the treated Sontara showed little amount of pesticide penetration. 2) After laundering, the amount of pesticide residue in the untreated and treated Sontara was less than that in Tyvek and in Kimlon. 3) Water- and oil-repellent finish improved water repellency, oil repellency, and water resistance of specimens. 4) The untreated Sontara and Kimlon showed higher water vapor transmission and air permeability than untreated Tyvek. Water vapor transmission and air permeability of treated specimen decreased compared to those of untreated.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.16 no.11
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• pp.1051-1059
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• 2004

Two phase thermosyphone loop for electronics cooling are designed and manufactured to test its performance under the partial load and low environment temperature conditions. The thermosyphone device has six evaporators connected parallel for the purpose of cooling six power amplifier units (PAU) independently. The heater modules for simulating PAUs are adhered with thermal pad to the evaporator plates to reduce the contact resistance. There are unbalanced distributions of liquid refrigerant in the differently heated evaporators due to the vapor pressure difference. To reduce the vapor pressure differences caused by partial heating, two evaporators are connected each other using the copper tube. The pressure regulation tube successfully reduces these unbalances and it is good candidates for a field distributed systems. Under the low environment temperature operating condition, such as $-30^{\circ}C$, there may be unexpected subcooling in condenser. It leads the very low saturation pressure, and under this condition there exists explosive boiling in evaporator. The abrupt pressure rise due to the explosive boiling inhibits the supplement of liquid refrigerant to the evaporator for continuous cooling. Finally the cooling cycle will be broken. For the normal circulation of refrigerant there may be an optimum cooling air flow rate in condenser to adjust the given heat load.