• Tribology and Lubricants
• /
• v.33 no.3
• /
• pp.112-118
• /
• 2017

Tilting pad journal bearings(TPJBs) are widely used for high speed rotating machinery owing to their rotordynamic stability and thermal management feature. With increase in the rotating speed of such machinery, an increasingly important aspect of TPJB design is the prediction of their thermal behaviors. Researchers have conducted detailed investigations in the last two decades, which provided design tools for the TPJBs. Based on these previous studies, this paper presents a thermohydrodynamic(THD) analysis model for TPJBs. To calculate pressure distribution, we solve the generalized Reynolds equation and to predict the lubricant temperature, we solve the 3D energy equation. We employ the oil mixing theory to calculate pad inlet temperature; further, to consider heat conduction via the pad, we solve the heat conduction equation for the pads. We assume the shaft temperature as the averaged oil film temperature and apply natural convection boundary conditions to the pad side and back surfaces. To validate the analysis model, we compare the predicted pad temperatures with those from previous research. The results show good agreement with previous research. In addition, we conduct parametric studies on a TPJB which was used in a gas turbine simulator system. The predicted results show that film temperature largely depends on the rotating speed and oil supply condition.

• Tribology and Lubricants
• /
• v.14 no.1
• /
• pp.28-36
• /
• 1998

This paper presents the thermal behaviours of a solid type disk brake for a high-speed train. The thermal behaviours of a brake disk with 50mm thickness shows good performance compared with 45mm thickness of a disk because of a high specific heat capacity. The FEM results show that the thickness of the disk with a same weight of the brake disk should be increased for a good flexibility of the contact thermal problems. Therefore, the ratio between the pad and disk in diameter may be reduced and the thickness of a disk increased.

• Proceedings of the KSR Conference
• /
• 2002.10a
• /
• pp.654-659
• /
• 2002

Continuous Welded rail(C.W.R.) tracks has many advantages over the conventional jointed rail track. Due to the elimination of rail joints for thermal expantion, however it many cause the track to be suddenly bucklled by thermal loads. The present study investigates the influences of Pad-fastner on the Thermal buckling behavior of C.W.R. Parametric studies are performed to evaluate the effects of the individual parameters on the upper and lower critical bucklig temperature.

• The Journal of the Korea institute of electronic communication sciences
• /
• v.9 no.12
• /
• pp.1397-1404
• /
• 2014

Grab cranes are used for multi-purpose when the sand and soil are deposited into harbor wharf or the undersea construction is performed. Among the components of crane grab, the wire drum and disc brake pad are key expendables and have disadvantages that lot of heat is generated and very expensive when replacing them. In this study, the thermal image analysis for the disc brake, which works with wire drum of the crane is suggested. The suggested system performs the pad thermal diagnosis through the thermal image using the characteristics that the disc and pad surface temperatures are distributed abnormally before the brake failure and the disc pad damage. Therefore, the damage by the failure can be prevented by discovering the abnormality of the machine parts before failure and the life cycle of the pad and the cost can be extended and saved by operating the crane performing constant checkup for the overload.

• Journal of Welding and Joining
• /
• v.17 no.1
• /
• pp.124-132
• /
• 1999

Thermal fatigue strength of the solder joints is the most critical issue for TSOP(Thin Small Outline Package) because the leads of this package are extremely short and thermal deformation cannot be absorbed by the deflection of the lead. And the TSOP body can be subject to early fatigue failures in thermal cycle environments. This paper was discussed distribution of thermal stresses at near the joint between silicon chip and die pad and investigated their reliability of solder joints of TSOP with 42 alloy clad lead frame on printed circuit board through FEM and 3 different thermal cycling tests. It has been found that the stress concentration around the encapsulated edge structure for internal crack between the silicon chip and Cu alloy die pad. And using 42 alloy clad, The reliability of TSOP body was improved. In case of using 42 alloy clad die pad(t=0.03mm). $$\sigma$_{VMmax}$ is 69Mpa. It is showed that 15% improvement of the strength in the TSOP body in comparison with using Cu alloy die pad $($\sigma$_{VMmax}$=81MPa). In solder joint of TSOP, the maximum equivalent plastic strain and Von Mises stress concentrate on the heel of solder fillet and crack was initiated in it's region and propagated through the interface between lead and solder. Finally, the modified Manson-Coffin equation and relationship of the ratio of $N_{f}$ to nest(η) and cumulative fracture probability(f) with respect to the deviations of the 50% fracture probability life $(N_{f 50%})$ were achieved.

• Tribology and Lubricants
• /
• v.32 no.1
• /
• pp.1-8
• /
• 2016

This paper focuses on the thermal deformation induced preload change in the tilting pad journal bearing, using a three-dimensional (3D) thermo-hydro-dynamic (THD) approach. Preload is considered as a critical factor in designing the tilting pad journal bearing. The initial preload measured under nil external load and nil thermal gradient is influenced by two factors, namely, the thermal deformation and elastic deformation. Thermal deformation is due to a temperature distribution in the bearing pads, whereas the elastic deformation is due to fluid forces acting on the pads. This study focuses on the changes induced in preload and film clearance due to thermal deformation. The generalized Reynolds equation is used to evaluate the force of the fluid and the 3D energy equation is used to calculate the temperature of the lubricant. The abovementioned equations are combined by establishing a relationship between viscosity and temperature. The heat transfer within the bearing pads, the lubricant, and the spinning journal is calculated using the heat flux boundary condition. The 3D Finite Element Method (FEM) is used in modeling the (1) heat conduction in the spinning journal and bearing pads, (2) thermal gradient induced thermal distortion of the spinning journal and pads, and (3) viscous shearing, and heat conduction and convection in a thin film. This evaluation method has an increased fidelity, and it can prove to be a cost-effective tool that can be used by designers to predict the dynamic behavior of a bearing.

• Journal of Aerospace System Engineering
• /
• v.14 no.3
• /
• pp.51-59
• /
• 2020

In the case of cubesat, a PCB-based deployable solar panel advantageous in terms of weight reduction and electrical circuit design is widely used considering the limited weight and volume of satellites. However, because of the low thermal conductivity of PCB, there is a limit relative to heat dissipation. In this paper, the thermal gap pad is applied to the contact between the PCB-based solar panel and the aluminum stiffener mounted on the outside of the panel. Thus, the heat transfer from the solar cell to the rear side of the panel is facilitated. It maximizes the heat dissipation performance while maintaining the merits of PCB panel, and thus, it is possible to improve the power generation efficiency from reducing the temperature of the solar cell. The effectiveness of the thermal design of the 6U cubesat's deployable solar panel using the thermal gap pad has been verified through on-orbit thermal analysis based on the results, compared with the conventional PCB-based solar panel.

• Tribology and Lubricants
• /
• v.13 no.4
• /
• pp.10-17
• /
• 1997

The present study describes an experimental investigation of temperature fluctuations associated with thermal instability. Surface temperatures of brake disk and pad were monitered at various locations in a caliper type brake system during drag braking conditions. It was found that the thermal instability appeared in pad more seriously than in disk. The temperatures at various circumferential positions fluctuate synchronously, whereas the center temperature fluctuates with 180$^{\circ}$ phase difference from the outer and inner radius temperatures. The temperature and amplitude of the temperature perturbations are increased due to the increase of contact area in the center location. It was also found that the thermal instability was dominantly determined by the increase of rotation speed and pressure. And the modification of ventilation path could retard the onset of thermal instability.

• Proceedings of the SAREK Conference
• /
• 2006.06a
• /
• pp.1144-1149
• /
• 2006

Electric power is generated by Seeback Effect if there is thermal difference in pettier module. Peltier module is composed by alumina, Bi-Te semiconductor and insulation (or air). If load is increased in pettier module, the alumina of module will be destroyed. One of the preventing method of module destruction is using damper between module and heat source. But the electric Power is dropped because of decrease of thermal difference, if thermal conductivity of damper was tourer than other thermoelectric materials. We design, Polymer Pad for enhancing thermoelectric porter. As the result of these experiment, Polymer Pad is more superior than the Rubber in the stability and thermal conduction.

• Macromolecular Research
• /
• v.12 no.3
• /
• pp.263-268
• /
• 2004

We have synthesized a water-soluble polyimide precursor, poly(amic acid) amine salt (PAD), from pyromellitic dianhydride (PMDA), 4,4'-oxydianiline, and N,N -dimethylethanolamine (DMEA) and have investigated in detail its properties with respect to the degree of salt formation (D$\_$sf/). The maximum value of D$\_$sf/ we obtained upon precipitation of the precursor solution into acetone was 79%. We synthesized a PAD having a D$\_$sf/ of 100% (PAD100) by the solid state drying of an organic solution. The precursors showed different solubility depending on the D$\_$sf/ to make up to 4 wt% solutions in water containing a small amount of DMEA. PAD100 is completely soluble in pure water. We investigated the imidization behavior of PAD in aqueous solution using various spectroscopic methods, which revealed that PAD 100 has faster imidization kinetics relative to that of the poly(amic acid)-type precursors. The resulting polyimide films prepared from an aqueous precursor solution possess almost similar physical and thermal properties as those prepared from N-methyl-2-pyrrolidone(NMP) solution. Therefore, we have demonstrated that PAD can be used as a water-based precursor of polyimide; this procedure avoids the use of toxic organic solvents, such as NMP.