• KSBB Journal
• /
• v.22 no.6
• /
• pp.433-437
• /
• 2007

A constant desire has been to fabricate nanopatterns for biochip and the Ultraviolet-nano imprint lithography (UV-NIL) is promising technology especially compared with thermal type in view of cost effectiveness. By using this method, nano-scale to micro-scale structures also called nanopore structures can be fabricated on large scale gold plate at normal conditions such as room temperature or low pressure which is not possible in thermal type lithography. One of the most important methods in fabricating biochips, immobilizing, was processed successfully by using this technology. That means immobilizing proteins only on the nanopore structures based on gold, not on hardened resin by UV is now possible by utilizing this method. So this selective nano-patterning process of protein can be useful method fabricating nanoscale protein chip.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2007.05a
• /
• pp.199-204
• /
• 2007

Hot embossing, one of Nanoimprint Lithography(NIL) techniques, has been getting attention as an alternative candidate of next generation patterning technologies by the advantages of simplicity and low cost compared to conventional photolithographies. A typical hot embossing usually, however, takes more than ten minutes for one cycle of the process because of a long thermal cycling. Over the last few years a number of studies have been made to reduce the cycle time for hot embossing or similar patterning processes. The target of this research is to develop an induction heating apparatus for heating a metallic micro patterning mold at very high speed with the large-area uniformity of temperature distribution. It was found that a 0.5 mm-thick nickel mold can be heated from $25^{\circ}C$ to $150^{\circ}C$ within 1.5 seconds with the temperature variation of ${\pm}5^{\circ}C$ in 4-inch diameter area, using the induction heating apparatus.

• Tribology and Lubricants
• /
• v.22 no.4
• /
• pp.182-189
• /
• 2006

In this paper, the adhesion characteristics between a fused silica without or with an anti-sticking layer and a thermoplastic polymer film used in thermal NIL were investigated experimentally in order to identify the release performance of the anti-sticking layer. The anti-sticking layers were derived from fluoroalkylsilanes, (1H, 1 H, 2H, 2H-perfluorooctyl)trichlorosilane ($F_{13}-OTS$) and (3, 3, 3-trifluoropropyl)trichlorosilane (FPTS), and coated on the silica surface in vapor phase. The commercial polymers, mr-I 7020 and 8020 (micro resist technology, GmbH), for thermal NIL were spin-coated on Si substrate with a rectangular island which was fabricated by conventional microfabrication process to achieve small contact area and easy alignment of flat contact sur- faces. Experimental conditions were similar to the process conditions of thermal NIL. When the polymer film on the island was separated from the silica surface after imprint process, the adhesion force between the silica surface and the polymer film was measured and the surfaces of the silica and the polymer film after the separation were observed. As a result, the anti-sticking layers remarkably reduced the adhesion force and the surface damage of polymer film and the chain length of silane affects the adhesion characteristics. The anti-sticking layers derived from FPTS and $F_{13}-OTS$ reduced the adhesion force per unit area to 38% and 16% of the silica sur-faces without an anti-sticking layer, respectively. The anti-sticking layer derived from $F_{13}-OTS$ was more effective to reduce the adhesion, while both of the anti-sticking layers prevented the surface damages of the polymer film. Finally, it is also found that the adhesion characteristics of mr-I 7020 and mr-I 8020 polymer films were similar with each other.

• Proceedings of the KSME Conference
• /
• 2007.05a
• /
• pp.343-348
• /
• 2007

Molecular dynamics study of thermal NIL (Nano Imprint Lithography) process is performed to examine stamp-resist interactions. A layered structure consists of Ni stamp, poly-(methylmethacrylate) thin film resist and Si substrate was constructed for isothermal ensemble simulations. Imposing confined periodicity to the layered unit-cell, sequential movement of stamp followed by NVT simulation was implemented in accordance with the real NIL process. Both vdW and electrostatic potentials were considered in all non-bond interactions and resultant interaction energy between stamp and PMMA resist was monitored during stamping and releasing procedures. As a result, the stamp-resist interaction energy shows repulsive and adhesive characteristics in indentation and release respectively and irregular atomic concentration near the patterned layer were observed. Also, the spring back and rearrangement of PMMA molecules were analyzed in releasing process.

• Transactions of Materials Processing
• /
• v.16 no.4 s.94
• /
• pp.282-287
• /
• 2007

Hot embossing, one of Nanoimprint Lithography(NIL) techniques, has been getting attention as an alternative candidate of next generation patterning technologies by the advantages of simplicity and low cost compared to conventional photolithographies. A typical hot embossing usually, however, takes more than ten minutes for one cycle of the process because of a long thermal cycling. Over the last few years a number of studies have been made to reduce the cycle time for hot embossing or similar patterning processes. The target of this research is to develop an induction heating apparatus for heating a metallic micro patterning mold at very high speed with the large-area uniformity of temperature distribution. It was found that a 0.5 mm-thick nickel mold can be heated from $25^{\circ}C\;to\;150^{\circ}C$ within 1.5 seconds with the temperature variation of ${\pm}5^{\circ}C$ in 4-inch diameter area, using the induction heating apparatus.

• Tribology and Lubricants
• /
• v.24 no.5
• /
• pp.255-263
• /
• 2008

Adhesion tests were conducted to investigate the adhesion characteristics between mold and thermoplastic polymer film. Coating of anti-sticking layer (ASL), a kind of polymer material, imprint pressure, and separation velocity were considered as the process conditions. A piece of fused silica without patterns on its surface was used as a mold and the thermoplastic polymer films were made on Si substrate by spin-coating the commercial polymer solution such as mr-I PMMA and mr-I 7020. The ASL was derived from (1H, 1H, 2H, 2H - perfluorooctyl) trichlorosilane($F_{13}$-OTS) and coated on the fused silica mold in vapor phase. The pull-off force was measured in various process conditions and the surfaces of the mold and the polymer film were observed after separation. It was found that the adhesion characteristics between the mold and the thermoplastic polymer film and the release performance of ASL were changed according to the process conditions. The ASL was effective to reduce the pull-off force and the damage of polymer film. In cases of the mold coated with ASL, the pull-off force did not depend on imprint pressure and separation velocity.

• Proceedings of the KSME Conference
• /
• 2008.11a
• /
• pp.1847-1850
• /
• 2008

The process conditions during ultraviolet nanoimprint lithography (UV-NIL) process such as temperature, stamping pressure, UV irradiation, etc. are effective factors for successful imprinting of complex and fine patterns. In this study, the effects of aluminum mold on the thermal characteristics of UV-NIL process were investigated through imprinting experiments and numerical simulations. The temperature of polymer resin on mold was measured to study thermal characteristics during UV curing. From the experimental and numerical results, the importance of curing reaction control for UV-NIL process was discussed for deformation characteristics.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.15 no.4
• /
• pp.1838-1843
• /
• 2014

Nanoimprint lithography (NIL) fabrication process is regarded as the main alternative to existing expensive photo-lithography in areas such as micro- and nano-electronics including optical components and sensors, as well as the solar cell and display device industries. Functional patterns, including anti-reflective moth-eye pattern, photonic crystal pattern, fabricated by NIL can improve the overall efficiency of such devices. To successfully imprint a nano-sized pattern, the process conditions such as temperature, pressure, and time should be appropriately selected. In this paper, a cavity-filling process of the moth-eye pattern during the thermal-NIL within the temperature range, where the polymer resist shows the viscoelastic behaviors with consideration of stress relaxation effect of the polymer, were investigated with three-dimensional finite element analysis. The effects of initial thickness of polymer resist and imprinting pressure on cavity-filling process has been discussed. From the analysis results it was found that the cavity filling can be completed within 100 s, under the pressure of more than 4 MPa.

• Journal of the Microelectronics and Packaging Society
• /
• v.25 no.1
• /
• pp.11-15
• /
• 2018

In this study, we deposited silver nanoparticles on the nanocone array structure which was fabricated by the UV nanoimprint process for optical signal amplification. The deposition of the silver nanoparticles was based on the evaporation behavior of the solution droplet according to wettability of surface and the deposition pattern changed from the center of the droplet to the edge depending on the difference of thermal energy. The optical property of silver nanoparticles that were deposited on imprinted nanohole patterns was simulated by the Finite difference time domain (FDTD) analysis method, and it was confirmed that energy was concentrated around the silver nanoparticle of the finally fabricated structure.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2007.10a
• /
• pp.364-367
• /
• 2007

In nano-imprint lithography (NIL) process, which has shown to be a good method to fabricate polymeric patterns, several kinds of pattern defects due to thermal effects during polymer flow and mold release operation have been reported. A typical defect in NIL process with high aspect ratio and low resist thickness pattern is a resist fracture during the mold release operation. It seems due to interfacial adhesion between polymer and mold. However, in the present investigation, FEM simulation of NIL molding process was carried out to predict the defects of the polymer pattern and to optimize the process by FEA. The embossing operation in NIL process was investigated in detail by FEM. From the analytical results, it was found that the lateral flow of polymer resin and the applied pressure in the embossing operation induce the weld line and the drastic lateral strain at the edge of pattern. It was also shown that the low polymer-thickness result in the delamination of polymer from the substrate. It seems that the above phenomena cause the defects of the final polymer pattern. To reduce the defect, it is important to check the initial resin thickness.