• Proceedings of the Materials Research Society of Korea Conference
• /
• 1999.11a
• /
• pp.103-103
• /
• 1999

• Proceedings of the Korean Nuclear Society Conference
• /
• 2003.05a
• /
• pp.384.2-384.2
• /
• 2003

• Proceedings of the Korean Nuclear Society Conference
• /
• 2004.05a
• /
• pp.450-450
• /
• 2004

• Proceedings of the KWS Conference
• /
• 2001.05a
• /
• pp.273-276
• /
• 2001

• Science of Emotion and Sensibility
• /
• v.16 no.4
• /
• pp.509-516
• /
• 2013

As the visual fatigue induced by 3D visual stimulation has raised some safety concerns in the industry, this study aims to quantify the visual fatigue through the means of measuring the facial temperature changes. Facial temperature was measured for one minute before and after watching a visual stimulus. Whether the visual fatigue has occurred was measured through subjective evaluations and high cognitive tasks. The difference in the changes that occurred after watching a 2D stimulus and a 3D stimulus was computed in order to associate the facial temperature changes and the visual fatigue induced by watching 3D contents. The results showed significant differences in the subjective evaluations and in the high cognitive tasks. Also, the ERP latency increased after watching 3D stimuli. There were significant differences in the maximum value of the temperature at the forehead and at the tip of the nose. A previous study showed that 3D visual fatigue activates the sympathetic nervous system. Activation of the sympathetic nervous system is known to increase the heart rate as well as the blood flow into the face through the carotid arteries system. When watching 2D or 3D stimuli, the sympathetic nervous system activation dictates the blood flow, which then influences the facial temperature. This study is meaningful in that it is one of the first investigations that looks into the possibility to measure 3D visual fatigue with thermal images.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.34 no.9
• /
• pp.1137-1143
• /
• 2010

This paper presents a fatigue design method for plug- and ring-type gas-welded joints, which takes into account the effects of welding residual stress. To develop this method, we simulated the gas-welding process by performing nonlinear finite element analysis (FEA) To validate the FEA results, numerically calculated residual stresses in the gas welds were then compared with experimental results obtained by the hole-drilling method. To evaluate the fatigue strength of plug- and ring-type gas-welded joints influenced by welding residual stresses, the use of stress amplitude $(\sigma_a)_R$, which includes the welding residual stress in gas welds, is proposed $(\sigma_a)_R$ on the basis of a modified Goodman equation that includes the residual stress effects. Using the stress amplitude $(\sigma_a)_R$ at the hot spot point of gas weld, the relations obtained as the fatigue test results for plug and ring type gas welded joints having various dimensions and shapes were systematically rearranged to obtain the $(\sigma_a)_R-N_f$ relationship. It was found that more systematic and accurate evaluation of the fatigue strength of plug- and ring-type gas-welded joints can be achieved by using $(\sigma_a)_R$.

• Journal of the Korean Society for Heat Treatment
• /
• v.29 no.6
• /
• pp.277-283
• /
• 2016

The influences of cooling pressure of quenching process on the mechanical properties such as hardness, impact endurance and anti-thermal fatigue behaviour of STD61 steel were investigated. The specimens were heat-treated using a vacuum furnace in which they were austenitized at $1,030^{\circ}C$ for 1hour under the pressure of $10^{-3}$ torr and cooled with quenching gas of various pressure, i.e. 1, 2 and 6 bar. According to the observation on the specimens prepared with quenching from austenizing temperature, the mechanical properties of the samples with higher quenching pressure were better than those of prepared at lower quenching pressure. The samples prepared with high quenching pressure showed the more homogeneous microstructure with finer carbides. The size of carbides such as VC and (Fe, Cr)C in quenched specimens decreased with increasing gas quenching pressure. It is considered that the rapid cooling with pressure may restrict the formation and growth of carbide.

• Journal of the Semiconductor & Display Technology
• /
• v.20 no.2
• /
• pp.43-50
• /
• 2021

The properties of materials which are widely used in industry fields like automobile, shipbuilding, casting, and electronics are strongly needed to have higher surface hardness, lower surface roughness, and higher compressive residual stress. As mentioned above, for the purpose of satisfying three factors, a variety of researches with respect to surface improvement have been actively studied and applied to every industry. SKD61 which is mostly used for die casting process of cold chamber method must meet a countless number of problems which are thermal, mechanical and chemical from highly specific working environment at high temperature over 600℃. Above all, in case of plunger sleeves used for die casting process, thermal fatigue has a bad effect on the surface of an inlet where molten metal is repeatedly injected. On account of it, plunger sleeves cause manufacturers to deteriorate quality of products. Therefore, in this paper, to improve the surface of an inlet of plunger sleeve, multilayer PVD coating using Ti, Cr and Mo is suggested. Furthermore, The surface characteristics such as surface roughness(Rsa, Rsq), surface hardness(HRB, HRC) and residual stress using XRD(X-ray diffractometer) of coated samples and specimens are studied and discussed.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.18 no.3
• /
• pp.729-737
• /
• 1994

A three-dimensional finite element model of a 20-pin plastic dual-in-line package(PDIP) plugged into a PCE has been developed by using the finite element code ANSYS. The model has been used for thermal characterization of the package during its normal operation under natural convection cooling. Temperature distributions in the package and PCB are obtained from numerical analysis and compared with experimentally measured data. Various cases are assumed and analyzed to study the effects of package and PCB materials on thermal characteristics of PDIP with and without aluminum heatspreader. Thermal dissipation capability of PDIP is greatly increased due to copper die pad/lead frame and heatspreader. However, thermally induced stresses in the package and fatigue life of chip are improved for PDIP with Alloy 42 die pad/lead frame and no heatspreader. It is also found that the role of PCB on thermal characteristics of PDIP is very imporatant.

• Proceedings of the Korean Powder Metallurgy Institute Conference
• /
• 2006.09b
• /
• pp.844-845
• /
• 2006

For microelectronic circuits, the main type of failure is thermal fatigue. Therefore, the search for matched coefficients of thermal expansion (CTE) of packaging materials in combination with a high thermal conductivity is the main task for developments of heat sink materials electronics, and good mechanical properties are also required. The aim of this work is to develop copper matrix composites reinforced with carbon nanofibers to meet these requirements. In this paper, a technology for obtaining a homogeneous mixture of copper and nanofibers will be presented and the microstructure and properties of consolidated samples will be discussed.