• 설비공학논문집
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• 제18권12호
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• pp.1007-1016
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• 2006

Although the advance in electronic technology enables a large number of circuity to be packed in a small volume, it is simultaneously required to remove the high heat load produced by them. In this study, the heat transfer and pressure drop characteristics of a mini-channel heat exchanger, which is designed for liquid cooling of electronic components, are investigated by varying operating conditions. Water and FC-72 were used as working fluids. The mini-channel heat exchanger was made with circular shape channels having din-meters of 2, 3, and 4 mm in regular intervals, and the channel length was 100 mm. The header and inlet guide pathway to provide uniform inflow were attached at the inlet of the test section. Copper block including the heaters was attached at the sidewall of the test section as a heat source, which provided the heat flux from 5 to $15W/cm^2$. The entrance effects enhanced the heat transfer coefficient in the mini-channel significantly. In addition, the single-phase pressure drop in the mini-channel was very similar to that predicted by the laminar flow correlation except that the transition Re decreased due to flow instability in the entrance region.