• Proceedings of the SAREK Conference
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• 2008.11a
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• pp.590-595
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• 2008

In this paper, the sensitivity analysis was examined about the main factors that compose an air-conditioning system with slab thermal storage by using the analytic solution. Those factors are the insulation performance of floor slab surface, the slab thickness, the heat capacity of floor slab, the air change rate, and the insulation performance of the wall. The slab thickness and heat capacity of floor slab that minimize heating loads was gained by sensitivity analysis. It is became clear that the insulation performance of slab surface, high airtightness and high heat insulation are important design factors in air conditioning system with slab thermal storage.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2001.10a
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• pp.238-246
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• 2001

Residual stresses and thermal deformation of a structure due to welding are very imfortant factors for a weld design. It has been carried therretical analysis to invesitigate influence of heat flux to residual stresses and thermal deformation producted by curcumferential welding. Temperature,stresses and deformationn are obtain as a function of circumferentisl drgree and distance from welding center line. These result can applicate to predict and remove the deformation or residual stresses built up by welding.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.11
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• pp.2466-2473
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• 2002

In twin roll strip casting process, the design of casting roll is the most important equipment for producing strip. Analyses of heat transfer and deformation for the casting roll are carried out by using the finite element program, ANSYS. Both the elastic deformation and the elasto-plastic deformation under a thermal load are considered in the analysis. Optimization to minimize the volume of roll is performed under the various thermal loads such as the heat flux and the roll speed. Design variables are defined by diameters and positions of the cooling hole in the roll , Although the thermal load remarkably varies, the design variables and objective function are found to be consistent.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.1
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• pp.39-43
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• 2003

Thermal management is very important for the success of high density circuit design in LTCC. In this paper, LTCC substrates containing thermal via and pad were fabricated in order to study the influence of the thermal dissipation. To realize the accurate thermal analysis for structure design, a series of simple thermal conductivity measurement by laser flash method and parametric numerical analysis have been carried out. The LTCC substrate including via and Ag pad has good thermal conductivity over 103 W/mK which is 44% value of pure Ag material. Thermal behaviors with via arrays, size and density in the LTCC substrate were studied by numerical method.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.525-530
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• 2003

Recently an automobile industry is concerned about an automobile wiring harness system. It means that development of component modules is on the increase. An importance of the connector in one part of the modules will be enhanced. A connector is made of P.B.T. (Poly Butylene Terephthalate). PBT is resistant to the high temperature. This paper deals with thermal strain of connector. According as temperature increase, effects of the temperature and thermal strains give an analysis of the deformation using ABAQUS. This apparent thermal strain results actually from the variation of temperature. Being based on this analysis, axiomatic design applies to design parameters of the connector. As compared with CAE analysis, a performance improvement makes certain of the truth of the matter.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.2
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• pp.122-129
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• 2004

There is an increasing need for large flat panel display devices. PDP (Plasma Display Panel) is one of the most promising candidates for this need. Thermal shock failure of PDP glass during manufacturing process is a critical issue in PDP industry since it is closely related to the product yield and the production speed. In this study, thermal shock resistance of PDP glass is measured by water quenching test and an analysis scheme is described for estimating transient temperature and stress distributions during thermal shock. Based on the experimental data and the analysis results, a simple procedure for predicting the thermal shock failure of PDP glass is proposed. The fast cooling process for heated glass plates can accelerate the speed of PDP production, but often leads to thermal shock failure of the glass plates. Therefore, a design guideline for preventing the failure is presented from a viewpoint of high speed PDP manufacturing process. This design guideline can be used for PDP process design and thermal -shock failure prevention.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.33 no.4
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• pp.321-325
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• 2020

Atmospheric environmental problems have a major impact on human health and lifestyle. In humans, inhalation of nitrogen oxides causes respiratory diseases, such as bronchitis. In this paper, thermal analysis of a gas sensor was carried out to design and fabricate a wearable nylon-yarn gas sensor for the detection of NO_x gas. In the thermal analysis method, the thermal diffusion process was analyzed while operating the sensors at 40 and 60℃ to secure a temperature range that does not cause thermal runaway due to temperature in the operating environment. Thermal diffusion analysis was performed using the COMSOL software. The thermal analysis results could be useful for analyzing gas adsorption and desorption, as well as the design of gas sensors. The thermal energy diffusion rate increased slightly from 10.05 to 10.1 K/mm as the sensor temperature increased from 40 to 60℃. It was concluded that the sensor could be operated in this temperature range without thermal breakdown.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.46 no.4
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• pp.306-314
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• 2018

A two-axis gimbal-type X-band antenna for CAS(Compact Advanced Satellite) transmits large amount of image data to ground station regardless of satellite attitude and orbital motion. This antenna mounted on the external surface of the satellite is directly exposed to the extreme space with thermal environment during the orbital operation. Therefore, a proper thermal design is needed to maintain the antenna itself as well as other main components within allowable temperature range. In this study, the thermal design effectiveness of two-axis gimbal X-band antenna was verified through the thermal analysis. In addition, required power and duty cycle of heater were estimated through the thermal analysis under conditions of system level thermal vacuum test and on-orbit thermal environment. The thermal analysis results indicated that all the main components of X-band antenna satisfy the allowable temperature requirement.

• Proceedings of the KSME Conference
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• 2001.11b
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• pp.77-82
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• 2001

Thermal design for KOMPSAT-2 propulsion system has been performed. Overall design requirements and the constitution for propulsion system is described. To meet the thermal design requirements, both a primary and a redundant heater circuit, each with two thermostats placed in series, will protect each hydrazine-wetted components, even if one heater circuit fails to operate. Heater power is turned off if any one of these thermostats is opened at its higher setpoint. Thus, even if one thermostat is failed closed, the second thermostat will turn off the heater. All such components shall be insulated with MLI. Propulsion heater sizing based on the constant worst cold case condition is conducted through thermal analysis. All heaters selected for propulsion components operate to prevent propellant freezing satisfying the thermal requirements for the propulsion subsystem over the worst case average voltage, i.e. 25 volts.

• Journal of computational fluids engineering
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• v.19 no.4
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• pp.37-44
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• 2014

A detailed satellite panel thermal model composed of more than thousands nodes can not be directly integrated into a spacecraft thermal model due to its node size and the limitation of commercial satellite thermal analysis programs. For the integration of the panel into the satellite thermal model, a reduced thermal model having proper accuracy is required. A thermal model reduction method was developed and validated by using a geostationary satellite panel. The temperature differences of main components between the detailed and the reduced thermal model were less than $1^{\circ}C$ in steady state analysis. Also, the dynamic responses of the detailed and the reduced thermal model show very similar trends. Thus, the developed reduction method can be applicable to actual satellite thermal design and analysis with resonable accuracy and convenience.