• Journal of the Korean Crystal Growth and Crystal Technology
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• v.30 no.5
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• pp.208-213
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• 2020

In this research, design optimization was investigated using the finite element analysis and the optimal design technique based on the PQRSM algorithm to minimize the thermal deformation of IGZO oxide in a target module in which IGZO oxide and a copper backplate are bonded to each other. In order to apply the optimal design technique in conjunction with finite element analysis, the x-coordinate of lower supports and upper fixed boards used as design valuables, and the optimal design was performed to minimize the thermal displacement of IGZO materials as the objective function. After the optimization process, the thermal displacement within IGZO oxide could be reduced to 42 % comparing with the initial model. The result is thought to be useful in the industry as it can reduce the thermal deformation of target oxides materials only by changing the position of the subsidiary materials during the bonding process.

• Smart Structures and Systems
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• v.15 no.2
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• pp.469-488
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• 2015

Thermal loads, especially thermal gradients, have a considerable effect on the behaviors of large-scale bridges throughout their lifecycles. Bridge design specifications provide minimal guidance regarding thermal gradients for simple bridge girders and do not consider transversal thermal gradients in wide girder cross-sections. This paper investigates the three-dimensional thermal gradients of arch bridge girders by integrating long-term field monitoring data recorded by a structural health monitoring system, with emphasis on the vertical and transversal thermal gradients of wide concrete-steel composite girders. Based on field monitoring data for one year, the time-dependent characteristics of temperature and three-dimensional thermal gradients in girder cross-sections are explored. A statistical analysis of thermal gradients is conducted, and the probability density functions of transversal and vertical thermal gradients are estimated. The extreme thermal gradients are predicted with a specific return period by employing an extreme value analysis, and the profiles of the vertical thermal gradient are established for bridge design. The transversal and vertical thermal gradients are developed to help engineers understand the thermal behaviors of concrete-steel composite girders during their service periods.

• Journal of Aerospace System Engineering
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• v.18 no.2
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• pp.71-78
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• 2024

During the initial thermal design process, determining the thermal effect of various design variables in a complex orbital thermal environment is time-consuming. To save time in the initial design phase, it is necessary to quickly derive optimal design parameters and predict the temperature. To address these challenges, Veritrek, a software specialized in optimal design using a reduced-order model (ROM), was released in 2018. In this paper, we utilized the Veritrek software to build a reduced-order model, conduct sensitivity analysis, and perform optimal design analysis for a graphite sheet-based cryogenic cooler thermal control system. The goal was to determine the optimal design values for the number of graphite sheet layers, radiator area, and thickness that would meet the allowable temperature of the cryogenic cooler.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2003.10a
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• pp.396-400
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• 2003

This paper has studied thermal characteristics of machine tool to develope high speed spindle and optimum design condidering the thermal deformation. Comparing the test data of temperature measurement and structural analysis data using FEM, we verifiedthe test validity and predicted thermal deformation, influence of spindle generation of heat, and established cooling system to prevent the thermal deformation. 1) The temperature rise of spindle system depends on increasing number of rotation and shows sudden doubling increment of number of rotation over 7,000rpm. 2) Oil jacket cooling can be effective cooling method below 8,000rpm but, over 8,000rpm, it shows the decrement of cooling effect. 3) Comparing FEM analysis results and revolution test results, we can confirmn approximate temperature change consequently, it is possible to simulate temperature rise and thermal distribution on the inside of spindle system. 4) We can confirm that simulated approach by FEM analysis can be effective method in thermal-appropriate design..

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.10a
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• pp.498-503
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• 2002

This paper has studied thermal characteristics of machine tool to develope high speed spindle and optimum design considering the thermal deformation. Comparing the test data of temperature measurement and structural analysis data using FEM, we verified the test validity and predicted thermal deformation, influence of spindle generation of heat, and established cooling system to prevent the thermal deformation. 1) The temperature rise of spindle system depends on increasing number of rotation and shows sudden doubling increment of number of rotation over 7,000rpm. 2) Oil jacket cooling can be effective cooling method below 8,000rpm but, over 8,000rpm, it shows the decrement of cooling effect. 3) Comparing FEM analysis results and revolution test results, we can confirmn approximate temperature change consequently, it is possible to simulate temperature rise and thermal distribution on the inside of spindle system. 4) We can confirm that simulated approach by FEM analysis can be effective mettled in thermal-appropriate design.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.1
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• pp.35-43
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• 2008

Aviation obstacle lights including controller for the safe night aviation service have applied to high voltage transmission line of which height is from $60{\sim}180 m$, Fresnel lens made by Augustine Fresnel have been applied to light houses, These Fresnel lens were applied to aviation obstacle lights and have been universally used, It was reported that Fresnel lens for aviation obstacle light was used in the first place in Korea in 1987, LEDs have recently been applied to aviation obstacle lights, So, the optimum physical design is essential to the design of aviation obstacle light. In this study, optical and three dimensional modeling of LED module and globe lens were performed, And thermal analysis due to LED thermal source and service thermal condition in high voltage transmission line was performed and was analyzed comparing with experiments, The optimum design process of medium intensity LED aviation obstacle lights was constructed with three dimensional modeling, thermal analysis, and thermal experimental technique.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.32 no.9
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• pp.114-121
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• 2004

Thermal design changes and analysis on the engineering model of Command Telemetry Unit(CTU) for a geostationary communications satellite arc performed for the purpose of developing an engineering qualification model. A thermal model is developed by using power consumption measurement values of each functional board and thermal cycling test results. In modeling heat dissipated EEE parts, heat dissipation is imposed evenly on the EEE part footprint area which is projected to the printed circuit board. All the EEE parts of CTU meet the requirement of their allowable temperature range when placed on the engineering qualification level of thermal vacuum environments in accordance with the proposed thermal design changes.

• 한국전산유체공학회:학술대회논문집
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• 2008.03b
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• pp.349-353
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• 2008

We present the development of a water-cooled heat sink that provides reliable thermal performance for high-power IGBT inverter. The development process comprises three stages. In the concept design, the thermal performances of two design proposals are considered. The thermal system of each design is particularly analyzed using the compact model. In the detailed design stage, specific dimensions of the heat sink are determined considering the design options under given external restrictions and the results from three-dimensional heat transfer analysis. The prototype of the resultant design is made and tested on the rig for final confirmation. We emphasize the relevant use of the thermal analysis on each stage and also discuss various practical issues involved.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.21 no.4
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• pp.517-529
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• 2023

The objectives of this paper are: (1) to conduct the thermal analyses of the disposal cell using COMSOL Multiphysics; (2) to determine whether the design of the disposal cell satisfies the thermal design requirement; and (3) to evaluate the effect of design modifications on the temperature of the disposal cell. Specifically, the analysis incorporated a heterogeneous model of 236 fuel rod heat sources of spent nuclear fuel (SNF) to improve the reality of the modeling. In the reference case, the design, featuring 8 m between deposition holes and 30 m between deposition tunnels for 40 years of the SNF cooling time, did not meet the design requirement. For the first modified case, the designs with 9 m and 10 m between the deposition holes for the cooling time of 40 years and five spacings for 50 and 60 years were found to meet the requirement. For the second modified case, the designs with 35 m and 40 m between the deposition tunnels for 40 years, 25 m to 40 m for 50 years and five spacings for 60 years also met the requirement. This study contributes to the advancement of the thermal analysis technique of a disposal cell.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.91-95
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• 2017

Package-On-Package (PoP) technology is developing toward smaller form factors with high-speed data transfer capabilities to cope with high DDR4x memory capacity. The common application processor (AP) used for PoP devices in smartphones has the bottom package as logic and the top package as memory, which requires both thermally and electrically enhanced functions. Therefore, it is imperative that PoP designs consider both thermal and power distribution network (PDN) issues. Stacked packages have poorer thermal dissipation than single packages. Since the bottom package usually has higher power consumption than the top package, the bottom package impacts the thermal budget of the top package (memory). This paper investigates the thermal and electrical characteristics of PoP designs, particularly the bottom package. Findings include that via and dense via-cluster volume have an important role to lower thermal resistance to the motherboard, which can be an effective way to manage chip hot spots and reduce the thermal impact on the memory package. A Cu block and dense via-cluster layout with an optimal location are proposed to drain the heat from the chip hot spots to motherboard which will enhance thermal and electrical performance at the design stage. The analytical thermal results can be used for design guidelines in 3D packaging.