• 대한기계학회논문집A
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• 제28권9호
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• pp.1408-1414
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• 2004

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue lift of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear hi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2$^{nd}$ DOE was conducted to obtain RSM equation far the choose 3 design parameter. The coefficient of determination ($R^2$) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430$\mu$m, and 78$\mu$m, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter should be controlled within 3% of average value.

• 한국정밀공학회지
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• 제20권8호
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• pp.175-184
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• 2003

A method of the shape design sensitivity analysis based on the boundary integral equation formulation is presented for two-dimensional inhomogeneous thermal conducting solids with multiple domains. Shape variation of the external and interface boundary is considered. A sensitivity formula of a general performance functional is derived by taking the material derivative to the boundary integral identity and by introducing an adjoint system. In numerical analysis, state variables of the primal and adjoint systems are solved by the boundary element method using quadratic elements. Two numerical examples of a compound cylinder and a thermal diffuser are taken to show implementation of the shape design sensitivity analysis. Accuracy of the present method is verified by comparing analyzed sensitivities with those by the finite difference. As application to the shape optimization, an optimal shape of the thermal diffuser is found by incorporating the sensitivity analysis algorithm in an optimization program.

• 한국항공우주학회지
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• 제32권7호
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• pp.117-125
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• 2004

기 수립한 열해석 모델을 바탕으로 접촉열전도가 있는 부위의 민감도 해석을 수행함으로서 향후 기계적 접속 부위 설계 변경시의 열설계에 대한 연구를 수행했다. 해석의 편의를 위해 비교적 간단한 열해석 모텔을 선택했다. 위성 버스 전압과 접촉열저항의 크기를 다양하게 변화시켜 해석을 수행했으며, 그 결과 향후 통일한 모듈에서 기계적 접속 조건 변경시 접촉열저항을 원래의 설계원용치를 기준 값으로 해 히터의 용량을 충분히 크게 설계할 경우 성공적인 열설계가 가능하리라 여겨진다.

• 대한기계학회논문집B
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• 제27권1호
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• pp.117-124
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• 2003

Thermal design fur satellite propulsion system has been performed. Overall design requirements and the constitution for propulsion system is described. To meet the thermal design requirements, both a primary and a redundant heater circuit, each with two thermostats placed in series, will protect each hydrazine-wetted components, even if one heater circuit fails to operate. Heater power is turned off if any one of these thermostats is opened at its higher setpoint. Thus, even if one thermostat is failed closed, the second thermostat will turn off the heater. All such components shall be insulated with MLI. Propulsion heater sizing based on the constant worst cold case condition is conducted through thermal analysis. All heaters selected fur propulsion components operate to prevent propellant freezing satisfying the thermal requirements for the propulsion subsystem over the worst case average voltage, i.e. 25 volts.

• 한국항공우주학회지
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• 제39권5호
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• pp.474-480
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• 2011

지구의 저궤도에서 운용되는 영상센서는 극저온 환경에서 태양 복사 뿐 아니라 지구의 적외선 및 알베도(Albedo)의 영향을 받는다. 극한 환경에 노출되는 영상센서는 작동/비작 동시 허용 온도를 벗어나지 않도록 열설계가 필요하며, 정상상태 에너지 평형식을 통해 필요한 방열판 면적 및 히터 예비 설계 값을 설정한다. 일반적으로 위성체 패널에 주기를 갖는 발열장비가 장착되어, 패널의 일부를 방열판 면적으로 설계한다. 본 논문에서는 위성체와 분리하여 설계하는 영상센서의 열제어를 위하여, 내부에서 항상 발열하는 장비의 열을 히트파이프를 이용하여 패널에 장착된 방열판으로 효과적으로 전달하도록 설계하였다. 예비 설계값을 기준으로 수치해석에 기반을 두는 SINDA를 이용하여 궤도 열해석을 실시하여, 방열 면적 및 히터 설계는 쉽고 빠르게 계산되어졌다. 또한, 방열 성능을 유지하면서 질량을 줄이도록 방열판을 립형상(Rib-type)으로 설계하였으며, 궤도 열해석 결과, 영상센서의 열적 요구사항을 만족함을 검증하였다.

• 한국전산유체공학회:학술대회논문집
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• 한국전산유체공학회 2010년 춘계학술대회논문집
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• pp.416-421
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• 2010

The north and south panel of a geostationary satellite are used for radiator panels to reject internal heat dissipation of electronics units and utilize several heat pipe networks to control the temperatures of units and the satellite within proper ranges. The design of these panels is very important and essential at the conceptual design and preliminary design stage so several thousands of nodes of more are utilized in order to perform thermal analysis of panel. Generating a large number of nodes(meshes) of the panel takes time and is tedious work because the mesh can be easily changed and updated by locations of units and heat pipes. Also the detailed panel model can not be integrated into spacecraft thermal model due to its node size and limitation of commercial satellite thermal analysis program. Thus development of a program was required in order to generate detailed panel model, to perform thermal analysis and to make a reduced panel model for the integration to the satellite thermal model. This paper describes the development and the verification of panel thermal analysis program with ist main modules and its main functions.

• 한국전산유체공학회지
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• 제15권3호
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• pp.66-72
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• 2010

The north and south panel of a geostationary satellite are used for radiator panels to reject internal heat and utilize several heat pipe networks to control the temperatures of units and the main structures of satellite within proper ranges. The design of these panels is very important and essential at the conceptual design and preliminary satellite design stage, so several thousands of nodes or more are utilized in order to perform detailed thermal analysis of panel. Generating a large number of panel nodes takes time and is tedious work because the nodes can be easily changed and updated by locations of units and heat pipes. Also the detailed panel model can not be integrated into spacecraft thermal model due to its node size and limitation of commercial satellite thermal analysis program. Thus development of a program was required to generate a detailed panel model, to perform thermal analysis and to make a reduced panel model for the integration to the satellite thermal model. This paper describes the development and the verification of the panel thermal analysis program with its main modules and functions.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2001년도 추계학술대회(한국공작기계학회)
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• pp.363-368
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• 2001

Studies on brake system recently are focused on braking performance, especially the consideration on safety of braking system in an extreme situation and reduction of vibration and noise during braking operation. The thermal crack and Judder from the friction between brake disc and pad can bring the threaten of passengers' safety in the end. Braking force comes from the change of kinetic energy to friction energy. Since heat energy is developed from here, the analysis on thermal stress and thermal strain can be the good data when selecting the material of brake pad and designing heat radiation holes on the disc and it will also be the data when designing the thickness of the disc. This paper is intended to show a creative design method by suggesting the thermal analysis data through FEM study and using shape design parameters.

• 동력기계공학회지
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• 제13권6호
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• pp.35-42
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• 2009

The piping systems in the steam-driven power engines lie under the cyclic condition of thermal expansion and contraction by superheated steam. These phenomena might cause some severe damages on the pipes and the accessory devices. To avoid these damages, the calculation of the proper strength and the consideration of the reduced resultant forces on the materials are needed. In the present study, numerical investigations on the effects of the thermal deformation of the industrial piping system were performed with comparison of the design data. Commercial software, ABAQUS with the thermal-fluidic loadings based on the design conditions was used for the thermal stress analysis of the piping system. From the analysis of the initially-designed pipe supporters, the rearrangement was suggested to improve the piping design.

• Journal of Astronomy and Space Sciences
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• 제29권1호
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• pp.23-31
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• 2012

Thermal analysis and control design are prerequisite essential to design the satellite. In the space environment, it makes satellite survive from extreme hot and cold conditions. In recent years CubeSat mission is developed for many kinds of purpose. Triplet Ionospheric Observatory (TRIO)-CubeSat for Ion, Neutral, Electron, MAgnetic fields (CINEMA) is required to weigh less than 3 kg and operate on minimal 3 W power. In this paper we describe the thermal analysis and control design for TRIO-CINEMA mission. For this thermal analysis, we made a thermal model of the CubeSat with finite element method and NX6.0 TMG software is used to simulate this analysis model. Based on this result, passive thermal control method has been applied to thermal design of CINEMA. In order to get the better conduction between solar panel and chassis, we choose aluminum 6061-T6 for the material property of standoff. We can increase the average temperature of top and bottom solar panels from $-70^{\circ}C$ to $-40^{\circ}C $ and decrease the average temperature of the magnetometer from $+93^{\circ}C$ to $-4^{\circ}C$ using black paint on the surface of the chassis, inside of top & bottom solar panels, and magnetometer.