• 한국주조공학회지
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• 제25권5호
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• pp.209-215
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• 2005

The design of the Metal mold casting should consider several variables such as the material properties and shape of the mold. In particular, the thermal stress generated by the thermal expansion and contraction depending on the thermal gradient of the mold causes partial plastic deformation on the mold, which causes damage or fracture of the cast. Consequently, the thermal deformation along with thermal stress leads to thermal deformation of the cast itself. In this study, the temperature analysis of the cast and mold is simulated by FDM to control the thermal deformation and stress as a result of the thermal gradient of mold. Using the results from FDM simulation, the thermal deformation and stress are analyzed by FEM and, the optimal mold design with minimum thermal deformation of the cast is suggested.

• 설비공학논문집
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• 제16권2호
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• pp.111-120
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• 2004

The optimal design method of indoor thermal environment using CFD coupled simulation and genetic algorithms (GA) is developed in this study. CFD could analyze the thermal environment considering the distribution of temperature, velocity, etc. in a room. Therefore, It would be appropriate to use CFD for the optimal design method considering their distribution. In this paper, the optimal design means the most appropriate boundary conditions of the room among the conditions where the design target of indoor therm environment is achieved. Two step optimal indoor thermal environment design method is proposed. It includes the GA for searching the optimal indoor thermal environment design. To examine the performance of this method, the optimal design of hybrid ventilation system, which uses the natural cross ventilation and the radiation-cooling panel is conducted. The optimal design which satisfies the design target (thermal comfort, minimum cooling load, minimum vertical temperature difference) is found using two step optimal design method.

• 항공우주기술
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• 제12권2호
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• pp.24-29
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• 2013

위성방열판은 내부의 부품유닛에서 발생하는 열을 외부우주로 방출하는 열전달경로를 확보하기 위해 적용되는 열제어방법 중 한 가지로서, 이것의 최적설계는 효율적인 위성 열설계의 한 방향이 될 수 있다. 본 연구는 위성 열제어 개발에서 활용하는 위성 열해석과 최적화알고리즘을 결합한 통합해석을 통하여 위성열모델 노드기반의 방열판설계최적화 접근방식을 제안하였다. 이 방법은 위성열해석과 최적화알고리즘의 해석소프트웨어의 종류에 상관없이 적용가능한 개념이며, 일반적인 위성열모델을 사용한 방열판설계의 개념을 그대로 유지하면서 최적화를 할 수 있기 때문에 위성설계에 실제적으로 사용할 수 있다. 또한, 두 해석소프트웨어를 결합하는 전체적인 해석구조와 본 방열판 설계 최적화문제에 대한 정식화를 제시하였다.

• 전력전자학회:학술대회논문집
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• 전력전자학회 2002년도 추계학술대회 논문집
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• pp.205-208
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• 2002

Thermal design is required with considering thermal stability to verify the reliability of electric power device with using IGBT. Numerical analysis is performed to analyzed the change in thermal resistance with respect to the various thermal density of heating element. Correlations between thermal resistance and heat generation density are established. With using these correlations, performance curve is composed with respect to the change in thermal resistance of cooling conditions for natural convection and forced convection. Thermal fatigue is occurred at the Inside and outside of IGBT by repeated heat load. The crack is occurred between base plate and ceramic substrate for the inside. When the crack length is 4mm, the failure is occurred. Therefore, Thermal design method considering thermal density, thermal fatigue resistance is presented on this study and it is expected to thermal design with considering life prediction.

• Nuclear Engineering and Technology
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• 제16권3호
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• pp.155-160
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• 1984

표준 핵연료집합체나 최적 핵연료집합체로 구성된 원자력 1호기 원자로심의 열적여유도를 기존 열설계 방법과 통계적 열설계 방법을 이용하여 분석하였다. 통계적 열설계 방법은 노심내 운전변수들의 불확실도를 통계적으로 처리함으로써 기존 방법에 비하여 열적여유도를 증가시킨다. 계산을 위하여 정상상태와 과도시 열수력분석 전산코드인 COBRA-IV-i를 사용하였다. 계산결과 통계적 설계방법은 열적여유도를 크게 증가시키며, 표준 핵 연료집 합체는 물론 최적 핵 연료집 합체가 장전된 원자력 1호기의 열설계기준을 만족시키는 것으로 밝혀졌다. 그러나 기존 열설계 방법은 원자력 1호기 노심에 최적 핵연료집합체가 장전된 경우 열설계기준을 만족시키지 못하는 것으로 밝혀졌다.

• Nuclear Engineering and Technology
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• 제49권7호
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• pp.1537-1546
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• 2017

Many thermal-hydraulic tests have been conducted at the Korea Atomic Energy Research Institute for verification of the SMART (System-integrated Modular Advanced ReacTor) design, the standard design approval of which was issued by the Korean regulatory body. In this paper, the contributions of these tests to the standard design approval of SMART are discussed. First, an integral effect test facility named VISTA-ITL (Experimental Verification by Integral Simulation of Transients and Accidents-Integral Test Loop) has been utilized to assess the TASS/SMR-S (Transient and Set-point Simulation/Small and Medium) safety analysis code and confirm its conservatism, to support standard design approval, and to construct a database for the SMART design optimization. In addition, many separate effect tests have been performed. The reactor internal flow test has been conducted using the SCOP (SMART COre flow distribution and Pressure drop test) facility to evaluate the reactor internal flow and pressure distributions. An ECC (Emergency Core Coolant) performance test has been carried out using the SWAT (SMART ECC Water Asymmetric Two-phase choking test) facility to evaluate the safety injection performance and to validate the thermal-hydraulic model used in the safety analysis code. The Freon CHF (Critical Heat Flux) test has been performed using the FTHEL (Freon Thermal Hydraulic Experimental Loop) facility to construct a database from the $5{\times}5$ rod bundle Freon CHF tests and to evaluate the DNBR (Departure from Nucleate Boiling Ratio) model in the safety analysis and core design codes. These test results were used for standard design approval of SMART to verify its design bases, design tools, and analysis methodology.

• 마이크로전자및패키징학회지
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• 제24권4호
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• pp.91-95
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• 2017

Package-On-Package (PoP) technology is developing toward smaller form factors with high-speed data transfer capabilities to cope with high DDR4x memory capacity. The common application processor (AP) used for PoP devices in smartphones has the bottom package as logic and the top package as memory, which requires both thermally and electrically enhanced functions. Therefore, it is imperative that PoP designs consider both thermal and power distribution network (PDN) issues. Stacked packages have poorer thermal dissipation than single packages. Since the bottom package usually has higher power consumption than the top package, the bottom package impacts the thermal budget of the top package (memory). This paper investigates the thermal and electrical characteristics of PoP designs, particularly the bottom package. Findings include that via and dense via-cluster volume have an important role to lower thermal resistance to the motherboard, which can be an effective way to manage chip hot spots and reduce the thermal impact on the memory package. A Cu block and dense via-cluster layout with an optimal location are proposed to drain the heat from the chip hot spots to motherboard which will enhance thermal and electrical performance at the design stage. The analytical thermal results can be used for design guidelines in 3D packaging.

• KIEAE Journal
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• 제10권4호
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• pp.67-73
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• 2010

As more and more people desire to live in an apartment complex with a comfortable outdoor space, many construction company became interested in outdoor design. In order to increase the use of outdoor space and create the most pleasant environment, outdoor thermal environment and comfort should be evaluated quantitatively from the design stage. This study utilized ENVI-met 3.1 model to analyze outdoor thermal environment in apartment complex, and evaluated outdoor thermal comfort in 6 points of apartment complex. The physiologically equivalent temperature(PET) was employed as a outdoor thermal index. Playground B had a poor thermal environment with the maximum PET $43^{\circ}C$ (Very hot). Because shading by building and tree didn't affect outdoor thermal environment of playground B. To design comfortable outdoor space from the view point of thermal environment, the factors influencing Mean radiant temperature(MRT) and wind speed should be considered in design stage. Since it is difficult to control outdoor thermal environment compared with indoor environment, we should take into account an assessment for outdoor thermal environment and comfort in outdoor design stage.

• 대한기계학회논문집B
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• 제27권1호
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• pp.117-124
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• 2003

Thermal design fur satellite propulsion system has been performed. Overall design requirements and the constitution for propulsion system is described. To meet the thermal design requirements, both a primary and a redundant heater circuit, each with two thermostats placed in series, will protect each hydrazine-wetted components, even if one heater circuit fails to operate. Heater power is turned off if any one of these thermostats is opened at its higher setpoint. Thus, even if one thermostat is failed closed, the second thermostat will turn off the heater. All such components shall be insulated with MLI. Propulsion heater sizing based on the constant worst cold case condition is conducted through thermal analysis. All heaters selected fur propulsion components operate to prevent propellant freezing satisfying the thermal requirements for the propulsion subsystem over the worst case average voltage, i.e. 25 volts.

• 한국군사과학기술학회지
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• 제11권1호
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• pp.102-111
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• 2008

This paper describes the basic model and simulation results of thermal battery. Voltage and thermal analysis is a critical part of thermal-battery design because of the need to maintain the inner temperature above the electrolyte melting point. Traditionally, battery design has depended on an empirical approach, in which prototype batteries are outfitted with thermocouples and the design of subsequent batteries is refined accordingly. We have developed the basic model that allows the design engineer to configure or modify a battery, quickly conduct a thermal analysis, and efficiently review the results. Based on performance tests, the thermal-battery model was established and the effect of design parameters on battery performance was analyzed.