• 한국응용과학기술학회지
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• 제21권2호
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• pp.174-181
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• 2004

Multi-walled carbon nanotubes (CNTs) were prepared by thermal chemical vapor deposition (CVD) and microwave plasma chemical vapor deposition (MPCVD) using various combination of binary catalysts with four transition metals such as Fe, Co, Cu, and Ni. In the preparation of CNTs from acetylene precursor by thermal CVD, the CNTs with very high yield of 43.6 % was produced over $Fe-Co/Al_2O_3$. The highest yield of CNTs was obtained with the catalyst reduced for 3 hr and the yield was decreased with increasing reduction time to 5 hr, due to the formation of $FeAl_2O_4$ metal-aluminate. On the other hand, the CNTs prepared by acethylene plasma CVD had more straight, smaller diameter, and larger aspect ratio(L/D) than those prepared by thermal CVD, although their yield had lower value of 27.7%. The degree of graphitization of CNTs measured by $I_d/I_g$ value and thermal degradation temperature were 1.04 and $602^{\circ}C$, respectively.

• 한국재료학회:학술대회논문집
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• 한국재료학회 1996년도 재료학회 추계학술발표회
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• pp.49-49
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• 1996

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 1999년도 추계학술발표회 초록집
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• pp.50-50
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• 1999

• 한국재료학회:학술대회논문집
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• 한국재료학회 2012년도 춘계학술발표대회
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• pp.90.2-90.2
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• 2012

Graphene has recently attracted significant attention because of its unique optical and electrical properties. For practical device applications, special attention has to be paid to the synthesis of high-quality graphene on large-area substrates. Graphene has been synthesized by eloborated mechanical exfoliation of highly oriented pyrolytic graphite, chemical reduction of exfoliated grahene oxide, thermal decomposition of silicon carbide, and chemical vapor deposition (CVD) on Ni or Cu substrates. Among these techniques, CVD is superior to the others from the perspective of technological applications because of its possibility to produce a large size graphene. PECVD has been demonstrated to be successful in synthesizing various carbon nanostructures, such as carbon nanotubes and nanosheets. Compared with thermal CVD, PECVD possesses a unique advantage of additional high-density reactive gas atoms and radicals, facilitating low-temperature, rapid, and controllable synthesis. In the current study, we report results in synthesizing of high-quality graphene films on a Ni films at low temperature. Controllable synthesis of quality graphene on Cu foil through inductively-coupled plasma CVD (ICPCVD), in which the surface chemistry is significantly different from that of conventional thermal CVD, was also discussed.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.652-652
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• 2013

The conventional thermal chemical vapor deposition (CVD) setup for the graphene synthesis has mainly used convective heat transfer in order to heat a catalyst (e.g. Cu) up to $1,000^{\circ}C$. Although the conventional CVD has been so far widely accepted as the most appropriate candidate enabling mass-production of high-quality graphene, this method has stillremained under the standard for the commercialization largely due to the poor productivity arisen out of the required long processing time. Here, we introduced a fast and efficient synthetic route toward CVD-graphene. Unlike the conventional CVD using convection heat transfer, we adopted a CVD setup utilizing conduction heat transfer between Cu catalyst and rapid heating source. The high thermal conductive nature of Cu and the employed rapid heating source led to the remarkable reduction in processing timeas compared to the conventional convection based CVD (Fig. 1A), moreover, the synthesized graphene was turned out to have comparable quality to that synthesized by the conventional CVD (Fig. 1B). For the optimization of the conduction based CVD process, the parametric studies were thoroughly performed using through Raman spectroscopy and electrical sheet resistance measurement. Our approach is thought to be worth considerable in order to enhance productivity of the CVD graphene in the industry.

• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2004년도 하계학술발표 논문집
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• pp.169-169
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• 2004

• 한국표면공학회지
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• 제29권5호
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• pp.454-458
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• 1996

The computer simulated CVD phase diagrams were completed by the stoichiometric algorithm. Three kinds of SiC/C FGMs: stepwise, semi-continuous, and continuous specimens were prepared according to the simulation. These three types of FGMs and SiC non-FGMs were compared through various thermal test and measurement. In overall judgment, the semi-continuously deposited FGM specimens out of three kinds showed excellent thermal properties as well as a good adhesion to each sub-layer.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2010년도 춘계학술대회 초록집
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• pp.102.1-102.1
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• 2010

고효율 멀티정션박막태양전지의 바텀셀 적용을 목적으로, 반응성CVD(Reactive thermal CVD)기술을 이용, $Si_2H_6+GeF_4$를 원료가스로, 이들이 가진 산화환원반응을 이용하여 400도 이하의 저온에서 Ge 및 Si 기판에 Ge을 에피성장 시켰다. Ge 기판위의 호모에피막의 경우, $2.5{\AA}/sec$의 성장속도와 99%의 Ge조성을 보였고, RHEED 및 HR-XRD를 통한 결정성 평가 결과, 고품질의 Ge 에피막의 성장이 확인되었다. 동일한 성장조건을 Si기판에 헤테로에피성장 시켰을 경우, 4% 격자불일치에 의해 막품질이 저하되는 것을 확인하였다. 이를 개선하기 위하여 저온에서 제작한 버퍼층에 대한 논의를 하고자 한다.

• 공업화학
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• 제5권1호
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• pp.16-23
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• 1994

아르곤 열플라즈마 CVD장치를 제작하여 메탄과 수소기체의 화학적인 반응을 이용해서 대기압하에서 몰리브덴 기판에 준안정상(metastable state)의 다이아몬드를 합성하였다. 증착실험 후 SEM관찰, X선 회절 및 Raman분광분석을 행한 결과, 기판표면온도와 수소에 대한 메탄 농도비에 따라 증착 입자의 morphology가 변화하였다. 본 연구에서 설정한 증착조건 범위에서 다이아몬드는 기판표면의 온도가 약 $890^{\circ}C$와 수소에 대한 메탄 농도비가 0.5%로 하였을 때, 결정성, 밀도 및 품질이 우수한 다이아몬드 입자를 합성하는 것이 가능하였다.

• 반도체디스플레이기술학회지
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• 제19권2호
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• pp.16-21
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• 2020

How accurately reproducible energy is delivered to the wafer in the process of making thin films using PE-CVD (Plasma enhanced chemical vapor deposition) during the semiconductor process. This is the most important technique, and most of the reaction on the wafer surface is made by thermal energy. In this study, we studied the method of monitoring the change of thermal energy transferred to the wafer surface by monitoring the temperature change according to the change of the thin film formed on the showerhead facing the wafer. Through this research, we could confirm the monitoring of wafer thin-film which is changed due to abnormal operation and accumulation of equipment, and we can expect improvement of semiconductor quality and yield through process reproducibility and equipment status by real-time monitoring of problem of deposition process equipment performance.