• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.567-570
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• 2000

Thermal simulation of typical stack-type and newly proposed planar-type micro-gas sensors were studied by FEM method. the thermal analysis for the proposed planar structure including temperature distribution over the sensing layer and power consumption of the heater were carried using finite element method by computer simulation and well compared with those of typical stack-type micro-gas sensor. The thermal properties of the microsensor from thermal simulation were compared with those of an actual device to investigate the acceptability of the computer simulation.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2022.11a
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• pp.85-86
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• 2022

In this study, a simulation using Company A's COMSOL heat flow program was used to analyze the thermal diffusion simulation according to the depth of the high-temperature exposed cement paste. As a result of the analysis, it showed a similar relationship with the measured temperature as of 180 minutes.

• Proceedings of the KIPE Conference
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• 2017.07a
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• pp.359-360
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• 2017

This paper presents comparison of simulation and experiment in thermal analysis of 3-level PFC. Thermal analysis is necessary to optimize the power conversion system to get higher efficiency. Accordingly, analysis via simulation tools and analytic methods is performed to predict the power losses of converter. Consequently, thermal results of 3-level PFC experiment is compared with thermal analysis.

• KIEAE Journal
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• v.15 no.4
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• pp.5-11
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• 2015

Purpose: Recently, renewable energy system has been widely used to reduce the energy consumption and CO2 emission of building. A photovoltaic/thermal(PVT) system is a kind of efficient energy uses, which is combined with photovoltaic module and solar thermal collector. PVT system removes heat from PV module by through thermal fluid to raise the performance efficiency of the PV system. However, though PVT system has the merit of the improved efficiency in theoretical approach, there have been few performance analysis for PVT system using the dynamic energy simulation. In this study, in order to establish the optimum design method of this system, simulation was conducted by using individual system modules. Method: For the dynamic simulation, TRNSYS17 was used and local weather data was utilized. Furthermore, the system performance in various installation condition was calculated by case studies. Result: As a result, the amount of electric generation and heat production in each case was found by the simulation. The gap of system performance was also evident according to the installation condition.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2000.10a
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• pp.84-89
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• 2000

Thermal simulation of typical stack-type and newly proposed planar-type micro-gas sensors were studied by FEM method. The thermal analyses for the proposed planar structure including temperatur distribution over the sensing layer and power consumption of the heater were carried using finite element method by computer simulation and well compared with those of typical stack-type micro-gas sensor. The thermal properties of the microsensor from thermal simulation were compared with those of a actual device to investigate the acceptability of the computer simulation.

• Fire Science and Engineering
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• v.16 no.3
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• pp.56-60
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• 2002

Recently, with the growth of software for electro-thermal analysis, it has been studied the precise analysis and investigation of cause for the electrical fire using computer simulation on the basis of theory for electro-thermal analysis. But it is very lacking for the precise analysis and investigation of cause for the electrical fire. In this paper, we have simulated the thermal analysis for electrical wire according to the value of current in a overload and a short with the electrical wire of the L's company product(600 V VVF) using the electro-thermal finite element method(Flux2D).

• International Journal of Aeronautical and Space Sciences
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• v.1 no.2
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• pp.30-42
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• 2000

On-orbit thermal environment test of KOMPSAT was performed in early 1999. An analysis of the test data are addressed in this paper. For the thermal-environmental simulation of spacecraft bus, an artificial heating through the radiator zones and onto some critical heat-dissipating electronic boxes was made by Absorbed-heat Flux Method. Test data obtained in terms of temperature history were reduced into flight heater duty cycles and converted into the total electrical power required for spacecraft thermal control. Verification result of flight heaters dedicated to the bus thermal control is presented. Additionally, an exhaustive heating-control process for maintaining the spacecraft thermally safe and for realistic simulation of the orbital-thermal environment during the test are graphically shown. Qualitative suggestions to post-test model correlation are given in consequency of the analysis.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.172-173
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• 2007

As the power density and switching frequency increase, thermal analysis of power electronics system becomes imperative. The thermal analysis provides valuable information on the semiconductor rating, long-term reliability. In this paper, thermal distribution of the Non Punchthrough(NPT) Insulated Gate Bipolar Transistor has been studied. For analysis of thermal distribution, we obtained experimental and simulation results by using finite element simulator, Ansys and by using photographic infrared thermometer, we compared experimental date with simulation result. and got good agreement. Also this paper provided thermal distribution of IGBT connected to heat sinks. and this results will be good information to design optimal heat sink for IGBT.

• Journal of Electrical Engineering and Technology
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• v.12 no.1
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• pp.91-99
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• 2017

In order to meet the thermal performance analysis accuracy requirements of high density permanent magnet synchronous motor (PMSM), a method of multi physical domain coupling thermal analysis based on control circuit, electromagnetic and thermal is presented. The circuit, electromagnetic, fluid, temperature and other physical domain are integrated and the temperature rise calculation method that considers the harmonic loss on the frequency conversion control as well as the loss non-uniformly distributed and directly mapped to the temperature field is closer to the actual situation. The key is to obtain the motor parameters, the realization of the vector control circuit and the accurate calculation and mapping of the loss. Taking a 48 slots 8 poles high density PMSM as an example, the temperature rise distribution of the key components is simulated, and the experimental platform is built. The temperature of the key components of the prototype machine is tested, which is in agreement with the simulation results. The validity and accuracy of the multi physical domain coupling thermal analysis method are verified.

• Transactions of Materials Processing
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• v.15 no.1 s.82
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• pp.15-20
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• 2006

The rapid thermal response (RTR) molding is a novel process developed to raise the temperature of mold surface rapidly to the polymer melt temperature prior to the injection stage and then cool rapidly to the ejection temperature. The resulting filling process is achieved inside a hot mold cavity by prohibiting formation of frozen layer so as to enable thin wall injection molding without filling difficulty. The present work covers flow simulation of thin wall injection molding using the RTR molding process. In order to take into account the effects of thermal boundary conditions of the RTR mold, coupled analysis with transient heat transfer simulation is suggested and compared with conventional isothermal analysis. The proposed coupled simulation approach based on solid elements provides reliable thin wall flow estimation for both the conventional molding and the RTR molding processes.