• Title/Summary/Keyword: Themal Deformation

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Thermal Behavior Analysis of a CNC Lathe (CNC 선반의 열적 거동 해석)

  • 안경기;조동우
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1994.10a
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    • pp.778-783
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    • 1994
  • In operating automated manufacturing system, the long term stability and reliability of NC machine tools become most critical issues. Especially the machining accuracy is dominated by the thermal deformation of machine tools which remains still unsolved and causes troubles in manufacturing operations. Although researches have been carried out on the thermal behavior of a machine tools to minimize or control the thermal deformation of machine tools, the computer models for an analysis of the thermal behacior in machine tools has yet to appear in the open literature. The object of the paper is to present a method of modeling the thermal behavior of a machine tool. The method will make use of finite elements ad be capable of modeling whole machine structures as well as of heat generation processes in the kinematic system components. And temperature distributions and thermal deformations of a CNC lathe are analyzed using the finite element method and are compared with those measured in practice.

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Submicro-displacement Measuring System with Moire Interferometer and Application to the Themal Deformation of PBGA Package (무아레 간섭계 초정밀 변위 측정장치의 설계 및 PBGA 패키지 열변형 측정에의 응용)

  • Oh, Ki-Hwan;Joo, Jin-Won
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.28 no.11
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    • pp.1646-1655
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    • 2004
  • A description of the basic principles of moire interferometry leads to the design of a eight-mirror four-beam interferometer for obtaining fringe patterns representing contour-maps of in-Plane displacements. The technique is implemented by the optical system using an environmental chamber for submicro-displacement mesurement. In order to estimate the reliability and applicabili쇼 of the system developed, the measurement of coefficient of thermal expansion (CTE) for a aluminium block is performed. Consequently, the system is applied to the measurement of thermal deformation of a WB-PBGA package assembly. Temperature dependent analyses of global and local deformations are presented to study the effect of the mismatch of CTE between materials composed of the package assemblies. Bending displacements of the packages and average strains of solder balls are documented. Thermal induced displacements calculated by FEM agree quantitatively with experimental results.

A Study on the Main Spindle Deformatin characteristics by the Tool Weight Condition (공구 중량조건에 의한 주축변위 특성연구)

  • 김종관
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.5 no.4
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    • pp.121-128
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    • 1996
  • In order to examine spindle deformation characteristics that affects the performance of dynmic cutting acuracy due to tool weight variation in a experimental spindle. thermal deformation value of operrative spindle by the axial displacement and the radial run out was measured according to the rise of spindle temperature through the laps of operation time and the change of rotational speed under the tool weight variation. A qualitative summary is as follows ; 1) The results show that the tool weight affcets the spindle temperature variation in a experimental spindle. 2) Radial run out and axial displacement was measured according to the rise of the spindle temperature and the performance of dynamic cutting accuracy was affected by the tool weight variation. 3) Axial displacement is 1.3 times larger than the radial run out in a experimental spindle conditions. 4) Axial displacement is continuously elongated when the tool weight is repeatly exchanged since the spindle themal deformaion, however, when the same tool weight is used. the displacement is still constant.

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