Analysis on the Effect of Operating Conditions on the Thermal Response of Electronic Assemblies during Infrared Reflow Soldering (적외선 리플로 솔더링시 작동조건이 전자조립품의 열적반응에 미치는 영향 분석)
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- Proceedings of the KSME Conference
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- 2004.11a
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- pp.1063-1068
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- 2004