• Journal of the Korea Institute of Information and Communication Engineering
• /
• v.15 no.8
• /
• pp.1791-1796
• /
• 2011

An optical fiber short period grating of 0.7 nm as a 3 dB wavelength linewidth was fabricated using a Gaussian distributed KrF Eximer laser and a phase mask. This grating has temperature dependancy of 0.01 nm/$^{\circ}C$ over the range of -10 $^{\circ}C$ ~ 70 $^{\circ}C$and no difference between temperature directions. An optical fiber long period grating of 14.22 nm as a 3 dB linewidth was also fabricated using a amplitude mask and has dependancy of 0.01 nm/$^{\circ}C$ over the same range.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
• /
• 2009.10a
• /
• pp.770-771
• /
• 2009

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
• /
• 2009.04a
• /
• pp.168-169
• /
• 2009

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
• /
• 2012.10a
• /
• pp.669-670
• /
• 2012

• Proceedings of the KIEE Conference
• /
• 2002.07c
• /
• pp.1463-1466
• /
• 2002

In this paper, the thermal analysis and dielectric/insulation properties were investigated with considering the temperature depenence Using the sheet of semi-conductor/XLPE came from 22 kV power cables, the dielectric/insulation properties and temperature dependence were measured under 1kHz. According to the results we can verify that only semi-conductor sheet changed linearly, and with the unstable results. the dielectric/insulation properties of the semi-conductor/XLPE sheet show the highest value in the range of 40 $^{\circ}C$ and 50 $^{\circ}C$ and are rely on XLPE rather than semi-conductor in terms of the temperature.

• The Transactions of The Korean Institute of Electrical Engineers
• /
• v.57 no.12
• /
• pp.2276-2280
• /
• 2008

In this paper, we present thermal dependancy of LED package element by changing temperature of MCPCB for design high efficiency LED lamp, and confirmed influence of LED chip against temperature with analysis of thermal resistance and thermal capacitance. As increasing temperature, WPOs were decreased from 25 to 22.5 [%] and optical power were also decreased. that is decreased reason of optical power that forward voltage was declined by decrease of energy bandgap. Therefore optical power by temperature of MCPCB should consider to design lamp for street light and security light. Moreover, compensation from declined optical efficiency is demanded when LED package is composed. Also, thermal resistances from chip to metal PCB were decreased from 12.18 to 10.8[$^{\circ}C/W$] by changing temperature. Among the thermal resistances, the thermal resistance form chip to die attachment was decreased from 2.87 to 2.5[$^{\circ}C/W$] and was decreased 0.72[$^{\circ}C/W$] in Heat Slug by chaning temperature. Therefore, because of thermal resistance gap in chip and heat slug, reliability and endurance of high power LED affect by increasing non-radiative recombination in chip from heat.

• Elastomers and Composites
• /
• v.22 no.2
• /
• pp.109-120
• /
• 1987

In this study, as one of the developing ways of the functional elastomer, improvement of the functionality of CB-BR was attemped through stabilization. At first the stabilization effect of CB-BR and the concentration dependancy in CB-BR were determined. Then, triazine thiol derivative(BPTT) was synthesized by reacting p-aminodiphenylamine with cyanuric chloride. Further the functional mechanism and the effects of the antioxidants were investigated using BPTT together with other various antioxidants in liquid and solid states. The results obtained are as follows: 1) The aging of CB-BR depended on the concentration and temperature. Thus, at a low temperature of $50^{\circ}C$, the aging proceeded with gel formation; at high temperature above $100^{\circ}C$ and in above 4wt% concentration, the aging occured by the formation of gel. And in concentrations below that, the aging proceeds with a decomposition caused by oxygen attacked to elastomer molecules. 2) The effect of antioxidation of CB-BR in the liquid state was at it's best when the MBIZ and BPTT were used at $110^{\circ}C$, 4hrs after the oxidation. 3) The effect of antioxidation of CB-BR in the solid state was the best choice the simultaneous use of NDBC and BPTT at $50^{\circ}C$, 30days after the oxidation.

• Proceedings of the KIEE Conference
• /
• 1994.07b
• /
• pp.1422-1424
• /
• 1994

This paper deals with piezoresistive humidity sensor using polycrystalline silicon (Poly-Si ) with membrane in sensors of semiconductor. Poly-Si piezoresistors which have no temperature dependancy are deposited on silicon wafer, membrane is formed with micromachining technology, then polyimide is formed as a hygroscopic layer. Whereas the principle of conventional humidify sensors are based on the change in electrical properties of the material, the humidity induced volume change of a polyimide layer leads to a deformation of a silicon membrane in this case. This deformation is transformed into an output voltage by Poly-Si piezoresistive. Wheatstone bridge. Fabricated piezoresistive humidity sensors showed good linearity, response time, and long term stability.

• Proceedings of the KIEE Conference
• /
• 1990.07a
• /
• pp.215-220
• /
• 1990

A.C. impedance properties of $RuO_2$ based thick film resistors which having different resistivity value (DuPont 1721 : $100{\Omega}$/ sq., 1741 : $10K{\Omega}$/sq.) were investigated using by impedance analyzer. In case of lower resistivity 1721 system, the complex impedance was composed nearly R component for all speciman sintered at above $600^{\circ}C$, and the frequency dependancy on impedance was not affected very much up to 5MHz and again gradually increase with increasing the frequency. In case of higher resistivity 1741 resistor system, impedance properties were very depandant on sintering temperature. When sintering temperature was $600^{\circ}C$, the complex impedance plot shows a vertical line, which correspond to lone capacitance equivalant circuit, and the impedance linearly decreased with increasing frequency. In case of speciman sintered at $700-900^{\circ}C$, the complex impedance plot shows semi-circular are correspond to a lumped RC combination, and the impedance shows constant value to 5MHz, again decreased with increasing frequency. But the complex impedance behavior of speciman sintered at $1000^{\circ}C$ was shows the equivalent circuit correspont to parallel combined LCR component, and the impedance was not varied with frequency.

• Journal of the Computational Structural Engineering Institute of Korea
• /
• v.27 no.5
• /
• pp.385-392
• /
• 2014

The isolators have been generally used to reduce a seismic force. If the isolators apply to the nuclear power plants(NPPs), the durability and capacity for the structures and equipments should be ensured during the life time. In this study, the long-term behavior of isolated NPPs was analyzed for ensuring the seismic safety. The properties of isolator due to the age-related degradation were analyzed. And the seismic behavior of isolated buildings was analyzed by considering the aging of rubber bearings in different temperature environments. According to the analysis results, the natural frequency of structures was increased with time. But the maximum acceleration and maximum displacement of isolated structures have not changed significantly. Although the damaged of structure did not occurred by aging of isolators, it was presented that the spectral acceleration at the target frequency of isolated structure increased with the temperature. Therefore the isolators in the isolated buildings should be carefully designed and manufactured considering the temperature-dependancy of rubber material.