• Title/Summary/Keyword: Telecentric optics

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OCI and ROCSAT-1 Development, Operations, and Applications

  • Chen, Paul;Lee, L.S.;Lin, Shin-Fa
    • Korean Journal of Remote Sensing
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    • v.15 no.4
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    • pp.367-375
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    • 1999
  • This paper describes the development, operations, and applications of ROCSAT-l and its Ocean Color Imager (OCI) remote-sensing payload. It is the first satellite program of NSPO. The satellite was successfully launched by Lockheed Martin's Athena on January 26, 1999 from Cape Canaveral, Florida. ROCSAT-l is a Low Earth Orbit (LEO) experimental satellite. Its circular orbit has an altitude of 600km and an inclination angle of 35 degrees. The satellite is designed to carry out scientific research missions, including ocean color imaging, experiments on ionospheric plasma and electrodynamics, and experiments using Ka-band (20∼30GHz) communication payloads. The OCI payload is utilized to observe the ocean color in 7 bands (including one redundant band) of Visible and Near-Infrared (434nm∼889nm) range with the resolution of 800m at nadir and the swath of 702km. It employs high performance telecentric optics, push-broom scanning method using Charge Coupled Devices (CCD) and large-scale integrated circuit chips. The water leaving radiance is estimated from the total inputs to the OCI, including the atmospheric scattering. The post-process estimates the water leaving radiance and generates different end products. The OCI has taken images since February 1999 after completing the early orbit checkout. Analyses have been performed to evaluate the performances of the instrument in orbit and to compare them with the pre-launch test results. This paper also briefly describes the ROCSAT-l mission operations. The spacecraft operating modes and ROCSAT Ground Segment operations are delineated, and the overall initial operations of ROCSAT-l are summarized.

DPSS UV laser projection ablation of 10μm-wide patterns in a buildup film using a dielectric mask (Dielectric 마스크 적용 UV 레이저 프로젝션 가공을 이용한 빌드업 필름 내 선폭 10μm급 패턴 가공 연구)

  • Sohn, Hyonkee;Park, Jong-Sig;Jeong, Su-Jeong;Shin, Dong-Sig;Choi, Jiyeon
    • Laser Solutions
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    • v.16 no.3
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    • pp.27-31
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    • 2013
  • To engrave high-density circuit-line patterns in IC substrates, we applied a projection ablation technique in which a dielectric ($ZrO_2/SiO_2$) mask, a DPSS UV laser instead of an excimer laser, a refractive beam shaping optics and a galvo scanner are used. The line/space dimension of line patterns of the dielectric mask is $10{\mu}m/10{\mu}m$. Using a ${\pi}$ -shaper and a square aperture, the Gaussian beam from the laser is shaped into a square flap-top beam; and a telecentric f-${\theta}$ lens focuses it to a $115{\mu}m{\times}105{\mu}m$ flat-top beam on the mask. The galvo scanner before the f-${\theta}$ lens moves the beam across the scan area of $40mm{\times}40mm$. An 1:1 projection lens was used. Experiments showed that the widths of the engraved patterns in a buildup film ranges from $8.1{\mu}m$ to $10.2{\mu}m$ and the depths from $8.8{\mu}m$ to $11.7{\mu}m$. Results indicates that it is required to increase the projection ratio to enhance profiles of the engraved patterns.

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A Study on the Hypercentric Lens Design and Optical Performance Analysis (하이퍼센트릭 렌즈 설계 방법 및 성능 분석에 대한 연구)

  • Koh, Jae Seok;Cho, Hyun Woo;Park, Tae Yang;Kim, Sang Hyun;An, Young Duk;Jung, Mee Suk
    • Korean Journal of Optics and Photonics
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    • v.29 no.1
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    • pp.7-12
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    • 2018
  • In the field of machine vision, a variety of lenses are used to inspect a product for defects. Only part of the appearance of an object can be photographed with a general lens. Optical components such as mirrors, multiple lenses and cameras are required to inspect the entire exterior. This increases the size of the optical system, and has the disadvantage of high cost. In this paper, we design a hypercentric lens, which can photograph the top and side of an object, and various sizes of objects while maintaining the image size. Also, the validity of the design is verified through the performance analysis of the product.