• Journal of the Korean Applied Science and Technology
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• v.27 no.1
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• pp.37-43
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• 2010

The objective of this study was to evaluate the antifungal properties of xanthorrhizol (extract from curcuma xanthorrhiza) against Candida albicans. Some of the commercial products were evaluated for their ability to inhibit growth of C. albicans. OTC product containing povidone iodide and cosmetic grade product with surfactants were tested. Antifungal activity was shown in 1.56% of OTC product, however, there was no antifungal effect in cosmetic product. For the comparison, we tested several materials. Povidone iodide, lemon tea tree oil and xanthorrhizol showed antifungal activities against C albicans in 0.25, 0.062 and 0.007%, respectively. We also tested the antifungal effects of povidone iodide and xanthorrhizol in surfactant base. Test results revealed that 2.5% of povidone iodide and 0.156% of xanthorrhizol showed similar antifungal effects. These findings support the application of xanthorrhizol for vaginal cleanser or personal cares using antifungal effect.

• Journal of Industrial Technology
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• v.31 no.B
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• pp.27-36
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• 2011

In this paper, the applicability of cement grout has been studied as an alternative to bentonite grout for backfill ground heat exchangers. To provide an optimal mixture design, the thermal conductivity of cement grout and bentonite grout with various mixture ratios were experimentally evaluated and compared. Numerical analyses using Fluent(FVM program) were applied to compare the thermal transfer efficiency of the cement grout with that of the bentonite grout used in the construction. Also the effective ground thermal conductivity was measured by In-situ thermal response test. The results showed that the thermal efficiency of the cement grout was better than the bentonite grout. Consequently, the cement grout could be an alternative with more thermal efficiency to bentonite grout for ground heat exchangers.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.1
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• pp.36-43
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• 2015

Optimizing multiple design characteristics which are usually in conflict with each other in the injection molding process is frequently becoming a critical problem for designers who work in this area. The purpose of this work is to develop an automated design methodology for optimizing two such design characteristics found in injection-molded parts. A value function based on decision-making theory is used as a means of evaluating the performance of a two-characteristic design alternative. Also, a design space reduction algorithm based on Taguchi's orthogonal arrays is utilized to discover an optimal design alternative. Verification of the developed design methodology is carried out for an actual model with two design characteristics, the weld line and the gate location, to be optimized in computer simulation experiments.

• ETRI Journal
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• v.28 no.6
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• pp.811-814
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• 2006

In this letter, we introduce confusion-based confidence measures for detecting an impostor in speaker recognition, which does not require an alternative hypothesis. Most traditional speaker verification methods are based on a hypothesis test, and their performance depends on the robustness of an alternative hypothesis. Compared with the conventional Gaussian mixture model-universal background model (GMM-UBM) scheme, our confusion-based measures show better performance in noise-corrupted speech. The additional computational requirements for our methods are negligible when used to detect or reject impostors.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.8 no.3
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• pp.59-65
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• 1999

To reduce the particulate matter and nitrogen oxides from diesel engine, many studies are proceeding and being accomplished practically. In this situation, LNG engine has important meaning as a clean fuel and alternative energy. In this reason, we try to understand the property of LNG fuel and predict the performance with using LNG engine simulation program and practical test. It could help to lead and apply practically LNG engine was studied in performance and other parameter related with engine performance and compared with current diesel engine. The simulation program was proved to be good in describing the experimental result. This means current heavy duty vehicle could be modified to LNG engine.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1144-1149
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• 2008

Converting technology has developed to print information for the decades. Recently, this technology (like gravure, gravure-offset) is rising as an alternative way for mass production of printed electronics such as RFID, solar cell. For the width of printing line is under 10 microns, registration error should be minimized less than several microns. Tension disturbance is main cause of registration error and this should be minimized before the substrate is transported into printing zone. With PI controller, it is possible to suppress the disturbance within 2% of operating tension. But register error appears more than 10 micron using PIcontroller considering noise. So LQG controller is needed as an alternative control method. In this paper, the comparision of PI and LQG controller in the converting machine including measured noise and tension disturbance is presented. It is shown that the LQG controller is more suitable for precision tension control in printed electronics.

• International Journal of Automotive Technology
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• v.8 no.1
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• pp.83-91
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• 2007

Nowadays, the increasing global competition forces manufacturing enterprises to apply new technologies such as laser welding to manufacturing of their products. In case of automotive industries, they interest in assembly system for BIW (Body in White) carrying out laser welding. In this paper, the method of implementation for digital laser welding assembly system is proposed. Based on the requirements of assembly tasks obtained through product analysis, process modeling is executed by using the IDEF0 and UML model. For digital assembly system, the selected components are modeled by using 3D CAD tools. According to the system configuration strategy, lots of the alternative solutions for the assembly system of welding side panels are generated. Finally, the optimal laser welding system is chosen by the evaluation of the alternative solutions with TOPSIS (Technique for Order Preference by Similarity to Ideal Solution) method.

• Proceedings of the Korean Nuclear Society Conference
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• 1998.05a
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• pp.547-552
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• 1998

The standard RELAP5/MOD3.2 code were assessed with the condensation experiment in the presence of noncondensable gas in a vortical tube of PCCS of CP-1300. There are two wall film condensation models, the default model and the alternative model, in RELAP5/MOD3.2. The experimental apparatus was modeled with the two models, md simulations were performed for several sub-tests to be compared with the experimental results. In overall sense the simulation results showed that the default model of RELAP5/MOD3.2 under-predicts the heat transfer coefficients, while the alternative model over-predicts them throughout the condensing tube.

• Journal of the Semiconductor & Display Technology
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• v.3 no.3
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• pp.5-9
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• 2004

A new wafer level packaging scheme is presented as an alternative to MEMS package. The proof-of-concept structure is fabricated and evaluated to confirm the feasibility of the idea for MEMS wafer level packaging. The scheme of this work is developed using an electroplated tin (Sn) solder. The critical difference over conventional ones is that wafers are laterally bonded by solder reflow after LEGO-like assembly. This lateral bonding scheme has merits basically in morphological insensitivity and its better bonding strength over conventional ones and also enables not only the hermetic sealing but also its electrical interconnection solving an open-circuit problem by notching through via-hole. The bonding strength of the lateral bonding is over 30 Mpa as evaluated under shear and the hermeticity of the encapsulation is 2.0$\times10^{-9}$mbar.$l$/sec as examined by pressurized Helium leak rate. Results show that the new scheme is feasible and could be an alternative method for high yield wafer level packaging.

• Proceedings of the Korea Society for Industrial Systems Conference
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• 2003.11a
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• pp.227-237
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• 2003

U-learning stresses the ubiquitous networking environment where different sizes of U-devices, let alone the dominant PCs, comprise a background infrastructure to enhance knowledge and performance. This paper suggests a U-learning system that will provide an alternative for the hectic private lessons, particularly English training among grade-school students. Several points are suggested of the U-system to be a cost-effective alternative. Besides the corresponding advancement of U-networking, the production of a profitable business model harnessing the emerging technology is most urgent. The Government authorities should recognize the potential U-social system solutions, and take an initiative to develop them. The latest technology seems to throw a light to the upcoming social systems applied in various fields of social needs.