• Journal of KSNVE
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• v.5 no.2
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• pp.183-195
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• 1995

The mathematical model of the gear reductioner which consists which consists of the geared rotor-bearing system containing case is developed, assuming as the lumped parameter system. Constraints for vibration suppresion as well as strength of gear teeth, and shaft and kinematic conditions in gear pairs are considered. To find the design parameters satisfing the proposed constraints, a direct search method modified by the technique of Taguchi's experimental scheduling is used. One and two stepped gear reductioners are designed so that the criticl speeds due to the gear transmission error are moved out of the operating speed range.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.769-773
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• 2001

Linear hydrostatic bearings have high stiffness, high damping and excellent guided motion straightness, and thus they are suitable for high precision machine tools. This paper describes the procedure for design and test of a high precision stamping press with vertical hydrostatic bearings. For a hydrostatic bearing set designed and manufactured, measurements were made for the straightness, repeatability and stiffness. They are found to be 1.36$\mu\textrm{m}$/100mm, 0.19$\mu\textrm{m}$/100mm and 1, 261N/$\mu\textrm{m}$ respectively. Based upon the experiences with the hydrostatic bearing, an improved design of the precision press is proposed.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.6
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• pp.951-960
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• 1997

Package crack caused by the soldering process in the surface mounting plastic package is evaluated by applying the maximum energy release rate criterion. It could be shown that the crack propagation from the lower edge of the ie pad is easily occurred at the maximum temperature during the soldering process, where the pressure acting on the crack surface is assumed by the saturated vapor pressure at maximum temperature. The package crack formation depends on various parameters such as chip size, relative thickness, material properties, the moisture content and soldering temperature etc. The quantitative measure of the effects of the parameters could be easily obtained by using the taguchi's method which requires only a few kinds of combinations with such parameters. From the results, it could be obtained that the more significant parameters to effect the package reliability are the orders of Young's modulus, die pad size, down set, chip thickness and maximum soldering temperature.