• Journal of the Korean Institute of Telematics and Electronics
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• v.25 no.12
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• pp.1663-1668
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• 1988

Ohmic contact process for the fabrication of GaAs integrated circuits is very important. Specific contact resistivities, assuming Rsm=Rs, were measured after the rapid and the conventional alloying process, respectively. The results show that the characteristics of ohmic contact through the rapid alloying process is much better (Apc=1.3~3.3x10**-7 \ulcorner-(m\ulcorner. This is probably due to intensive and compound energy densities during the rapid alloying process. New analysis method of TLM patterns viz. measurements of normlaized specific contact resistivities are proposed to reduce measurement errors that could occur when measuring the small contact end resistances. The adoption of rapid alloying process for the mass production of GaAs integrated circuits could greatly reduce the total processig time.

• Geomechanics and Engineering
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• v.23 no.6
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• pp.547-560
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• 2020

This paper studies the dynamic foundation-soil-foundation interaction for two square rigid foundations embedded in a viscoelastic soil layer. The vibrations come from only one rigid foundation placed in the soil layer and subjected to harmonic loads of translation, rocking, and torsion. The required dynamic response of rigid surface foundations constitutes the solution of the wave equations obtained by taking account of the conditions of interaction. The solution is formulated using the frequency domain Boundary Element Method (BEM) in conjunction with the Kausel-Peek Green's function for a layered stratum, with the aid of the Thin Layer Method (TLM), to study the dynamic interaction between adjacent foundations. This approach allows the establishment of a mathematical model that enables us to determine the dynamic displacements amplitude of adjacent foundations according to their different separations, the depth of the substratum, foundations masss, foundations embedded, and the frequencies of excitation. This paper attempts to introduce an approach based on a polynomial mathematical tool conducted from several results of numerical methods (BEM-TLM) so that practicing civil engineers can evaluation the dynamic foundations displacements more easy.

• Proceedings of the Korean Information Science Society Conference
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• 1999.10c
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• pp.230-232
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• 1999

KOMPSAT(KOrea Multi-Purpose SATEllite) Flight Software[2]의 개발 단계에서 통합 및 시험, 검증 시험을 위해 실제 시스템과 유사한 환경을 제공하는 개발도구로서 STB(Software Test BED)를 개발하였으며 STB 구성중에서 Command/Telemetry (CMD/TLM) 테스트를 위해 개발한 Command Generator / Telemetry Analyzer에 관한 내용을 본 논문에서 설명하고자 한다. 통신간에 사용되는 프로토콜은 [1]에서 언급한 바와 같이 CCSDS 프로토콜을 따르고 모든 관련된 Command 와 Telemetry 형식 또한 [1]에서 언급한 바와 같다. 이 구현된 소프트웨어를 이용하여 Flight Soaftware내의 CMD/TLM 처리 소프트웨어의 기능시험과 검증시험을 수행하였다.

• Proceedings of the IEEK Conference
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• 2007.07a
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• pp.421-422
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• 2007

In underwater, acoustic waves are used for telecommunication. The communication channels are very complicated, because of the distribution of temperature in depth, reflections from boundaries like as the surface of water and the bottom. We report the constitution of the underwater acoustic channel using the simulation of the Transmission Line Matrix Modeling and cross-correlations from the input and output signals.

• Journal of the Institute of Electronics Engineers of Korea CI
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• v.45 no.5
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• pp.1-7
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• 2008

The general bus architecture consists of masters, slaves, arbiter, decoder and so on in shared bus. Specially, as several masters do not concurrently receive the right of bus usage, the arbiter plays an important role in arbitrating between shared bus and masters. Fixed priority, round-robin, TDMA and Lottery methods are developed in general arbitration policies, which lead the efficiency of bus usage in shared bus. On the other hand, the bus architecture can be modified to maximize the system performance. In the paper, we propose the flying master bus architecture that supports the parallel bus communication and analyze its merits and demerits following various arbitration policies that are mentioned above, compared with normal shared bus. From the results of performance verification using TLM(Transaction Level Model), we find that more than 40% of the data communication performance improves, regardless of arbitration policies. As the flying master bus architecture advances its studies and applies various SoCs, it becomes the leading candidate of the high performance bus architecture.

• Journal of IKEEE
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• v.25 no.3
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• pp.467-472
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• 2021

Stable operation of semiconductor devices is needed even at high temperatures. Among the structures of semiconductor devices, the area that can cause unstable electrical responses at high temperatures is the contact layer between the metal and the semiconductor. In this study, the effect of annealing conditions included in the process of forming a contact layer of nickel silicide(NiSix) on a p-type SiC layer on the specific contact resistance of the contact layer and the total resistance between the metal and the semiconductor was investigated. To this end, a series of electrodes for TLM (transfer length method) measurements were patterned on the 4 inch p-type SiC layer under conditions of changing annealing temperature of 1700 and 1800 ℃ and annealing time of 30 and 60 minutes. As a result, it was confirmed that the annealing conditions affect the resistance of the contact layer and the electrical stability of the device.

• Structural Engineering and Mechanics
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• v.58 no.5
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• pp.887-903
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• 2016

This study analyses the seismic response of a three-dimensional (3-D) rigid massless square foundation resting or embedded in a viscoelastic soil limited by rigid bedrock. The foundation is subjected to harmonic oblique seismic waves P, SV, SH and R. The key step is the characterization of the soil-foundation interaction by computing the impedance matrix and the input motion matrix. A 3-D frequency boundary element method (BEM) in conjunction with the thin layer method (TLM) is adapted for the seismic analysis of the foundation. The dynamic response of the rigid foundation is solved from the wave equations by taking into account the soil-foundation interaction. The solution is formulated using the frequency BEM with the Green's function obtained from the TLM. This approach has been applied to analyze the effect of soilstructure interaction on the seismic response of the foundation as a function of the kind of incident waves, the angles of incident waves, the wave's frequencies and the embedding of foundation. The parametric results show that the non-vertical incident waves, the embedment of foundation, and the wave's frequencies have important impact on the dynamic response of rigid foundations.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.96-98
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• 1999

유기전계발광소자(OELD)의 성능 향상을 위한 많은 연구가 진행되고 있지만 아직까지 금속전극과 유기발 광층 사이의 접촉저항(Contact Resistance)에 관한 연구는 거의 보고되지 않고 있다. Ohmic 접합에서 접촉 저항은 효율적이고 신뢰성 있는 소자제작에 있어서 간과되어서는 안될 매우 중요한 부분이다. 본 연구에서는 금속전극과 유기발광충 사이의 접촉저항에 관해서 논의하고자 한다. 본 연구에서 제작된 샘플은 금속전극으로 Ag, 유기발광재료로서 Alq$_3$를 사용하였으며, Alq3의 두께를 100 $\AA$에서 500 $\AA$까지 각각 다르게 하여 서로 다른 두께의 유기발광층을 가지는 샘플을 제작하였다. 금속전극의 매트릭스 구조에 의해 형성된 적선의 크기는 3 mm x 2 mm이며, 제작된 샘플의 접촉비저항은 TLM(Transmission Line Measurement) 방법을 이용하여 구하였다. Planar한 TLM model로부터 새로운 vertical model을 유추하였으며, 이를 근거로 접촉저항 및 transfer length 등을 계산하였다. 상온에서 측정된 전체 저항값은 유기발광층의 두께가 증가함 에 따라 증가하는 경향을 나타냈으며, 이 때 계산된 접촉비저항은 1.49$\times$$10^1$ $\Omega$-$\textrm{cm}^2$ 이다. 접촉저항은 전극 사이의 거리의 증가에 따라 증가하지만, 측정시간의 thermal budget의 영향으로 상대적으로 전체저항이 감 소하였으나, 저항감소분의 포화에 따라서, 거리에 비례하여 다시 저항이 증가하였다.

• Proceedings of the Korean Institute of Communication Sciences Conference
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• 1995.10a
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• pp.818-821
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• 1995

• Proceedings of the Korean Institute of Communication Sciences Conference
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• 1998.10a
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• pp.872-875
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• 1998